1. Product Overview
This document details the specifications for an electronic component, specifically an LED, which is currently in the Revision 2 phase of its product lifecycle. The component was officially released on December 5, 2014, at 11:57:35. A key characteristic noted in the provided data is its Expired Period, which is designated as Forever. This indicates that from the manufacturer's perspective, this specific revision does not have a planned obsolescence date and remains valid for reference and use indefinitely, barring any superseding documentation. The repeated entries of this lifecycle information suggest a standardized header or metadata block used across multiple pages or sections of the original PDF, emphasizing the stability and finalized nature of this revision.
2. Technical Parameters Deep Objective Interpretation
While the core PDF snippet focuses on administrative metadata, a comprehensive technical document for an LED component would typically include detailed parameters. Based on standard industry practice for such components, the following sections would be critically analyzed.
2.1 Photometric and Color Characteristics
This section would objectively detail the light output properties. Key parameters include Luminous Flux, measured in lumens (lm), which quantifies the perceived power of light. Dominant Wavelength or Correlated Color Temperature (CCT) defines the color of the emitted light, ranging from warm white to cool white for white LEDs, or specific monochromatic colors like red, blue, or green. Color Rendering Index (CRI), particularly for white LEDs, indicates how accurately the light source reveals the colors of objects compared to a natural light source. The Viewing Angle specifies the angular range over which the luminous intensity is at least half of its maximum value, affecting the beam pattern.
2.2 Electrical Parameters
This part provides the essential electrical operating conditions. The Forward Voltage (Vf) is the voltage drop across the LED when it is emitting light at a specified current. It is a crucial parameter for driver design. The Forward Current (If) is the recommended operating current, typically given as a continuous DC value. Exceeding the Maximum Forward Current can lead to accelerated degradation or immediate failure. The Reverse Voltage (Vr) rating indicates the maximum voltage that can be applied in the reverse direction without damaging the LED. Power dissipation is calculated from Vf and If.
2.3 Thermal Characteristics
LED performance and lifespan are heavily dependent on temperature. The Thermal Resistance (Rthj-a), measured in degrees Celsius per watt (°C/W), quantifies the difficulty of heat transfer from the LED junction to the ambient environment. A lower value indicates better heat dissipation. The Maximum Junction Temperature (Tjmax) is the highest temperature the semiconductor junction can withstand without permanent damage. Operating below this temperature, ideally much lower, is essential for long-term reliability. Proper heatsinking is required to maintain the junction temperature within safe limits.
3. Binning System Explanation
Manufacturing variations cause slight differences between individual LEDs. A binning system groups components with similar characteristics.
3.1 Wavelength/Color Temperature Binning
LEDs are sorted into bins based on their dominant wavelength (for colored LEDs) or CCT and Duv (for white LEDs). This ensures color consistency within a single production batch or application.
3.2 Luminous Flux Binning
LEDs are categorized according to their light output at a standard test current. This allows designers to select components that meet specific brightness requirements.
3.3 Forward Voltage Binning
Components are grouped by their forward voltage drop. This is important for applications where multiple LEDs are connected in series, as mismatched Vf can lead to uneven current distribution and brightness.
4. Performance Curve Analysis
Graphical data provides deeper insight into component behavior under varying conditions.
4.1 Current vs. Voltage (I-V) Curve
This curve shows the relationship between forward current and forward voltage. It is non-linear, with a characteristic \"knee\" voltage below which very little current flows. The curve helps in selecting appropriate current-limiting circuitry.
4.2 Temperature Characteristics
Graphs typically show how forward voltage decreases and luminous flux degrades as junction temperature increases. Understanding these relationships is vital for thermal management design to maintain performance over the product's lifetime.
3.3 Spectral Power Distribution
For white LEDs, this graph shows the relative intensity of light across the visible spectrum. It reveals the peaks of the blue pump LED and the broad phosphor emission, helping to understand color quality and CRI.
5. Mechanical and Packaging Information
Precise physical specifications are necessary for PCB design and assembly.
5.1 Dimension Diagram
A detailed drawing with tolerances showing the component's length, width, height, and any critical features like lens shape or lead dimensions.
5.2 Pad Layout Design
The recommended copper pad pattern on the PCB for surface-mount devices (SMD), including pad size, shape, and spacing to ensure reliable soldering and mechanical strength.
5.3 Polarity Identification
Clear marking on the component body (e.g., a notch, dot, or cut corner) and in the diagram to indicate the anode and cathode. Correct polarity is essential for circuit operation.
6. Soldering and Assembly Guidelines
Proper handling ensures reliability.
6.1 Reflow Soldering Profile
A time-temperature graph specifying the preheat, soak, reflow, and cooling stages. Key parameters include peak temperature (typically 245-260°C for Pb-free solder) and time above liquidus (TAL). Adherence prevents thermal shock.
6.2 Precautions
Instructions may include: avoiding mechanical stress on the lens, using no-clean flux, preventing moisture absorption (MSL rating), and ensuring ESD protection during handling.
