LED Component Datasheet - Revision 3 - Lifecycle Information - Release Date 2014-09-23 - English Technical Document

1. Product Overview

This technical datasheet provides critical lifecycle and revision control information for a specific electronic component, likely an LED or similar optoelectronic device. The primary purpose of this document is to establish traceability and version control, ensuring that users and manufacturers are referencing the correct and current specifications. The core information revolves around the formalized release of Revision 3 of the component's technical data, indicating updates to parameters, specifications, or testing procedures from previous versions. This revision is designated for indefinite use, as indicated by its "Forever" expired period, signifying its status as the active and authoritative specification until a subsequent revision is formally issued.

Understanding the lifecycle phase is crucial for supply chain management, design-in processes, and long-term product support. A component in the "Revision" phase is actively produced and supported, with its documentation being the current reference for all electrical, optical, and mechanical characteristics. Engineers and procurement specialists rely on this data to ensure design consistency and component availability throughout a product's manufacturing lifecycle.

2. Technical Parameters Deep Objective Interpretation

While the provided text snippet focuses on administrative data, a complete datasheet for an electronic component would contain extensive technical parameters. These are typically divided into several key categories that define the component's performance envelope and application limits.

2.1 Photometric and Color Characteristics

For light-emitting components, photometric parameters are paramount. This includes the dominant wavelength or correlated color temperature (CCT), which defines the color of the emitted light. Luminous flux, measured in lumens (lm), quantifies the perceived power of light. Other critical parameters are luminous efficacy (lm/W), which measures efficiency, and chromaticity coordinates (e.g., CIE x, y), which precisely define the color point on a standard diagram. The viewing angle, specified as the angle at which luminous intensity drops to half its maximum value, determines the spatial distribution of light.

2.2 Electrical Parameters

The electrical characteristics define the operating conditions for the component. The forward voltage (Vf) is the voltage drop across the device at a specified test current (If). This parameter is crucial for driver design and thermal management. The reverse voltage (Vr) specifies the maximum voltage that can be applied in the non-conducting direction without causing damage. Dynamic resistance and capacitance are also important for high-frequency switching applications.

2.3 Thermal Characteristics

Thermal management is critical for performance and longevity. The junction-to-ambient thermal resistance (RθJA) indicates how effectively heat is dissipated from the semiconductor junction to the surrounding environment. A lower value signifies better heat dissipation. The maximum junction temperature (Tj max) is the absolute highest temperature the semiconductor material can withstand without permanent degradation or failure. Operating the component near or above this limit drastically reduces its lifespan.

3. Binning System Explanation

Manufacturing variations necessitate a binning system to categorize components based on key parameters, ensuring consistency within a batch.

3.1 Wavelength/Color Temperature Binning

Components are sorted into bins based on their measured dominant wavelength or CCT. For example, white LEDs might be binned into groups like 2700K, 3000K, 4000K, 5000K, and 6500K, each with a tolerance range (e.g., +/- 200K). This allows designers to select components that meet specific color consistency requirements for their application.

3.2 Luminous Flux Binning

Components are also binned according to their light output at a standard test current. Bins are defined by a minimum luminous flux value. This enables predictable brightness levels in the final product and helps in selecting components for different brightness tiers or for balancing light output in multi-device arrays.

3.3 Forward Voltage Binning

Forward voltage is binned to ensure uniform electrical behavior. Components with similar Vf can be driven by the same constant-current source without significant variation in power consumption or thermal load, simplifying circuit design and improving system reliability.

4. Performance Curve Analysis

Graphical data provides deeper insight into component behavior under varying conditions.

4.1 Current-Voltage (I-V) Characteristic Curve

The I-V curve shows the relationship between forward current and forward voltage. It is non-linear, exhibiting a turn-on voltage threshold. This curve is essential for designing the driving circuitry, whether it's a simple resistor, a linear regulator, or a switching constant-current driver. It also helps in understanding power dissipation (Vf * If).

4.2 Temperature Dependency Characteristics

Graphs typically show how key parameters like forward voltage and luminous flux change with junction temperature. Vf generally decreases with increasing temperature, while luminous flux typically degrades. Understanding these relationships is vital for designing effective heat sinks and predicting performance in real-world operating environments.

3.3 Spectral Power Distribution (SPD)

The SPD graph plots the relative intensity of light emitted at each wavelength. For white LEDs (often blue chips with phosphor), it shows the blue pump peak and the broader phosphor emission spectrum. This graph is used to calculate color rendering index (CRI), color quality scale (CQS), and other color fidelity metrics important for lighting quality.

5. Mechanical and Packaging Information

Precise physical specifications ensure proper fit and function on the printed circuit board (PCB).

5.1 Dimensional Outline Drawing

A detailed mechanical drawing provides all critical dimensions: length, width, height, lead spacing, and component tolerances. This drawing is used for PCB footprint design and checking clearances within the assembly.

5.2 Pad Layout Design

The recommended PCB land pattern (pad size, shape, and spacing) is provided to ensure reliable solder joint formation during reflow soldering. Adhering to this design minimizes soldering defects like tombstoning or insufficient solder.

5.3 Polarity Identification

The datasheet clearly indicates how to identify the anode and cathode. This is often shown via a diagram marking a cut corner, a dot, a longer lead, or a specific pad shape. Correct polarity is essential for device operation.

