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LED Component Datasheet - Revision 2 - Lifecycle Information - English Technical Document

Technical datasheet detailing the lifecycle phase, revision history, and release information for an LED component. Includes specifications and application guidelines.
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PDF Document Cover - LED Component Datasheet - Revision 2 - Lifecycle Information - English Technical Document

1. Product Overview

This technical datasheet provides comprehensive information for an LED component, focusing on its lifecycle management and revision history. The document is structured to offer engineers and procurement specialists clear insights into the product's status, ensuring compatibility and informed decision-making for integration into new designs or for maintaining existing production lines. The core information presented indicates a stable product in its "Revision 2" phase, signifying maturity and established performance characteristics.

The primary advantage of this component lies in its documented and controlled lifecycle. The "Forever" expired period suggests long-term availability and support, which is critical for products with extended lifecycles, such as those used in industrial, automotive, or infrastructure applications. This stability reduces the risk of obsolescence and simplifies supply chain planning. The target market includes applications requiring reliable, long-lasting illumination solutions where consistent performance and part availability are paramount.

2. In-Depth Technical Parameter Analysis

While the provided PDF snippet focuses on administrative data, a complete technical datasheet for an LED would typically include the following parameter categories, which are essential for design-in.

2.1 Photometric and Color Characteristics

Key parameters include dominant wavelength or correlated color temperature (CCT), which defines the color of the emitted light (e.g., cool white, warm white, specific monochromatic colors). Luminous flux, measured in lumens (lm), indicates the total perceived light output. Chromaticity coordinates (e.g., CIE x, y) provide a precise color point on the chromaticity diagram. Color Rendering Index (CRI) is crucial for applications where color accuracy is important, indicating how naturally colors appear under the LED's light compared to a reference source.

2.2 Electrical Parameters

The forward voltage (Vf) is a critical parameter, specifying the voltage drop across the LED at a specified test current. It is essential for designing the driving circuitry. The forward current (If) rating defines the maximum continuous current the LED can handle, directly influencing light output and lifetime. Reverse voltage (Vr) specifies the maximum voltage that can be applied in the reverse direction without damaging the device. Electrostatic Discharge (ESD) sensitivity, often classified per JEDEC or MIL-STD standards, indicates the component's robustness against static electricity.

2.3 Thermal Characteristics

LED performance and longevity are heavily dependent on thermal management. The junction-to-ambient thermal resistance (RθJA) quantifies how effectively heat is transferred from the LED's semiconductor junction to the surrounding environment. A lower value indicates better heat dissipation. The maximum junction temperature (Tj max) is the highest temperature the semiconductor material can withstand without permanent degradation or failure. Operating the LED below this temperature, typically through adequate heatsinking, is vital for achieving the rated lifetime (often defined as L70 or L50, the time until lumen output degrades to 70% or 50% of initial value).

3. Binning System Explanation

Manufacturing variations necessitate a binning system to group LEDs with similar characteristics.

3.1 Wavelength/Color Temperature Binning

LEDs are sorted into bins based on their precise wavelength (for monochromatic LEDs) or correlated color temperature (for white LEDs). This ensures color consistency within a single production batch and across different batches. Designers must specify the required bin or acceptable bin range to maintain uniform color appearance in their application.

3.2 Luminous Flux Binning

LEDs are also binned according to their light output at a standard test current. This allows designers to select components that meet specific brightness requirements and to predict the final luminous output of their assembly accurately.

3.3 Forward Voltage Binning

Grouping LEDs by forward voltage (Vf) helps in designing more efficient and consistent driver circuits. Using LEDs from the same Vf bin can lead to better current matching in parallel arrays and more predictable power consumption.

4. Performance Curve Analysis

Graphical data is essential for understanding device behavior under various conditions.

4.1 Current vs. Voltage (I-V) Curve

This curve shows the relationship between the forward current through the LED and the voltage across it. It is non-linear, exhibiting a turn-on voltage threshold. The curve is vital for selecting appropriate current-limiting components or designing constant-current drivers.

4.2 Temperature Characteristics

Graphs typically show how forward voltage and luminous flux change with junction temperature. Forward voltage generally decreases with increasing temperature, while luminous flux degrades. Understanding these relationships is key to thermal design and predicting performance in real-world operating environments.

4.3 Spectral Power Distribution

This graph plots the relative intensity of light emitted at each wavelength. For white LEDs, it shows the blue pump LED peak and the broader phosphor-converted spectrum. It is used to calculate CCT, CRI, and understand the color quality of the light.

5. Mechanical and Package Information

Precise physical dimensions are required for PCB layout and assembly.

5.1 Dimensional Outline Drawing

A detailed drawing with top, side, and bottom views, including all critical dimensions (length, width, height, lens shape) and tolerances. This ensures the component fits the designed footprint on the printed circuit board (PCB).

5.2 Pad Layout Design

The recommended PCB land pattern (pad size, shape, and spacing) is provided to ensure reliable solder joint formation during reflow soldering and to provide adequate thermal and electrical connection.

