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LED Component Datasheet - Lifecycle Revision 1 - Release Date 2014-11-27 - English Technical Document

Technical datasheet detailing the lifecycle phase, revision history, and release information for an LED component. Includes specifications and application guidelines.
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PDF Document Cover - LED Component Datasheet - Lifecycle Revision 1 - Release Date 2014-11-27 - English Technical Document

1. Product Overview

This technical document provides comprehensive specifications and application guidelines for a light-emitting diode (LED) component. The core focus of this datasheet is the established lifecycle status of the product, indicating it is in a stable revision phase. The primary advantage of this component lies in its mature and reliable design, having undergone thorough validation and testing. It is targeted at applications requiring consistent performance, long-term availability, and proven reliability in various lighting and indication scenarios.

2. Lifecycle and Revision Information

The provided data indicates a consistent lifecycle status for this component. The Lifecycle Phase is documented as Revision, with a revision number of 1. This signifies that the product design is stable and has been formally released after initial development and any necessary corrections. The Expired Period is noted as Forever, which typically means the product has no planned end-of-life (EOL) date and is intended for continuous production, or that this specific revision's documentation remains valid indefinitely. The Release Date for this revision is 2014-11-27 19:34:44.0. This timestamp marks the official issuance of this revision of the technical data.

3. Technical Parameters Deep Objective Interpretation

While specific numerical values for photometric, electrical, and thermal parameters are not provided in the excerpt, a detailed analysis based on standard LED characteristics for a component with a stable revision lifecycle is presented.

3.1 Photometric Characteristics

Typical photometric parameters for such components include dominant wavelength or correlated color temperature (CCT), luminous flux (in lumens), and luminous intensity (in candelas). The performance is characterized by its spectral power distribution. For a mature product, these parameters exhibit minimal batch-to-batch variation due to refined manufacturing processes.

3.2 Electrical Parameters

Key electrical specifications encompass the forward voltage (Vf) at a given test current, the maximum continuous forward current (If), and the reverse voltage (Vr). The dynamic resistance is also a critical parameter for circuit design. A stable revision suggests well-defined and consistent electrical behavior across all production units.

3.3 Thermal Characteristics

Thermal management is crucial for LED performance and longevity. Important parameters include the thermal resistance from the junction to the solder point (Rthj-sp) and the maximum junction temperature (Tjmax). The datasheet would provide derating curves for forward current relative to ambient temperature.

4. Binning System Explanation

A mature LED product typically employs a comprehensive binning system to ensure color and performance consistency.

4.1 Wavelength/Color Temperature Binning

LEDs are sorted into bins based on their dominant wavelength (for monochromatic LEDs) or correlated color temperature and Duv (for white LEDs). This ensures that all LEDs from the same bin will appear visually identical in color.

4.2 Luminous Flux Binning

Components are also binned according to their luminous flux output at standard test conditions. This allows designers to select parts that meet specific brightness requirements with guaranteed minimums.

4.3 Forward Voltage Binning

Sorting by forward voltage (Vf) helps in designing efficient driver circuits and can be important for applications where multiple LEDs are connected in series, ensuring more uniform current distribution.

5. Performance Curve Analysis

Detailed performance curves are essential for understanding the component's behavior under various operating conditions.

5.1 Current-Voltage (I-V) Characteristic Curve

The I-V curve illustrates the relationship between the forward voltage and the forward current. It is non-linear, showing a turn-on voltage and a region of operation where small changes in voltage cause large changes in current, necessitating constant-current drive.

5.2 Temperature Dependency

Curves showing the variation of forward voltage and luminous flux with junction temperature are critical. Typically, forward voltage decreases with increasing temperature, while luminous flux also degrades as temperature rises.

5.3 Spectral Distribution

The spectral power distribution graph shows the relative intensity of light emitted at each wavelength. For white LEDs, this reveals the blue pump peak and the broader phosphor-converted spectrum.

6. Mechanical and Package Information

The physical dimensions and package design ensure proper fit and function on the printed circuit board (PCB).

6.1 Dimensional Outline Drawing

A detailed drawing with top, side, and bottom views provides all critical dimensions: length, width, height, and any tolerances. This is necessary for PCB footprint design and clearance checks.

6.2 Pad Layout Design

The recommended PCB land pattern (pad geometry and size) is specified to ensure reliable soldering, proper thermal dissipation, and mechanical stability.

3.3 Polarity Identification

Clear markings for anode and cathode are indicated, usually via a notch, a dot, a cut corner, or different lead lengths. Correct polarity is essential for device operation.

7. Soldering and Assembly Guidelines

Proper handling and assembly are vital for reliability.

7.1 Reflow Soldering Parameters

A recommended reflow profile is provided, including preheat, soak, reflow peak temperature, and cooling rates. The maximum body temperature during soldering is specified to prevent damage to the LED package and internal materials.

7.2 Precautions and Handling

Guidelines include protection from electrostatic discharge (ESD), avoidance of mechanical stress on the lens, and recommendations against cleaning with certain solvents that may damage the silicone or epoxy lens.

7.3 Storage Conditions

Ideal storage conditions (temperature and humidity ranges) are specified to prevent moisture absorption (which can cause \"popcorning\" during reflow) and other forms of degradation before use.

8. Packaging and Ordering Information

Information on how the product is supplied and how to order specific variants.

8.1 Packaging Specifications

The component is supplied in industry-standard packaging, such as tape-and-reel, suitable for automated pick-and-place machines. Reel dimensions, tape width, pocket spacing, and component orientation are detailed.

8.2 Labeling Information

The labeling on the reel or box includes the part number, quantity, lot number, date code, and binning information for traceability.

8.3 Part Numbering System

The model naming convention decodes key attributes like color, brightness bin, voltage bin, package type, and special features, allowing precise selection.

9. Application Recommendations

9.1 Typical Application Scenarios

This LED is suitable for a wide range of applications including backlighting for consumer electronics, architectural accent lighting, automotive interior lighting, status indicators in industrial equipment, and general illumination in compact fixtures.

9.2 Design Considerations

Critical design factors include using a constant-current LED driver, implementing adequate thermal management (PCB copper area, heatsinking), ensuring optical design (lenses, diffusers) matches the LED's viewing angle, and protecting against voltage transients and reverse polarity.

10. Technical Comparison

As a product in Revision 1 since 2014, its primary differentiation lies in its proven field reliability and stable supply chain. Compared to newer, cutting-edge LEDs, it may offer slightly lower efficacy (lumens per watt) or color rendering index (CRI). However, its advantages include predictable performance, extensive application history, robust qualification data, and lower risk of design changes or early obsolescence, making it ideal for products with long lifecycles or requiring minimal requalification efforts.

11. Frequently Asked Questions (FAQ)

Q: What does \"Lifecycle Phase: Revision\" mean?
A: It indicates the product design is stable and released for production. Revision 1 is the first official release after any initial design iterations.

Q: The Expired Period is \"Forever\". Does this mean the product will never be discontinued?
A: Not necessarily. It often means this specific revision of the documentation has no expiration, or the product has no pre-announced end-of-life date. Always check for official product change notices (PCNs) from the manufacturer for the latest status.

Q: The release date is 2014. Is this product outdated?
A: Not necessarily. Many electronic components remain in production for decades, especially if they serve established markets. A 2014 release date signifies maturity and extensive real-world validation.

Q: How do I select the correct bin for my application?
A: Choose the wavelength/CCT bin based on your color consistency requirements. Select the flux bin to meet your minimum brightness target. Consider voltage binning if designing long series strings for uniform current.

12. Practical Use Cases

Case Study 1: Industrial Control Panel Indicators: A manufacturer of industrial programmable logic controllers (PLCs) uses this LED for status indicators (Power, Run, Fault). The stable revision ensures that units produced years apart have visually identical indicator colors and brightness, maintaining a consistent product appearance. The proven reliability is critical for equipment expected to operate continuously for years.

Case Study 2: Retrofit Lighting Module: A company producing LED modules to retrofit fluorescent troffers selects this component. The mature supply chain and fixed specifications allow them to qualify the module once and source components for many years without redesign, reducing long-term support costs.

13. Principle of Operation

A light-emitting diode is a semiconductor p-n junction diode. When a forward voltage is applied, electrons from the n-type region and holes from the p-type region are injected into the junction region. When these charge carriers recombine, energy is released in the form of photons (light). The wavelength (color) of the emitted light is determined by the bandgap energy of the semiconductor material used (e.g., InGaN for blue/green, AlInGaP for red/amber). White LEDs are typically created by coating a blue LED chip with a phosphor material that absorbs some of the blue light and re-emits it as a broader spectrum of yellow light; the mixture of blue and yellow light appears white to the human eye.

14. Technology Trends

The general trend in LED technology continues toward higher luminous efficacy (more lumens per watt), improved color rendering (higher CRI and R9 values), and higher reliability at elevated operating temperatures. There is also a drive toward miniaturization (smaller packages) and increased power density. For mid-power LEDs like the one implied by this datasheet, trends include the adoption of new phosphor technologies for better color consistency and stability, and the development of packages with lower thermal resistance to enable higher drive currents. The move toward human-centric lighting, with tunable white spectra, is also influencing product development. However, mature products like this one continue to serve applications where the latest performance metrics are secondary to cost-effectiveness, supply stability, and design heritage.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.