LED Component Datasheet - Lifecycle Revision 3 - Technical Documentation

1. Product Overview

This technical document provides comprehensive specifications and guidelines for a light-emitting diode (LED) component. The primary focus is on the component's lifecycle management, specifically detailing its current revision status and release information. The document serves as a critical reference for engineers, designers, and procurement specialists involved in the integration of this component into electronic systems. It outlines the fundamental characteristics and parameters necessary for proper selection, circuit design, and reliable operation.

The core advantage of this component lies in its documented and controlled lifecycle, ensuring consistency and traceability across production batches. This is particularly vital for applications requiring long-term reliability and minimal performance variance. The target market includes a wide range of industries such as general lighting, automotive interior lighting, consumer electronics backlighting, and industrial indicator applications where stable performance and documented quality are paramount.

2. Technical Parameters Deep Objective Interpretation

While the provided PDF excerpt focuses on administrative data, a complete datasheet for an LED component would contain detailed technical parameters. The following sections represent the typical, essential data required for engineering design.

2.1 Photometric and Color Characteristics

The photometric characteristics define the light output of the LED. Key parameters include luminous flux, measured in lumens (lm), which quantifies the perceived power of light. The correlated color temperature (CCT), measured in Kelvin (K), indicates whether the light appears warm (lower K, e.g., 2700K-3000K) or cool (higher K, e.g., 5000K-6500K). Chromaticity coordinates (e.g., CIE x, y) precisely define the color point on the color space diagram. The viewing angle, specified in degrees, describes the angular distribution of the emitted light intensity (e.g., 120°).

2.2 Electrical Parameters

Electrical parameters are critical for circuit design. The forward voltage (Vf) is the voltage drop across the LED when operating at a specified forward current (If). This parameter has a typical value and a range (e.g., Vf = 3.2V ± 0.2V @ If=20mA). The absolute maximum ratings define the limits beyond which permanent damage may occur, including maximum forward current, reverse voltage, and power dissipation. The thermal resistance (Rth) from the junction to the solder point or ambient is crucial for thermal management calculations.

2.3 Thermal Characteristics

LED performance and lifespan are heavily dependent on junction temperature (Tj). Key thermal parameters include the thermal resistance junction-to-ambient (Rth J-A) and junction-to-solder point (Rth J-Sp). The maximum allowable junction temperature (Tj max) is a critical design constraint. The derating curve shows how the maximum permissible forward current decreases as the ambient temperature increases to keep Tj within safe limits.

3. Binning System Explanation

LED manufacturing yields natural variations. A binning system categorizes components into groups based on key parameters to ensure consistency within a batch.

3.1 Wavelength/Color Temperature Binning

LEDs are sorted into bins based on their dominant wavelength (for monochromatic LEDs) or correlated color temperature (for white LEDs). Each bin represents a small range on the chromaticity diagram (e.g., MacAdam ellipses). This ensures color uniformity in applications using multiple LEDs.

3.2 Luminous Flux Binning

Components are binned according to their luminous flux output at a standard test current. Bins are typically labeled with codes (e.g., FL1, FL2, FL3) representing minimum and maximum flux values. This allows designers to select the appropriate brightness grade for their application.

3.3 Forward Voltage Binning

LEDs are also grouped by their forward voltage (Vf) at a specified test current. This is important for designing efficient driver circuits, especially when connecting multiple LEDs in series, to ensure even current distribution and optimal power usage.

4. Performance Curve Analysis

4.1 Current vs. Voltage (I-V) Curve

The I-V curve illustrates the relationship between the forward current through the LED and the voltage across its terminals. It shows the turn-on voltage and the exponential increase in current beyond this point. This curve is fundamental for selecting current-limiting components like resistors or designing constant-current drivers.

4.2 Temperature Characteristics

Several graphs depict performance changes with temperature. The forward voltage typically decreases as junction temperature increases. Luminous flux output generally decreases with rising temperature; this relationship is shown in a relative luminous flux vs. junction temperature graph. Understanding these curves is essential for thermal design to maintain stable light output.

4.3 Spectral Power Distribution

For white LEDs, the spectral power distribution (SPD) graph shows the intensity of light emitted at each wavelength. It reveals the peaks of the blue LED chip and the phosphor conversion, providing insight into color rendering properties (CRI) and the specific spectral makeup of the white light.

5. Mechanical and Package Information

5.1 Outline Dimensions Drawing

A detailed mechanical drawing provides the exact package dimensions, including length, width, height, and any curvature. Critical tolerances are specified. This drawing is necessary for PCB footprint design and ensuring proper fit within the assembly.

5.2 Pad Layout Design

The recommended PCB land pattern (footprint) is provided, showing the size, shape, and spacing of the copper pads. This ensures reliable solder joint formation during reflow soldering. The design often includes thermal pad recommendations for heat dissipation.

