Table of Contents
- 1. Product Overview
- 1.1 Core Advantages
- 1.2 Target Market
- 2. Technical Parameter Deep-Dive Analysis
- 2.1 Photometric and Color Characteristics
- 2.2 Electrical Parameters
- 2.3 Thermal Characteristics
- 3. Binning System Explanation
- 3.1 Wavelength / Color Temperature Binning
- 3.2 Luminous Flux Binning
- 3.3 Forward Voltage Binning
- 4. Performance Curve Analysis
- 4.1 Current vs. Voltage (I-V) Curve
- 4.2 Temperature Dependency
- 4.3 Spectral Power Distribution
- 5. Mechanical and Package Information
- 5.1 Dimensional Outline Drawing
- 5.2 Pad Layout Design
- 5.3 Polarity Identification
- 6. Soldering and Assembly Guidelines
- 6.1 Reflow Soldering Profile
- 6.2 Precautions and Handling
- 6.3 Storage Conditions
- 7. Packaging and Ordering Information
- 7.1 Packaging Specifications
- 7.2 Labeling Information
- 7.3 Part Numbering System
- 8. Application Recommendations
- 8.1 Typical Application Circuits
- 8.2 Design Considerations
- 9. Technical Comparison While specific competitor names are omitted, this section would objectively compare this LED's key parameters—such as efficacy (lumens per watt), CRI, thermal resistance, and package size—against typical industry offerings or previous generations. The stable "Revision 3" status itself is a comparative advantage, indicating a refined and reliable product. 10. Frequently Asked Questions (FAQ)
- 11. Practical Use Case
- 12. Principle of Operation
- 13. Technology Trends
1. Product Overview
This technical datasheet provides comprehensive information for a specific LED (Light Emitting Diode) component. The document is currently in its third revision, indicating a mature and stable product specification. The lifecycle phase is designated as "Revision," which typically signifies that the product is in active production with established parameters, and any changes are managed through formal revision control. The release date for this revision is documented as December 5, 2014, and the expired period is marked as "Forever," suggesting this version of the datasheet remains valid indefinitely unless superseded by a newer revision. This component is designed for reliability and long-term use in various electronic applications.
1.1 Core Advantages
The primary advantages of this component, as inferred from its stable revision status, include proven reliability, consistent performance parameters, and established manufacturing processes. A product in the "Revision" phase with a "Forever" validity period indicates a high level of design maturity, reducing the risk of unforeseen performance variations. This makes it an excellent choice for applications requiring long-term supply chain stability and predictable behavior.
1.2 Target Market
This LED component is suitable for a wide range of applications across consumer electronics, industrial controls, automotive interior lighting, signage, and general illumination. Its mature lifecycle status makes it particularly attractive for products with long development cycles or those requiring components with a guaranteed long-term availability.
2. Technical Parameter Deep-Dive Analysis
While the provided excerpt focuses on document metadata, a complete datasheet for an LED component would contain detailed technical parameters. The following sections outline the typical parameters that would be analyzed in depth.
2.1 Photometric and Color Characteristics
A detailed analysis of the LED's light output is crucial. This includes the Luminous Flux, measured in lumens (lm), which indicates the total perceived power of light emitted. The Luminous Intensity, measured in millicandelas (mcd) at a specified viewing angle, defines the brightness in a particular direction. The Dominant Wavelength or Correlated Color Temperature (CCT) for white LEDs specifies the color of the emitted light. The Color Rendering Index (CRI), particularly for white LEDs, indicates how accurately the light source reveals the true colors of objects compared to a natural light source. A high CRI (e.g., >80) is essential for applications like retail lighting or art galleries.
2.2 Electrical Parameters
The electrical characteristics define the operating conditions. The Forward Voltage (Vf) is the voltage drop across the LED when it is emitting light at a specified forward current. This parameter is temperature-dependent. The Forward Current (If) is the recommended operating current, typically given as a continuous DC value. Exceeding the maximum rated forward current can drastically reduce the LED's lifespan. The Reverse Voltage (Vr) is the maximum voltage the LED can withstand when biased in the non-conducting direction; exceeding this can cause immediate and irreversible damage.
