LED Component Technical Datasheet - Lifecycle Revision 3 - Release Date 2015-10-16 - English Technical Document

1. Product Overview

This technical document pertains to a specific electronic component, likely an LED (Light Emitting Diode) or a related optoelectronic device. The core information provided indicates the component is in its third revision (Revision 3) of its lifecycle, with a release date of October 16, 2015. The "Expired Period: Forever" notation suggests this document version is the final and definitive specification for this particular revision, with no planned expiration or superseding by a newer document for this specific product iteration. This status is common for mature components that have reached a stable production state.

The component is designed for applications requiring reliable, long-term performance. Its finalized revision status implies it has undergone rigorous testing and validation, making it suitable for integration into products where design stability and consistent supply are critical factors.

2. Technical Parameters Deep Objective Interpretation

While the provided PDF snippet is limited, a comprehensive technical datasheet for such a component would typically include the following parameter categories, which are essential for design engineers.

2.1 Photometric and Color Characteristics

Key parameters include dominant wavelength or correlated color temperature (CCT), which defines the color of light emitted. For white LEDs, CCT is specified in Kelvin (K), such as 2700K (warm white), 4000K (neutral white), or 6500K (cool white). Luminous flux, measured in lumens (lm), indicates the total perceived light output. Chromaticity coordinates (e.g., on the CIE 1931 diagram) provide a precise definition of color point. Color Rendering Index (CRI), a value up to 100, measures the light source's ability to reveal the true colors of objects compared to a natural reference.

2.2 Electrical Parameters

The forward voltage (Vf) is the voltage drop across the LED when operating at its specified current. It is a critical parameter for driver design and varies with the LED material (e.g., InGaN for blue/green/white, AlInGaP for red/amber). The forward current (If) is the recommended operating current, typically in milliamperes (mA) or amperes (A) for power LEDs. Maximum ratings for reverse voltage and peak forward current define the absolute limits the device can withstand without damage. The electrostatic discharge (ESD) sensitivity rating (e.g., Class 1C, 1000V HBM) is crucial for handling and assembly procedures.

2.3 Thermal Characteristics

LED performance and longevity are heavily dependent on thermal management. The junction-to-ambient thermal resistance (RθJA) indicates how effectively heat is transferred from the semiconductor junction to the surrounding environment. A lower value signifies better heat dissipation. The maximum junction temperature (Tj max) is the highest temperature the semiconductor die can tolerate. Operating the LED below this temperature, typically by maintaining a lower case temperature (Tc), is vital for ensuring rated lifetime and preventing accelerated lumen depreciation or catastrophic failure.

3. Binning System Explanation

Manufacturing variations necessitate sorting components into performance bins to ensure consistency for end-users.

3.1 Wavelength/Color Temperature Binning

LEDs are sorted into tight wavelength or CCT bins (e.g., 3-step, 5-step MacAdam ellipses) to guarantee minimal color variation within a single application. This is paramount for lighting fixtures using multiple LEDs where color uniformity is required.

3.2 Luminous Flux Binning

Components are grouped based on their measured light output at a standard test current. This allows designers to select bins that meet specific brightness requirements for different product tiers or to compensate for optical system losses.

3.3 Forward Voltage Binning

Sorting by forward voltage helps in designing efficient driver circuits, especially when connecting multiple LEDs in series, as matched Vf bins ensure more uniform current distribution and simplified driver requirements.

4. Performance Curve Analysis

Graphical data provides deeper insight into device behavior under varying conditions.

4.1 Current vs. Voltage (I-V) Curve

This curve shows the nonlinear relationship between forward current and forward voltage. It is essential for determining the operating point and for designing constant-current drivers, which are standard for LEDs to ensure stable light output and color.

4.2 Temperature Characteristics

Curves typically illustrate how forward voltage decreases with increasing junction temperature and how luminous flux depreciates as temperature rises. Understanding this thermal derating is critical for designing adequate heat sinks and predicting performance in the application environment.

4.3 Spectral Power Distribution (SPD)

The SPD graph plots the relative intensity of light emitted at each wavelength. It provides detailed information about color quality, peak wavelength, and spectral width, which is important for applications with specific colorimetric needs.

5. Mechanical and Package Information

The physical package ensures electrical connection, mechanical stability, and thermal path.

5.1 Dimensional Outline Drawing

A detailed drawing with critical dimensions (length, width, height), tolerances, and datum references is provided for PCB footprint design and mechanical integration.

5.2 Pad Layout and Solder Pad Design

The recommended PCB land pattern (pad size, shape, and spacing) is specified to ensure reliable solder joint formation during reflow and to manage thermal stress.

5.3 Polarity Identification

Clear markings (such as a cathode indicator, a notch, or a beveled corner) are defined to prevent incorrect orientation during assembly, which would prevent the device from functioning.