6.3 Storage Conditions
Recommended temperature and humidity ranges for storing unused components, often in moisture-barrier bags with desiccant if the Moisture Sensitivity Level (MSL) is above 1.
7. Packaging and Ordering Information
Details for procurement and logistics.
7.1 Packaging Specifications
Describes the tape and reel dimensions, pocket size, reel diameter, and orientation of components for automated pick-and-place machines.
7.2 Labeling Information
Explains the data printed on the reel label, including part number, quantity, lot number, date code, and binning codes.
7.3 Part Numbering Rule
Decodes the part number structure, showing how different fields represent attributes like color, flux bin, voltage bin, packaging type, and special features.
8. Application Suggestions
8.1 Typical Application Scenarios
This LED, based on its implied characteristics from being a standard component, is suitable for a wide range of applications including general indicator lights, backlighting for small displays, status lights on consumer electronics, automotive interior lighting, and decorative lighting. Its \"Forever\" expired period suggests it is intended for products with long lifecycles or where long-term spare part availability is a consideration.
8.2 Design Considerations
Always drive the LED with a constant current source, not a constant voltage, to ensure stable light output and prevent thermal runaway. Calculate the necessary current-limiting resistor or select an appropriate LED driver IC based on the forward voltage and desired current. Ensure adequate PCB copper area or a dedicated heatsink for thermal management, especially when operating at high currents or in high ambient temperatures. Consider optical design elements like diffusers or lenses to achieve the desired light distribution.
9. Technical Comparison
While a direct comparison requires a specific competitor part, this revision's key differentiator, as per the provided data, is its formalized Lifecycle Phase: Revision 2 with an Expired Period: Forever. This offers an advantage in design stability and long-term supply predictability compared to components that are marked as \"Preliminary\", \"Obsolete\", or have a defined end-of-life date. Designers can incorporate this component with confidence that its specifications are fixed and it will remain a valid choice for the foreseeable future, reducing requalification efforts for future production runs.
10. Frequently Asked Questions
Q: What does \"Lifecycle Phase: Revision 2\" mean?
A: It indicates this is the second officially released and fixed version of the component's specification. Earlier revisions (e.g., Revision 0 or 1) may have existed. Revision 2 is considered stable for production.
Q: Does \"Expired Period: Forever\" mean the component will never become obsolete?
A: It means the manufacturer has not set an expiration date for this specific document revision and does not plan to declare it obsolete imminently. However, actual component production may eventually cease based on market demand, but the specification remains valid for reference.
Q: The release date is 2014. Is this component outdated?
A: Not necessarily. A 2014 release date for a Revision 2 document suggests the underlying technology was mature at that time. Many fundamental LED packages have multi-decade lifespans in the market. The \"Forever\" expired period supports its continued relevance. Always check for the latest datasheet from the manufacturer for any potential updates.
11. Practical Use Case
Scenario: Long-Life Industrial Indicator Light
An equipment manufacturer designs a control panel for industrial machinery that must operate reliably for 15+ years. They select this LED based on its documented \"Revision 2\" status and \"Forever\" expired period, which signals design maturity and stable long-term specification availability. The design team uses the forward voltage and current parameters to size the current-limiting resistor on the PCB. They use the thermal resistance data to ensure the small PCB area dedicated to the indicator provides sufficient heat dissipation to keep the junction temperature low, thereby achieving the target lifespan. The clear polarity marking simplifies assembly. The stable specifications mean the same BOM can be used for the entire production run without fear of unannounced electrical changes.
12. Principle Introduction
An LED is a semiconductor diode. When a forward voltage is applied across its terminals (anode positive relative to cathode), electrons from the n-type semiconductor material recombine with holes from the p-type material within the active region. This recombination process releases energy in the form of photons (light). The specific wavelength (color) of the emitted light is determined by the energy bandgap of the semiconductor materials used (e.g., InGaN for blue/green, AlInGaP for red/amber). White LEDs are typically created by coating a blue LED chip with a phosphor material that absorbs some of the blue light and re-emits it as a broader spectrum of yellow light; the mixture of blue and yellow light is perceived as white.
13. Development Trends
The LED industry continues to evolve. Trends include increasing luminous efficacy (more lumens per watt), improving color rendering (higher CRI and R9 values for vivid reds), and achieving higher maximum current density for brighter light from smaller packages. There is a push towards miniaturization (e.g., micro-LEDs) and integration, such as LEDs with built-in drivers (IC-driven LEDs) or color-mixing capabilities. Smart lighting features, including tunable white (CCT adjustment) and full-color control, are becoming more common. Furthermore, emphasis on quality and reliability testing, along with standardized lifetime reporting methods like TM-21, provides designers with more accurate long-term performance data. The concept of a \"Forever\" expired period for a datasheet may become less common as digital documentation allows for more dynamic, living specifications, but the need for stable references for long-lifecycle products will remain.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |