LED Component Datasheet - Revision 2 - Lifecycle Information - English Technical Document

1. Product Overview

This technical datasheet provides comprehensive information for an LED component, focusing on its lifecycle management and revision history. The document is essential for engineers, procurement specialists, and quality assurance teams to ensure the correct version of the component is used in production and design. The core information centers on the formal release and perpetual validity of Revision 2 of the product specification.

The primary purpose of this document is to serve as a definitive reference for the component's technical data, ensuring consistency and reliability in its application across various electronic designs. It establishes the official parameters and characteristics that define the component's performance and compatibility.

2. Lifecycle and Revision Information

The datasheet explicitly defines the current state of the product's documentation and its validity period.

2.1 Lifecycle Phase

The component is documented in its Revision phase. This indicates that the product and its specifications have undergone updates or corrections from a previous version. The revision number is clearly stated as 2, providing a traceable history for the documentation.

2.2 Document Validity

The Expired Period for this revision is specified as Forever. This denotes that unless superseded by a newer revision (e.g., Revision 3), this document remains the active and valid specification for the component indefinitely. There is no scheduled obsolescence for this revision of the datasheet.

2.3 Release Date

The official Release Date for Revision 2 is 2014-12-10 09:55:35.0. This timestamp is crucial for version control, allowing users to confirm they are referencing the correct and most recent published version of the specifications at any given point in time.

3. Technical Parameters Deep Objective Interpretation

While the provided text snippet is limited, a standard LED datasheet based on this lifecycle header would contain detailed technical parameters. The following sections elaborate on the typical content found in such documents.

3.1 Photometric Characteristics

This section details the light-related properties of the LED. Key parameters typically include luminous flux (measured in lumens), which indicates the total perceived power of light emitted. The dominant wavelength or correlated color temperature (CCT) defines the color of the light, whether it is warm white, cool white, or a specific color like red or blue. Chromaticity coordinates (e.g., CIE x, y) provide a precise, numerical description of the color point on the color space diagram. Viewing angle specifies the angular range over which the luminous intensity is at least half of its maximum value, affecting the beam pattern.

3.2 Electrical Parameters

Electrical specifications are critical for circuit design. The forward voltage (Vf) is the voltage drop across the LED when operating at its rated current. It is typically specified at a specific test current (e.g., 20mA, 350mA). The forward current (If) is the recommended operating current for achieving the specified photometric output. Reverse voltage (Vr) indicates the maximum voltage the LED can withstand in the non-conducting direction without damage. Power dissipation is calculated from Vf and If, determining thermal management requirements.

3.3 Thermal Characteristics

LED performance and longevity are heavily influenced by temperature. The junction temperature (Tj) is the temperature at the semiconductor chip itself, which should be kept below a specified maximum (e.g., 125°C) to ensure reliability. Thermal resistance (Rth j-a) quantifies how effectively heat travels from the junction to the ambient environment; a lower value indicates better heat dissipation. These parameters guide the design of heat sinks and PCB layouts to manage thermal load effectively.

4. Binning System Explanation

Manufacturing variations lead to slight differences between individual LEDs. Binning groups components with similar characteristics to ensure consistency in application.

4.1 Wavelength / Color Temperature Binning

LEDs are sorted into bins based on their precise wavelength (for monochromatic LEDs) or correlated color temperature (for white LEDs). This ensures a uniform color appearance when multiple LEDs are used in a single fixture, such as in panel lights or displays. Bins are defined by ranges on the CIE chromaticity diagram.

4.2 Luminous Flux Binning

Components are also binned according to their light output. A flux bin code (e.g., L1, L2, L3) indicates the minimum and maximum luminous flux a group of LEDs will deliver when driven under standard test conditions. This allows designers to select the appropriate brightness level for their application and predict final product performance.

4.3 Forward Voltage Binning

To aid in power supply design and current matching in series/parallel arrays, LEDs are binned by their forward voltage (Vf). Using LEDs from the same Vf bin helps achieve uniform current distribution, preventing some LEDs from being overdriven while others are underdriven, which improves efficiency and longevity.

5. Performance Curve Analysis

Graphical data provides deeper insight into the component's behavior under varying conditions.

5.1 Current vs. Voltage (I-V) Curve

This fundamental curve shows the relationship between the forward current through the LED and the voltage across it. It is non-linear, exhibiting a turn-on voltage threshold. The curve is essential for designing the driving circuit, whether it's a simple current-limiting resistor or a constant-current driver, to ensure stable operation.

5.2 Temperature Characteristics

Graphs typically show how luminous flux and forward voltage change with increasing junction temperature. Luminous output generally decreases as temperature rises (thermal quenching), while forward voltage typically decreases slightly. Understanding these curves is vital for designing systems that maintain consistent performance across their operating temperature range.

5.3 Spectral Power Distribution

For white LEDs, this graph plots the relative intensity of light across the visible spectrum. It reveals the peaks of the blue pump LED and the broad phosphor emission. The shape of the spectrum determines the Color Rendering Index (CRI), which measures how accurately the light source reveals the colors of objects compared to a natural reference.

6. Mechanical and Packaging Information

Physical specifications ensure proper integration into the final product.

6.1 Dimensional Outline Drawing

A detailed diagram provides exact measurements for the LED package, including length, width, height, and any lens curvature. Critical dimensions such as the distance from the LED chip to the top of the lens may also be specified, as this affects the optical design.

6.2 Pad Layout Design

The PCB footprint (land pattern) is specified, showing the recommended size, shape, and spacing of the solder pads. Adhering to this design is crucial for achieving a reliable solder joint, proper alignment, and effective heat transfer from the LED to the circuit board.

6.3 Polarity Identification

The method for identifying the anode (+) and cathode (-) terminals is clearly indicated. This is often done via a marking on the package (such as a notch, dot, or cut corner), different lead lengths, or an asymmetric pad design. Correct polarity is essential for the LED to function.

7. Soldering and Assembly Guidelines

Proper handling and processing are key to reliability.

7.1 Reflow Soldering Parameters

A recommended reflow profile is provided, including preheat, soak, reflow (peak temperature), and cooling rates. The maximum allowable temperature and duration at peak temperature are specified to prevent damage to the LED's internal materials, such as the plastic lens or wire bonds.

7.2 Precautions and Handling

Guidelines include warnings against applying mechanical stress to the lens, using appropriate ESD (Electrostatic Discharge) protection during handling, and avoiding contamination of the optical surface. Cleaning methods compatible with the package material may also be suggested.

7.3 Storage Conditions

Recommended long-term storage conditions are specified to preserve solderability and prevent moisture absorption, which can cause "popcorning" during reflow. This often involves storing components in a dry environment (low humidity) at a moderate temperature.

8. Packaging and Ordering Information

Information for logistics and procurement.

8.1 Packaging Specifications

Details on how the LEDs are supplied, such as embossed tape and reel dimensions (e.g., EIA-481 standard), quantity per reel, and reel diameter. This information is necessary for setting up automated pick-and-place assembly machines.

8.2 Labeling and Part Numbering

The structure of the product's part number is explained. It typically encodes key attributes like color, flux bin, voltage bin, and package type. Understanding this nomenclature is essential for accurately specifying and ordering the desired component variant.

9. Application Recommendations

9.1 Typical Application Scenarios

Based on its technical parameters (to be inferred from a full datasheet), this LED would be suitable for applications such as general lighting (bulbs, tubes), backlighting for LCDs, automotive lighting (interior, signaling), and decorative lighting. The specific flux, color, and viewing angle would determine the best fit.

9.2 Design Considerations

Key design advice includes: using a constant-current driver for stable light output; implementing proper thermal management on the PCB (thermal vias, copper area); considering optical elements (lenses, diffusers) based on the desired beam pattern; and ensuring electrical protection against voltage transients or reverse polarity.

10. Technical Comparison and Differentiation

While a direct comparison requires a specific competitor's datasheet, the advantages of this component (implied by its specifications) might include high luminous efficacy (lumens per watt), excellent color consistency due to tight binning, robust thermal performance allowing for higher drive currents, or a compact package size enabling dense PCB layouts.

11. Frequently Asked Questions (FAQs)

Q: What does "Lifecycle Phase: Revision" mean for my design?
A: It means you are using an updated version of the product specifications. Always ensure your Bill of Materials (BOM) references Revision 2 to guarantee the components you receive match the documented performance.

Q: The Expired Period is "Forever." Does this mean the product will never be obsolete?
A> No, it refers specifically to this revision of the *datasheet*. The product itself may eventually be discontinued, but this document will remain the valid reference for Revision 2 components as long as they are in use or available.

Q: How do I ensure I get LEDs from the same performance bin for my project?
A: Specify the full part number, which includes bin codes for flux, color, and voltage, when ordering. Work with your distributor to secure sufficient quantity from a single manufacturing lot or bin.

12. Practical Use Case Examples

Case Study 1: Linear LED Fixture. A designer uses the I-V curve and thermal resistance data to model the performance of 50 LEDs in series. They calculate the total forward voltage and required driver voltage, and design an aluminum PCB with sufficient thermal mass to keep the junction temperature below 105°C, ensuring long-term lumen maintenance.

Case Study 2: Consumer Bulb. A manufacturer selects a specific flux and color temperature bin to meet Energy Star requirements and achieve a consistent warm white appearance. They use the reflow profile from the datasheet to set their SMT assembly line, preventing yield loss due to thermal damage during soldering.

13. Operating Principle Introduction

An LED is a semiconductor diode. When a forward voltage is applied, electrons from the n-type semiconductor recombine with holes from the p-type semiconductor in the active region, releasing energy in the form of photons (light). The wavelength (color) of the emitted light is determined by the energy bandgap of the semiconductor materials used (e.g., InGaN for blue/green, AlInGaP for red/amber). White LEDs are typically created by coating a blue LED chip with a phosphor material that absorbs some blue light and re-emits it as a broader spectrum of yellow light; the mixture of blue and yellow light is perceived as white.

14. Technology Trends

The LED industry continues to evolve. Key trends include: increasing luminous efficacy, pushing beyond 200 lumens per watt in commercial products; improvements in color quality, with high-CRI (CRI>90) and full-spectrum LEDs becoming more common; the development of Mini-LED and Micro-LED technologies for next-generation displays; enhanced reliability and lifetime, especially for demanding applications like automotive headlights; and the integration of smart features, such as built-in drivers and color-tuning capabilities. These advancements are driven by material science, packaging innovations, and more sophisticated manufacturing processes.