5.3 Polarity Identification

Clear markings indicate the anode and cathode. This is often shown by a notch, a dot, a beveled corner, or different lead lengths. Correct polarity is essential for the device to function.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

A recommended time-temperature profile for reflow soldering is provided, including preheat, soak, reflow, and cooling stages. Maximum peak temperature and time above liquidus are specified to prevent thermal damage to the LED package, particularly the silicone lens and internal bonds.

6.2 Precautions and Handling

Guidelines include avoiding mechanical stress on the lens, preventing contamination of the optical surface, and using proper ESD precautions during handling. Recommendations for cleaning agents compatible with the LED materials may also be included.

6.3 Storage Conditions

Ideal storage temperature and humidity ranges are specified to maintain solderability and prevent moisture absorption, which can cause "popcorning" during reflow if the component is not properly baked before use.

7. Packaging and Ordering Information

7.1 Packaging Specifications

Details on how the LEDs are supplied: reel type (e.g., tape width, pocket size), reel quantity, and orientation within the tape for automated pick-and-place machines.

7.2 Labeling Information

Explanation of the information printed on the reel label, including part number, quantity, date code, lot number, and bin codes for luminous flux, color, and voltage.

7.3 Model Number Nomenclature

A breakdown of the part number structure, showing how different codes within the number represent specific attributes like color, flux bin, voltage bin, package type, and special features.

8. Application Recommendations

8.1 Typical Application Scenarios

Based on its technical parameters, this LED would be suitable for general lighting (bulbs, tubes, panels), architectural lighting, signage, backlighting for displays, automotive lighting (interior, signaling), and industrial lighting. The "Forever" lifecycle suggests suitability for applications with long service life expectations.

8.2 Design Considerations

Key considerations include: implementing a constant-current driver for stable operation, designing an effective thermal path to manage junction temperature, ensuring optical design (lenses, reflectors) matches the LED's viewing angle and intensity distribution, and protecting the LED from electrical transients and reverse voltage.

9. Technical Comparison

While a direct comparison requires a specific competitor part, the advantages of a component with a clear "Revision 2" and "Forever" lifecycle status include reduced risk of premature obsolescence, proven reliability from a mature design, and potentially better availability and cost stability compared to newly introduced or end-of-life parts. The technical parameters (when fully specified) would be compared against alternatives on efficiency (lm/W), color quality (CRI, CCT consistency), reliability (lifetime ratings), and package size.

10. Frequently Asked Questions (FAQ)

Q: What does "LifecyclePhase: Revision 2" mean?
A: It indicates the product is in a mature stage of its lifecycle. The design has been finalized and is in volume production. "Revision 2" suggests there have been at least one previous version, with this version incorporating improvements or fixes.

Q: What is the implication of "Expired Period: Forever"?
A: This typically means the manufacturer does not currently have a planned end-of-life (EOL) date for this product. It is intended for long-term availability, which is beneficial for designs requiring a stable supply chain over many years.

Q: How should I interpret the release date?
A: The release date (2014-12-05) marks when this specific revision of the datasheet or product was officially issued. It helps track the document version and can be used to ensure the latest specifications are being used for design.

Q: Can I mix LEDs from different bins in my product?
A: Mixing bins, especially for color and flux, is generally not recommended as it will lead to visible color and brightness variations in the final product. For consistent performance, use LEDs from the same or closely adjacent bins.

11. Practical Use Case

Scenario: Designing a Linear LED Fixture for Office Lighting
A design engineer is creating a 4-foot LED troffer for office ceilings. Using this datasheet, they would:
1. Select the appropriate flux bin to achieve the target lumens per fixture.
2. Choose a specific CCT bin (e.g., 4000K) to meet office lighting standards.
3. Use the Vf bin and I-V curve to design a series-parallel array and specify a constant-current driver.
4. Reference the thermal resistance (RθJA) and derating curves to design an aluminum heatsink that keeps the junction temperature below Tj max, ensuring the 50,000-hour L70 lifetime claim is met.
5. Use the mechanical drawing to create the PCB footprint and ensure proper spacing between LEDs on the metal-core PCB (MCPCB).
6. Follow the reflow profile during SMT assembly to avoid damaging the components.

12. Operating Principle Introduction

Light Emitting Diodes (LEDs) are semiconductor devices that emit light through electroluminescence. When a forward voltage is applied across the p-n junction, electrons from the n-type region recombine with holes from the p-type region, releasing energy in the form of photons. The wavelength (color) of the emitted light is determined by the energy bandgap of the semiconductor material used (e.g., InGaN for blue/green, AlInGaP for red/amber). White LEDs are typically created by coating a blue or ultraviolet LED chip with a phosphor material. Part of the blue light is converted by the phosphor to longer wavelengths (yellow, red), and the mixture of blue and phosphor-converted light is perceived as white.

13. Technology Trends

The LED industry continues to evolve with several key trends. Efficiency (lumens per watt) is steadily increasing, reducing energy consumption for the same light output. Color quality is improving, with high-CRI LEDs becoming more common and affordable. Miniaturization persists, enabling new form factors in displays and lighting. There is a growing focus on horticultural lighting, tailoring spectra to plant growth. Smart lighting integration, with built-in drivers and controls, is expanding. Furthermore, reliability and lifetime predictions are becoming more accurate through advanced testing and modeling, supporting the long-life claims indicated by documents like this one.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.