LED Component Datasheet - Revision 1 - Lifecycle Information - English Technical Document

1. Product Overview

This technical datasheet provides comprehensive information for an LED component currently in the revision phase of its lifecycle. The document serves as the definitive source for engineers, designers, and procurement specialists involved in integrating this component into electronic systems. The core advantage of this component lies in its documented and stable revision history, ensuring consistency and reliability for long-term production cycles. The target market includes manufacturers of consumer electronics, industrial control systems, automotive lighting, and general illumination products where component traceability and lifecycle management are critical.

2. Lifecycle and Revision Information

The primary data presented in the provided content pertains to the component's lifecycle management.

2.1 Lifecycle Phase

The component is explicitly documented as being in the "Revision" phase. This indicates that the product design and specifications have been finalized, released, and are now subject to controlled updates or corrections. A revision phase suggests a mature product that is actively being manufactured and supplied, with any changes being managed through formal revision control processes.

2.2 Revision Number

The current revision of this datasheet and the associated component is Revision 1. This is the first formally released version of the documentation following initial design and qualification. Engineers must always verify they are using the latest revision to ensure design accuracy.

2.3 Release and Validity Information

The datasheet was released on 2012-05-14 at 11:50:18. The "Expired Period" is noted as "Forever". This terminology typically means the datasheet does not have a pre-defined expiration date and remains valid as long as the product is in production. However, "Forever" in this context should be interpreted as "indefinite until superseded by a new revision." It is the user's responsibility to check for newer revisions from the component source periodically.

3. Technical Parameters: In-Depth Objective Interpretation

While the specific numerical parameters for photometric, electrical, and thermal characteristics are not detailed in the provided snippet, a standard LED datasheet structure is implied. The following sections explain the typical parameters that would be found and their significance.

3.1 Photometric Characteristics

Photometric characteristics define the light output of the LED. Key parameters include:

• Luminous Flux (Φ_v): Measured in lumens (lm), this indicates the total perceived power of light emitted. The value is typically specified at a standard test current (e.g., 20mA, 150mA) and junction temperature (e.g., 25°C).
• Luminous Intensity (I_v): Measured in candelas (cd), this describes the luminous flux per solid angle in a specific direction. It is crucial for directional lighting applications.
• Dominant Wavelength (λ_d) or Correlated Color Temperature (CCT): For colored LEDs, the dominant wavelength defines the perceived color (e.g., 625nm for red). For white LEDs, the CCT, measured in Kelvin (K), defines whether the light is warm white (2700K-3500K), neutral white (3500K-5000K), or cool white (5000K-6500K).
• Color Rendering Index (CRI): For white LEDs, CRI (Ra) indicates how accurately the light source reveals the true colors of objects compared to a natural light source. A higher CRI (closer to 100) is better for applications requiring accurate color perception.

3.2 Electrical Parameters

Electrical parameters are critical for circuit design and driver selection.

• Forward Voltage (V_F): The voltage drop across the LED when operating at a specified forward current. It varies with current and temperature. Typical values range from 2.0V to 3.8V for common LEDs.
• Forward Current (I_F): The recommended continuous DC operating current. Exceeding the maximum rated forward current can cause permanent damage.
• Reverse Voltage (V_R): The maximum voltage that can be applied in the reverse direction without damaging the LED. LEDs have very low reverse voltage ratings (often 5V).
• Power Dissipation (P_d): The maximum power the LED package can dissipate, calculated as V_F * I_F, and limited by thermal constraints.

3.3 Thermal Characteristics

LED performance and lifetime are heavily dependent on thermal management.

• Junction Temperature (T_j): The temperature at the semiconductor chip's p-n junction. The maximum allowable T_j (e.g., 125°C) must not be exceeded.
• Thermal Resistance (R_θJA or R_θJC): R_θJA is the junction-to-ambient thermal resistance (°C/W), indicating how easily heat flows from the junction to the surrounding air. R_θJC is junction-to-case. Lower values mean better heat dissipation.
• Storage Temperature Range: The temperature range within which the LED can be stored without degradation when not powered.

4. Binning System Explanation

LED manufacturing yields variations. Binning groups LEDs with similar characteristics to ensure consistency in mass production.

4.1 Wavelength/Color Temperature Binning

LEDs are sorted into bins based on their dominant wavelength (color LEDs) or CCT and chromaticity coordinates (white LEDs) to ensure a uniform color appearance in an array or fixture.

4.2 Luminous Flux Binning

LEDs are binned according to their light output (lumens) at a standard test condition. This allows designers to select bins that meet specific brightness requirements.

4.3 Forward Voltage Binning

Sorting by forward voltage (V_F) helps in designing efficient driver circuits, especially when connecting multiple LEDs in series, to ensure even current distribution.

5. Performance Curve Analysis

Graphical data is essential for understanding performance under non-standard conditions.

5.1 Current vs. Voltage (I-V) Curve

This curve shows the relationship between forward current and forward voltage. It is non-linear, exhibiting a turn-on voltage (or knee voltage) after which current increases rapidly with small increases in voltage. This curve is vital for selecting current-limiting circuitry.

5.2 Temperature Characteristics

Key graphs include Luminous Flux vs. Junction Temperature and Forward Voltage vs. Junction Temperature. Light output typically decreases as temperature increases (thermal quenching), while forward voltage decreases. Understanding these trends is crucial for thermal design.

5.3 Spectral Power Distribution (SPD)

The SPD graph shows the relative intensity of light emitted at each wavelength. For white LEDs, it reveals the blend of blue pump LED emission and phosphor-converted light, impacting CCT and CRI.