6. Soldering and Assembly Guidelines

Proper handling and soldering are critical to reliability.

6.1 Reflow Soldering Profile

A recommended reflow temperature profile is provided, including preheat, soak, reflow peak temperature, and cooling rates. The peak temperature and time above liquidus (TAL) must not exceed the component's maximum rated temperature to avoid damage to the plastic package or the semiconductor die.

6.2 Precautions and Handling

Guidelines include warnings against excessive mechanical stress, recommendations for using moisture barrier bags if the component is moisture-sensitive (MSL rating), and proper ESD (electrostatic discharge) handling procedures to prevent damage to the sensitive semiconductor junction.

6.3 Storage Conditions

Ideal storage temperature and humidity ranges are specified to prevent degradation. For moisture-sensitive devices, a floor life (time out of the dry bag) is specified, after which baking is required before soldering to prevent "popcorning" during reflow.

7. Packaging and Ordering Information

This section details how components are supplied and how to specify them.

7.1 Packaging Specifications

Describes the packaging format, such as tape-and-reel dimensions, reel quantity, or tray specifications. This information is necessary for automated pick-and-place machine setup.

7.2 Labeling and Marking

Explains the markings on the component body and the packaging labels, which typically include part number, date code, lot number, and binning codes for traceability.

7.3 Part Numbering System

Decodes the part number structure, showing how different fields represent attributes like color, flux bin, voltage bin, packaging type, and special features. This allows precise ordering of the required specification.

8. Application Recommendations

Guidance on how to effectively use the component in real-world designs.

8.1 Typical Application Circuits

Schematics for basic driving circuits, such as using a series resistor with a constant voltage source or employing a dedicated constant-current LED driver IC. Considerations for series/parallel connections are also discussed.

8.2 Design Considerations

Key design advice includes thermal management strategies (PCB copper area, vias, heat sinks), derating guidelines (operating at less than maximum ratings for improved longevity), and optical design tips (using appropriate lenses or diffusers).

9. Technical Comparison

An objective analysis of how this component compares to alternatives or previous generations. This might discuss improvements in efficacy (lm/W), color rendering, reliability (L70/L90 lifetime), or miniaturization. It may also position the component against different technology choices (e.g., vs. traditional lighting or other LED packages).

10. Frequently Asked Questions (FAQ)

Answers to common technical queries based on the parameters.

Q: What is the meaning of "LifecyclePhase: Revision"?
A: It indicates that the component and its documentation are in an active, supported production phase. The "Revision 3" denotes the third official version of the specification document, incorporating any changes or updates from previous revisions.

Q: What does "Expired Period: Forever" imply?
A: It means this revision of the datasheet does not have a planned expiration or obsolescence date. It remains the valid reference until superseded by a new official revision. It does not refer to the component's product lifecycle.

Q: How do I select the correct bin for my application?
A: Choose the wavelength/CCT bin based on the required color consistency. Select the flux bin to meet minimum brightness targets. Choose the voltage bin to ensure uniform current sharing if components are connected in parallel, or to optimize driver efficiency.

Q: What happens if I exceed the maximum junction temperature?
A: Exceeding Tj max can cause immediate catastrophic failure or, more commonly, a rapid acceleration of lumen depreciation and color shift, significantly reducing the useful life of the component far below its rated lifetime.

11. Practical Use Cases

Case 1: Architectural Linear Lighting: For a continuous run of LED tape, selecting components from tight wavelength and flux bins is critical to avoid visible color or brightness variations along the length. The low thermal resistance of the package allows for higher drive currents in confined spaces.

Case 2: Automotive Interior Lighting: The component's wide operating temperature range and high reliability metrics make it suitable for the harsh environment inside a vehicle. The specific binning ensures consistent ambiance lighting color across all fixtures in the cabin.

Case 3: Consumer Electronics Backlighting: The thin profile and high efficacy allow for slim display designs with good energy efficiency. The stable color point over temperature and current ensures consistent screen white balance.

12. Principle Introduction

Light-emitting diodes (LEDs) are semiconductor devices that emit light through electroluminescence. When a forward voltage is applied, electrons recombine with holes within the device, releasing energy in the form of photons. The wavelength (color) of the light is determined by the energy bandgap of the semiconductor materials used (e.g., InGaN for blue/green, AlInGaP for red/amber). White light is typically generated by using a blue LED chip coated with a yellow phosphor, which converts some blue light to longer wavelengths, resulting in a broad spectrum perceived as white. The efficiency of this conversion process and the electrical-to-optical power conversion are key metrics defining LED performance.

13. Development Trends

The LED industry continues to evolve along several key trajectories. Efficiency (lumens per watt) is steadily increasing, reducing energy consumption for the same light output. Improvements in color rendering, particularly for red and deep red spectral components (high CRI R9 value), are enhancing light quality for applications like retail and healthcare. Miniaturization allows for higher pixel density in direct-view displays. There is also a strong trend towards intelligent, connected lighting systems where LEDs are integrated with sensors and controllers. Furthermore, research continues into novel materials like perovskites and quantum dots for next-generation color conversion, potentially offering higher efficiency and more saturated colors.