2.3 Thermal Characteristics
LED performance and longevity are heavily influenced by temperature. The Junction Temperature (Tj) is the temperature at the semiconductor chip itself. Maintaining Tj below its maximum rating is critical for reliability. The Thermal Resistance (Rthj-a), measured in degrees Celsius per watt (°C/W), indicates how effectively heat is transferred from the LED junction to the ambient environment. A lower thermal resistance means better heat dissipation, which is vital for maintaining light output and lifespan, especially in high-power applications.
3. Binning System Explanation
LED manufacturing naturally produces slight variations. Binning is the process of sorting LEDs into groups (bins) based on key parameters to ensure consistency within a production lot.
3.1 Wavelength / Color Temperature Binning
LEDs are binned according to their dominant wavelength (for colored LEDs) or correlated color temperature (for white LEDs). This ensures that LEDs used in the same assembly, such as a light panel or display, have nearly identical color output, preventing visible color shifts or uneven lighting.
3.2 Luminous Flux Binning
LEDs are sorted based on their light output (lumens) at a standard test current. This allows designers to select bins that meet specific brightness requirements for their application, ensuring consistent luminance across multiple units or batches.
3.3 Forward Voltage Binning
Sorting by forward voltage (Vf) helps in designing efficient driver circuits. Using LEDs from the same or similar Vf bins ensures more uniform current distribution when multiple LEDs are connected in series, improving overall system efficiency and reliability.
4. Performance Curve Analysis
Graphical data provides deeper insight into LED behavior under varying conditions.
4.1 Current vs. Voltage (I-V) Curve
The I-V curve shows the relationship between the forward current and the forward voltage. It is non-linear, exhibiting a characteristic "knee" voltage below which very little current flows. This curve is essential for designing the current-limiting circuitry (e.g., a resistor or constant-current driver) to ensure stable operation.
4.2 Temperature Dependency
Graphs showing luminous flux or forward voltage as a function of junction temperature are critical. Luminous flux typically decreases as temperature increases. Forward voltage also decreases with rising temperature for most LEDs. Understanding these relationships is key for thermal management design.
4.3 Spectral Power Distribution
For white LEDs, this graph shows the intensity of light emitted at each wavelength. It reveals the peaks of the blue pump LED and the broader phosphor emission, helping to understand the color quality and CRI of the light source.
5. Mechanical and Package Information
The physical dimensions and construction of the LED package are vital for PCB (Printed Circuit Board) design and assembly.
5.1 Dimensional Outline Drawing
A detailed mechanical drawing provides exact dimensions including length, width, height, and any critical tolerances. This drawing ensures the component will fit correctly into the designated space on the PCB and within the final product enclosure.
5.2 Pad Layout Design
The recommended PCB land pattern (footprint) is provided, showing the size, shape, and spacing of the copper pads to which the LED will be soldered. Following this design is crucial for achieving a reliable solder joint and proper alignment.
5.3 Polarity Identification
Clear markings indicate the anode (+) and cathode (-) terminals. This is often shown via a diagram with a notch, a dot, a longer lead, or a differently shaped pad. Correct polarity is essential for the LED to function.
6. Soldering and Assembly Guidelines
Proper handling and assembly are critical to prevent damage.
6.1 Reflow Soldering Profile
A recommended temperature profile for reflow soldering is provided, including preheat, soak, reflow (peak temperature), and cooling rates and durations. Adhering to this profile prevents thermal shock, which can crack the LED package or damage the internal die.
6.2 Precautions and Handling
Guidelines include warnings against applying mechanical stress, the importance of using ESD (Electrostatic Discharge) protection during handling, and avoiding contamination of the LED lens. Cleaning methods compatible with the package material are also specified.