6. Mechanical and Package Information

Physical dimensions and assembly details are provided through technical drawings.

6.1 Outline Dimension Drawing

A detailed diagram showing the LED package's exact length, width, height, and any critical features. Tolerances are always specified.

6.2 Pad Layout Design

The recommended footprint for the PCB lands (pads), including pad size, shape, and spacing. Adhering to this layout ensures proper soldering and thermal connection.

6.3 Polarity Identification

Clear marking of the anode (+) and cathode (-) terminals, often via a notch, cut corner, marked pad, or different lead lengths. Correct polarity is essential for operation.

7. Soldering and Assembly Guidelines

7.1 Reflow Soldering Profile

A recommended time-temperature profile for reflow soldering, including preheat, soak, reflow (peak temperature), and cooling rates. Maximum temperature and time above liquidus must not be exceeded to avoid damaging the LED package or internal bonds.

7.2 Precautions

• Avoid mechanical stress on the LED lens.
• Use ESD precautions during handling.
• Do not clean with ultrasonic cleaners after soldering, as cavitation can damage the package.
• Avoid touching the lens with fingers to prevent contamination.

7.3 Storage Conditions

LEDs should be stored in a dry, dark environment within the specified temperature and humidity range (e.g., <40°C, <60% RH). Moisture-sensitive devices may require baking before use if the packaging seal is broken.

8. Packaging and Ordering Information

8.1 Packaging Specifications

Details on how LEDs are supplied: reel type (e.g., embossed carrier tape), reel dimensions, pocket quantity, and orientation.

8.2 Labeling Information

Explanation of the information printed on the reel label: part number, quantity, lot/batch code, date code, and bin codes.

8.3 Part Numbering System

A breakdown of the component's model number, showing how different fields correspond to attributes like color, flux bin, voltage bin, package type, and special features.

9. Application Recommendations

9.1 Typical Application Scenarios

Based on the implied standard LED technology, potential applications include backlighting for displays (LCDs, keyboards), status indicators, automotive interior lighting, decorative lighting, and general signage.

9.2 Design Considerations

• Current Drive: Always drive LEDs with a constant current source, not a constant voltage, for stable light output and longevity.
• Thermal Management: Design the PCB with adequate thermal vias and copper area. Consider the maximum ambient temperature of the end application.
• Optics: Select appropriate secondary optics (lenses, diffusers) based on the desired beam angle and distribution.
• ESD Protection: Incorporate ESD protection diodes on sensitive lines if the LED is in an exposed location.

10. Technical Comparison

While a direct comparison with other components is not possible without specific models, the key differentiators for any LED in this category typically involve:

• Efficacy (lm/W): Higher efficacy means more light output per electrical watt, leading to energy savings.
• Color Consistency: Tighter binning tolerances for wavelength/CCT and flux ensure better color matching in arrays.
• Reliability/Lifetime (L70/B50): The number of hours before light output degrades to 70% of its initial value for 50% of the population under test conditions.
• Package Robustness: Resistance to thermal cycling, moisture, and mechanical stress.

11. Frequently Asked Questions (Based on Technical Parameters)

Q1: What does "Revision 1" and "LifecyclePhase: Revision" mean for my design?
A1: It means you are using a mature, released product specification. Any future changes will be documented in a subsequent revision (e.g., Rev 1.1, Rev 2). You should always check for the latest revision before finalizing a design to incorporate any errata or improvements.

Q2: The "Expired Period" is "Forever." Does this mean the product will always be available?
A2: No. "Forever" refers to the validity of this specific revision's documentation. Product availability is determined by the manufacturer's production lifecycle. The component may eventually be discontinued (EOL). The datasheet remains a valid historical reference.

Q3: How do I interpret the lack of specific photometric/electrical numbers in the provided content?
A3: The provided snippet is a header/footer containing meta-information. The full, complete datasheet from the manufacturer would contain all the detailed technical parameter tables and graphs described in sections 3, 4, and 5 of this document. Always obtain the full datasheet for design work.

12. Practical Use Case

Scenario: Designing a status indicator panel for industrial equipment.
The designer refers to the full datasheet (implied by this revision header). They select the appropriate LED color (e.g., green for "on," red for "fault") based on the wavelength binning. Using the forward voltage (V_F) and test current (I_F) from the electrical table, they calculate the series resistor value needed when using a 5V supply: R = (V_supply - V_F) / I_F. They design the PCB footprint exactly as shown in the mechanical drawing, ensuring correct polarity alignment. They follow the reflow profile during assembly and verify the final product's light output meets the required visibility under the equipment's ambient lighting conditions.

13. Principle Introduction

An LED (Light Emitting Diode) is a semiconductor device that emits light when an electric current passes through it. This phenomenon, called electroluminescence, occurs when electrons recombine with electron holes within the device, releasing energy in the form of photons. The color of the light is determined by the energy band gap of the semiconductor material used. White LEDs are typically created by using a blue or ultraviolet LED chip coated with a phosphor material, which absorbs some of the blue/UV light and re-emits it as yellow light; the combination of blue and yellow light is perceived as white.

14. Development Trends

The LED industry continues to evolve with several clear trends. Efficiency (lumens per watt) is constantly improving, reducing energy consumption for lighting applications. There is a strong push towards higher color rendering indices (CRI) and more consistent color quality, especially in professional lighting. Miniaturization remains key, enabling new applications in compact devices. Integration is another trend, with LEDs increasingly incorporating drivers, control circuitry, and optics into single packaged modules. Finally, smart and connected lighting, where LEDs are part of IoT systems with tunable color and intensity, is a significant growth area. The component described in this datasheet, with its formal revision control, represents a stable point in this ongoing technological progression.