5.3 Polarity Identification

The method for identifying the anode (+) and cathode (-) terminals is clearly indicated. This is typically done via a marking on the package (e.g., a notch, a dot, a green mark, or a cut corner) or by having one lead shorter than the other. Correct polarity is essential for device operation.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

A detailed reflow profile is specified, including preheat, soak, reflow, and cooling zones. Key parameters are peak temperature (typically not exceeding 260°C for a specified time, e.g., 10 seconds), time above liquidus (TAL), and ramp rates. Adhering to this profile prevents thermal damage to the LED package and solder joints.

6.2 Precautions and Handling

Guidelines include protection from electrostatic discharge (ESD), avoidance of mechanical stress on the lens, and preventing contamination of the optical surface. Recommendations for storage conditions (temperature and humidity) are provided to preserve solderability and performance.

7. Packaging and Ordering Information

7.1 Packaging Specifications

The component is supplied in industry-standard packaging, such as tape and reel. Specifications include reel diameter, tape width, pocket pitch, and orientation. The quantity per reel is specified (e.g., 2000 pieces per 7-inch reel).

7.2 Label Information and Model Numbering Rule

The labeling on the reel or box includes the part number, quantity, date code, and lot number. The model numbering rule decodes the part number to indicate key attributes like color, flux bin, voltage bin, and package type, enabling precise ordering.

8. Application Recommendations

8.1 Typical Application Circuits

Schematics for basic driving circuits are shown, such as a simple series resistor circuit for low-current applications or a constant-current driver circuit for higher performance and stability. Design equations for calculating the current-limiting resistor are provided.

8.2 Design Considerations

Key considerations include thermal management (using adequate PCB copper area or heatsinks), optical design (lens selection for desired beam pattern), and electrical design (ensuring the driver can handle the LED's forward voltage and current requirements, including tolerances).

9. Technical Comparison

While specific competitor data is not included, this component's differentiation may be highlighted in areas such as higher luminous efficacy (lumens per watt), tighter color consistency due to advanced binning, superior thermal performance leading to longer lifetime (L70, L90 ratings), or a more robust package design resistant to moisture and thermal cycling. These factors contribute to overall system reliability and performance.

10. Frequently Asked Questions (FAQs)

Q: What does "LifecyclePhase: Revision 3" mean?
A: It indicates the document and the component specification it describes are in their third revision. This implies updates, corrections, or improvements have been made since the initial release.

Q: What is the significance of "Expired Period: Forever"?
A: This likely means the document has no set expiration date and is considered valid until superseded by a newer revision. The technical data remains the reference for this specific revision of the component.

Q: How do I select the correct current-limiting resistor?
A: Use Ohm's Law: R = (Vsupply - Vf) / If. Where Vsupply is your circuit voltage, Vf is the LED's forward voltage (use max value from datasheet for a safe design), and If is the desired forward current. Ensure the resistor's power rating is sufficient: P = (Vsupply - Vf) * If.

Q: Can I drive this LED with a voltage source directly?
A: No. LEDs are current-driven devices. A voltage source without current regulation will cause the current to rise uncontrollably once the forward voltage is exceeded, likely destroying the LED. Always use a current-limiting mechanism (resistor or constant-current driver).

11. Practical Use Cases

Case 1: Backlighting for a Consumer Device Display: Multiple LEDs of the same flux and color bin are arranged in an array behind a light guide plate. Constant-current drivers are used to ensure uniform brightness. Thermal vias in the PCB help dissipate heat to maintain stable color and output over the device's operating temperature range.

Case 2: Architectural Cove Lighting: LEDs are placed on a long, linear PCB strip. The high color rendering index (CRI) variant is selected for accurate color reproduction. The design uses a dimmable constant-current driver, and the low thermal resistance of the package allows for higher drive currents to achieve the required lumen output without excessive temperature rise.

12. Principle Introduction

An LED is a semiconductor p-n junction diode. When a forward voltage is applied, electrons from the n-type material recombine with holes from the p-type material in the depletion region. This recombination releases energy in the form of photons (light). The wavelength (color) of the emitted light is determined by the energy bandgap of the semiconductor material used (e.g., InGaN for blue, AlInGaP for red). White LEDs are typically created by coating a blue LED chip with a yellow phosphor; the mixture of blue and yellow light is perceived as white. The efficiency of this electroluminescent process is characterized by the external quantum efficiency (EQE).

13. Development Trends

The LED industry continues to evolve with several clear trends. Efficiency (lumens per watt) is steadily increasing, reducing energy consumption for the same light output. Color quality is improving, with higher CRI values and more precise color tuning becoming standard. Miniaturization persists, enabling new form factors in displays and lighting. There is a strong focus on reliability and lifetime prediction under various stress conditions. Furthermore, integration is a key trend, with LEDs incorporating drivers, sensors, and communication interfaces (like Li-Fi) into "smart" lighting systems. The development of novel materials, such as perovskites for next-generation LEDs, is also an active area of research.