6. Soldering and Assembly Guidelines

Proper assembly is critical for reliability.

6.1 Reflow Soldering Profile

A recommended temperature profile is provided, including preheat, soak, reflow peak temperature (typically not exceeding 260°C for a specified time, e.g., 10 seconds), and cooling rates. Adherence to this profile prevents thermal damage to the LED package and internal die.

6.2 Precautions and Handling

Guidelines include using ESD-safe practices, avoiding mechanical stress on the lens, preventing contamination of the optical surface, and not applying solder directly to the component body.

6.3 Storage Conditions

Recommended storage involves a controlled environment (typical temperature and humidity ranges are specified) in moisture-sensitive packaging (with a defined Moisture Sensitivity Level, MSL) to prevent oxidation of terminals and moisture-induced damage during reflow ("popcorning").

7. Packaging and Ordering Information

Information for procurement and logistics.

7.1 Packaging Specifications

Details include reel dimensions (for tape-and-reel packaging), pocket quantity, orientation in the tape, and reel material.

7.2 Labeling Information

Explains the data on packaging labels, which typically include part number, quantity, lot/batch code, date code, and binning information.

7.3 Part Numbering System

Decodes the part number structure, showing how different fields correspond to attributes like color, flux bin, voltage bin, packaging type, and special features.

8. Application Recommendations

8.1 Typical Application Scenarios

Based on its implied characteristics, this component could be suited for general lighting (bulbs, downlights), backlighting units (for displays), automotive interior lighting, signage, or indicator applications where a stable, long-life light source is needed.

8.2 Design Considerations

Key considerations include using a constant-current driver, implementing proper thermal management (heatsinking), ensuring electrical isolation if required, protecting against voltage transients, and considering optical design (lenses, diffusers) to achieve the desired beam pattern and efficiency.

9. Technical Comparison

While a direct comparison requires a specific alternative, this component's "Revision 3" and "Forever" expired period suggest it is a mature, optimized design. Its advantages likely include well-characterized performance, high reliability due to extensive field history, stable supply chain, and potentially lower cost compared to newer, cutting-edge components that may offer higher efficacy at the expense of design maturity.

10. Frequently Asked Questions (FAQs)

Q: What does "LifecyclePhase: Revision 3" mean?
A: It indicates this is the third major version of the product's technical specification. Changes from previous revisions could include improved performance parameters, updated test methods, or modified mechanical details. This is the finalized spec for this product generation.

Q: Why is the "Expired Period" listed as "Forever"?
A: This denotes that this document version does not have a planned obsolescence date. It will remain the valid specification for this product revision indefinitely, assuring designers of long-term documentation stability.

Q: How critical is thermal management for this component?
A: It is paramount for all LEDs. Exceeding the maximum junction temperature will significantly reduce luminous output (lumen depreciation), shift color, and drastically shorten operational lifetime. Proper heatsinking is non-negotiable for reliable performance.

Q: Can I drive this LED with a constant-voltage source?
A: It is strongly discouraged. LEDs exhibit an exponential I-V relationship; a small change in voltage causes a large change in current, leading to thermal runaway and failure. A constant-current driver is the standard and required method.

11. Practical Use Case

Scenario: Designing a linear LED light fixture. An engineer selects this component based on its color consistency (tight binning), efficacy, and proven reliability. They design a metal-core PCB (MCPCB) to act as both electrical interconnect and heatsink. The LEDs are arranged in series strings, with the total forward voltage of each string calculated using the binned Vf to select an appropriate constant-current driver. Thermal simulations are run to ensure the fixture housing dissipates enough heat to keep the LED junction temperature within limits under worst-case ambient conditions. The finalized design benefits from the component's stable specifications, ensuring consistent performance across production units.

12. Principle of Operation

An LED is a semiconductor diode. When a forward voltage is applied, electrons from the n-type semiconductor and holes from the p-type semiconductor are injected into the active region. When electrons and holes recombine, energy is released in the form of photons (light). The wavelength (color) of the emitted light is determined by the energy bandgap of the semiconductor materials used in the active region (e.g., InGaN for blue/green, AlInGaP for red/amber). White LEDs are typically created by coating a blue LED chip with a phosphor material that converts some of the blue light into longer wavelengths (yellow, red), resulting in white light.

13. Development Trends

The general trend in LED technology continues toward higher luminous efficacy (more lumens per watt), improved color rendering, and higher reliability at lower cost. Miniaturization and increased power density are also ongoing. In packaging, there is a move toward chip-scale packages (CSP) and novel designs for better light extraction and thermal management. For phosphor-converted white LEDs, developments focus on new phosphor materials for higher efficiency, better spectral quality, and improved stability. Furthermore, smart and connected lighting, integrating sensors and controls, is becoming increasingly important, though this trend impacts system design more than the fundamental LED component itself.