6.3 Storage Conditions
Recommended storage temperature and humidity ranges are given to prevent degradation of the LED's materials (like the epoxy lens or internal bonds) before use. Moisture sensitivity level (MSL) information may also be included, dictating bake-out requirements if the packaging has been exposed to humidity.
7. Packaging and Ordering Information
This section details how the product is supplied and how to specify it when ordering.
7.1 Packaging Specifications
Describes the packaging format, such as tape-and-reel, tube, or tray. It includes details like reel dimensions, pocket spacing, and orientation of components on the tape, which are necessary for automated assembly equipment setup.
7.2 Labeling Information
Explains the information printed on the packaging labels, which typically includes the part number, quantity, lot/batch code, date code, and binning information.
7.3 Part Numbering System
Decodes the part number structure, showing how different digits or letters within the full part number correspond to specific attributes like color, flux bin, voltage bin, packaging type, and special features.
8. Application Recommendations
8.1 Typical Application Circuits
Provides schematic examples for driving the LED, such as using a simple series resistor for low-current applications or a constant-current driver for higher performance and stability. It may also show configurations for series/parallel arrays.
8.2 Design Considerations
Key design advice includes calculating the appropriate current-limiting resistor, ensuring adequate heat sinking (especially for high-power LEDs), considering optical design for desired beam pattern, and protecting against voltage transients or reverse polarity connection.
9. Technical Comparison
While specific competitor names are omitted, this section would objectively compare this LED's key parameters—such as efficacy (lumens per watt), CRI, thermal resistance, and package size—against typical industry offerings or previous generations. The stable "Revision 3" status itself is a comparative advantage, indicating a refined and reliable product.
10. Frequently Asked Questions (FAQ)
Based on common technical queries regarding LED datasheets.
Q: What does "LifecyclePhase: Revision" mean?
A: It indicates the product is in a mature stage of its life. The design is stable and in active production. Changes are managed through formal revision updates to the documentation, ensuring traceability.
Q: Why is the "Expired Period: Forever"?
A: This means this specific revision of the datasheet does not have a predetermined expiration date. The information contained within it remains the official specification for that product revision unless explicitly replaced by a newer document version.
Q: How do I interpret the lack of specific technical numbers in the provided excerpt?
A: The provided text is metadata from the document header. A full datasheet would have separate, detailed sections for optical, electrical, and mechanical specifications. Always refer to the complete document for design-critical parameters.
11. Practical Use Case
Scenario: Designing a Backlight Unit for an Industrial Display
A designer needs uniform, reliable backlighting for a 7-inch display used in a factory environment. They select this LED based on its mature revision status, ensuring long-term availability for future repairs. They use the luminous flux binning information to source LEDs from a single, tight bin to guarantee even brightness across the panel. The thermal resistance data is used to design an aluminum heat spreader to keep the junction temperature low, maintaining consistent light output and maximizing lifespan in a potentially warm environment. The mechanical drawing ensures the LEDs fit precisely into the light guide plate assembly.
12. Principle of Operation
An LED is a semiconductor diode. When a forward voltage is applied across its terminals (anode positive relative to cathode), electrons from the n-type semiconductor material recombine with holes from the p-type material at the junction between them. This recombination releases energy in the form of photons (light). The specific wavelength (color) of the emitted light is determined by the energy bandgap of the semiconductor materials used (e.g., Gallium Nitride for blue, Gallium Arsenide Phosphide for red). White LEDs are typically created by coating a blue LED chip with a yellow phosphor; some of the blue light is converted to yellow, and the mixture of blue and yellow light is perceived as white.
13. Technology Trends
The LED industry continues to evolve. Key trends include increasing luminous efficacy (more lumens per watt), leading to greater energy efficiency. There is a strong focus on improving color quality, with high-CRI LEDs becoming more standard. Miniaturization persists, enabling higher pixel density in direct-view displays. The development of UV-C LEDs for disinfection and Micro-LEDs for next-generation displays represents significant technological frontiers. Furthermore, integration of control electronics directly with the LED package ("smart LEDs") is simplifying system design for color-tunable and connected lighting applications.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |