LED Component Datasheet - Lifecycle Phase: Revision 1 - Release Date: 2012-06-18 - English Technical Document

1. Product Overview

This technical datasheet pertains to a specific revision of an LED component. The primary information provided indicates the component is in its first revision (Revision 1) and was officially released on June 18, 2012. The lifecycle phase being 'Revision' suggests this document supersedes a previous version, incorporating updates, corrections, or improvements based on ongoing development, testing, or feedback. The 'Expired Period: Forever' notation implies this revision has no predetermined expiration for its validity under standard conditions, meaning the specifications are considered stable and definitive for this version of the product. This document serves as the authoritative source for all technical parameters, performance data, and handling instructions for this specific revision.

1.1 Core Advantages

The core advantage of this component lies in its documented and stable revision state. Being a 'Revision 1' product indicates that initial design phases are complete, and the component has undergone a cycle of review and refinement. This offers engineers and designers a reliable set of specifications with reduced risk of unspecified changes compared to pre-release or preliminary versions. The fixed release date allows for precise version control in Bill of Materials (BOM) and supply chain management.

1.2 Target Market

This component is targeted at the general electronics manufacturing industry, particularly segments requiring stable, documented components for medium to long product life cycles. Applications could include consumer electronics, industrial controls, automotive interior lighting, and general illumination where consistent performance based on a fixed datasheet is critical for design reproducibility and quality assurance.

2. In-Depth Technical Parameter Analysis

While the provided snippet is limited, a comprehensive datasheet for an LED component would typically include the following sections with detailed parameters. The values below are illustrative examples based on common industry standards for a component of this era.

2.1 Photometric and Color Characteristics

The photometric characteristics define the light output and quality. Key parameters include Luminous Flux, which might range from 20 to 120 lumens depending on the LED chip technology and power rating. The Dominant Wavelength or Correlated Color Temperature (CCT) specifies the color of light emitted; for white LEDs, common CCTs are 2700K (warm white), 4000K (neutral white), and 6500K (cool white). Color Rendering Index (CRI) is a measure of how naturally colors appear under the light, with values above 80 being typical for general lighting. Viewing angle, often between 120 and 140 degrees, describes the beam spread.

2.2 Electrical Parameters

Electrical parameters are crucial for circuit design. The Forward Voltage (Vf) is the voltage drop across the LED when operating at its rated current. For a typical power LED, this could be in the range of 2.8V to 3.6V. The Forward Current (If) is the recommended operating current, such as 150mA, 350mA, or 700mA. Maximum ratings for reverse voltage (e.g., 5V) and peak forward current must be strictly observed to prevent damage. The datasheet would also specify the dynamic resistance.

2.3 Thermal Characteristics

LED performance and lifespan are heavily dependent on thermal management. The Junction-to-Ambient Thermal Resistance (RθJA) indicates how easily heat can escape from the LED chip to the environment; a lower value (e.g., 10-20 °C/W) is better. The Maximum Junction Temperature (Tj max), often 125°C or 150°C, is the absolute limit. Operating the LED below this temperature, ideally below 85°C at the junction, is essential for maintaining luminous output and achieving the rated lifetime (often defined as the time until lumen output degrades to 70% of initial value, L70).

3. Binning System Explanation

LED manufacturing yields variations. Binning groups LEDs with similar characteristics to ensure consistency.

3.1 Wavelength/Color Temperature Binning

LEDs are sorted into bins based on their dominant wavelength (for colored LEDs) or Correlated Color Temperature (for white LEDs). A typical binning scheme for white LEDs might have steps of 50K or 100K within a nominal CCT range (e.g., 5000K-5300K). This ensures color uniformity within a lighting fixture.

3.2 Luminous Flux Binning

LEDs are also binned according to their light output at a specific test current. A flux bin code (e.g., P2, Q3) corresponds to a predefined range of lumens. This allows designers to select LEDs that meet minimum brightness requirements for their application.

3.3 Forward Voltage Binning

Forward voltage (Vf) bins group LEDs with similar voltage drops. This is important for designing efficient driver circuits and ensuring uniform current distribution when multiple LEDs are connected in parallel.

4. Performance Curve Analysis

Graphical data provides deeper insight than tabular specifications alone.

4.1 Current vs. Voltage (I-V) Curve

The I-V curve shows the relationship between forward current and forward voltage. It is non-linear, exhibiting a 'knee' voltage below which very little current flows. The curve helps in selecting the appropriate driving method (constant current vs. constant voltage) and understanding the impact of small voltage changes on current.

4.2 Temperature Characteristics

Graphs typically show how forward voltage decreases with increasing junction temperature (a negative coefficient) and how luminous flux depreciates with rising temperature. These curves are critical for thermal design; poor heat sinking will lead to reduced light output and accelerated aging.

4.3 Spectral Power Distribution

This graph plots the relative intensity of light emitted at each wavelength. For white LEDs (typically blue chip + phosphor), it shows the blue peak from the chip and the broader yellow/red emission from the phosphor. The shape of the curve determines the CCT and CRI.

5. Mechanical and Package Information

The physical package ensures reliable electrical connection and thermal dissipation.

5.1 Dimensional Outline Drawing

A detailed drawing with all critical dimensions: overall length, width, and height (e.g., 5.0mm x 5.0mm x 1.6mm), lens shape and size, and location of mounting features. Tolerances are specified for each dimension.

5.2 Pad Layout and Solder Pad Design

The recommended footprint for the PCB is provided, including pad size, shape, and spacing. This is essential for creating the correct land pattern in PCB design software to ensure proper soldering and mechanical stability.

5.3 Polarity Identification

The method for identifying the anode (+) and cathode (-) terminals is clearly indicated, usually via a marking on the package (a dot, notch, or cut corner), longer lead (for through-hole), or labeled in the footprint diagram.

6. Soldering and Assembly Guidelines

Proper handling is required to maintain reliability.

6.1 Reflow Soldering Profile

A detailed temperature vs. time profile is provided, specifying preheat, soak, reflow (peak temperature), and cooling stages. Maximum temperature limits (e.g., 260°C for 10 seconds) are given to prevent damage to the LED package or lens.

6.2 Precautions and Handling

Instructions include warnings against applying mechanical stress to the lens, using ESD protection during handling, avoiding contamination of the lens surface, and not cleaning with certain solvents. Recommendations for storage conditions (temperature and humidity) are also stated.

7. Packaging and Ordering Information

Information for procurement and logistics.

7.1 Packaging Specifications

Describes the packaging format: tape and reel specifications (carrier tape width, pocket spacing, reel diameter), quantity per reel (e.g., 1000 or 4000 pieces), or tray packaging details.

7.2 Model Numbering Rule

Explains the part number structure. A typical model number encodes key attributes like color (e.g., W for white), flux bin, color temperature bin, voltage bin, and package type. This allows precise ordering of the desired performance combination.

8. Application Recommendations

8.1 Typical Application Circuits

Schematics for basic driving circuits are often included, such as a simple series resistor circuit for low-current LEDs or a constant current driver circuit using a dedicated IC or transistor for power LEDs. Design equations may be provided.

8.2 Design Considerations

Key considerations include: using a constant current driver for stable brightness and longevity; implementing adequate PCB copper area or a metal-core board for heat sinking; ensuring optical design (lenses, reflectors) is compatible with the LED's viewing angle; and protecting against electrostatic discharge (ESD) and voltage transients.

9. Technical Comparison

While a direct comparison is not possible without a specific competitor, the advantages of this revision (Rev 1) would typically include finalized and verified specifications, potentially improved performance metrics (e.g., higher efficacy or better color consistency) over a prototype, and the assurance of a stable supply of identical parts for the duration of a product's manufacturing cycle.

10. Frequently Asked Questions (FAQ)

Q: What does 'LifecyclePhase: Revision' mean?
A: It indicates this is a revised and finalized version of the product datasheet, containing the official specifications for manufacturing and design.

Q: Can I use the maximum forward current continuously?
A: The maximum current is an absolute rating. For reliable long-term operation, it is recommended to drive the LED at or below the typical forward current specified in the electrical parameters table, with proper thermal management.

Q: How critical is thermal management?
A: Extremely critical. Exceeding the maximum junction temperature will drastically reduce lumen output and lifespan. Always follow the thermal resistance guidelines and design an appropriate heat sink.

11. Practical Use Case

Scenario: Designing a LED Panel Light. An engineer uses this datasheet to select LEDs binned for 4000K CCT and a specific flux bin to meet the target lumens per fixture. The I-V curve and thermal resistance data are used to design a constant-current driver and an aluminum heatsink. The mechanical drawing ensures the PCB layout has the correct pad spacing, and the reflow profile is programmed into the production line's soldering oven. The 'Revision 1' status gives confidence that the component specifications will not change unexpectedly during the multi-year production of the light panel.

12. Operating Principle

Light Emitting Diodes (LEDs) are semiconductor devices that emit light through electroluminescence. When a forward voltage is applied across the p-n junction, electrons recombine with holes, releasing energy in the form of photons. The wavelength (color) of the light is determined by the energy bandgap of the semiconductor material. White LEDs are typically created by using a blue LED chip coated with a yellow phosphor; some of the blue light is converted to yellow, and the mixture of blue and yellow light is perceived as white. Different phosphor blends produce different correlated color temperatures (CCT).

13. Technology Trends

Since the 2012 release date of this revision, LED technology has continued to evolve. Trends have included significant increases in luminous efficacy (lumens per watt), enabling brighter and more energy-efficient lighting. Color quality has improved, with high-CRI (90+) LEDs becoming more common and affordable. Miniaturization has progressed, with smaller packages delivering higher light output. Smart and connected lighting, featuring integrated control circuitry, has emerged as a major application area. Furthermore, there is a growing focus on quality, reliability, and standardized testing methods to ensure long-term performance as LEDs are used in more demanding applications.