LED Component Datasheet - Peak Wavelength λp - Packaging Details - Electrostatic Bag, Inner Carton, Outer Carton - English Technical Document

1. Product Overview

This technical document provides specifications for an LED (Light Emitting Diode) component. The primary focus, as indicated by the provided content, is on the product's lifecycle management, a key optical parameter, and its detailed packaging requirements. The document is structured to serve engineers, procurement specialists, and quality assurance personnel involved in the integration of this component into larger electronic assemblies. Its core advantage lies in providing clear, revision-controlled technical data essential for consistent manufacturing and reliable application.

The target market includes manufacturers of consumer electronics, automotive lighting modules, industrial indicators, and general illumination products where precise optical characteristics and secure component handling are critical.

2. Document Control and Lifecycle

The document is identified as Revision 2. It has an Expired Period of Forever, indicating this is the final and perpetually valid version of this particular revision's specifications. The official Release Date is recorded as 2013-06-10 16:27:13.0. This stringent revision control ensures that all parties reference the exact same set of technical parameters, preventing errors due to document version mismatch.

3. In-Depth Technical Parameter Analysis

3.1 Photometric and Optical Characteristics

The most prominent technical parameter specified is the Peak Wavelength (λp). The peak wavelength is the specific wavelength at which the LED emits its maximum optical power. This parameter is fundamental in defining the perceived color of the LED. For example:

• A λp around 450-470 nm typically indicates a blue LED.
• A λp around 520-550 nm typically indicates a green LED.
• A λp around 620-660 nm typically indicates a red LED.
• For white LEDs, the peak wavelength refers to the blue pump LED's emission, which is then converted by a phosphor layer.

The exact value of λp is crucial for applications requiring specific color points, such as in display backlights, traffic signals, or medical devices. It directly influences the chromaticity coordinates (e.g., CIE x,y) of the emitted light. Designers must select an LED with a λp that falls within the acceptable binning range for their application to ensure color consistency across multiple units.

3.2 Electrical Parameters (Inferred)

While specific voltage (Vf), current (If), and power ratings are not explicitly listed in the provided snippet, these are intrinsic to any LED datasheet. Typical parameters that would be detailed in a full document include:

• Forward Voltage (Vf): The voltage drop across the LED when operating at its rated current. This is critical for driver circuit design.
• Forward Current (If): The recommended operating current, which directly correlates to light output (luminous flux) and device longevity.
• Reverse Voltage (Vr): The maximum voltage the LED can withstand in the reverse-biased direction before damage occurs.

Thermal management parameters, such as the thermal resistance junction-to-ambient (RθJA), would also be essential for calculating heat dissipation requirements and ensuring the LED operates within its safe junction temperature limits.

4. Binning System Explanation

LED manufacturing involves natural variations. A binning system categorizes LEDs based on key parameters measured after production. Common binning criteria include:

• Wavelength/Color Temperature Binning: Groups LEDs based on their peak wavelength (λp) or, for white LEDs, their correlated color temperature (CCT) and chromaticity coordinates. This ensures color uniformity in an array.
• Luminous Flux Binning: Groups LEDs based on their light output at a specified test current. This ensures consistent brightness levels.
• Forward Voltage Binning: Groups LEDs based on their Vf at a specified test current. This can simplify driver design for parallel connections.

The provided document's emphasis on λp suggests that wavelength binning is a critical selection criterion for this component.

5. Performance Curve Analysis

A complete datasheet includes graphical representations of performance.

• I-V (Current-Voltage) Curve: Shows the relationship between forward voltage and current. It is non-linear, exhibiting a turn-on voltage after which current increases rapidly.
• Temperature Characteristics: Graphs typically show how forward voltage decreases and how luminous flux degrades as the junction temperature increases. This highlights the importance of thermal management.
• Spectral Power Distribution (SPD): A plot of relative optical power versus wavelength. It visually shows the peak wavelength (λp) and the full width at half maximum (FWHM), which indicates color purity.

6. Mechanical, Packaging & Assembly Information

6.1 Packaging Specifications

The document explicitly details a multi-layer packaging system:

1. Electrostatic Bag: The primary container for the individual LED components or reels. This is a static-shielding bag designed to protect the sensitive semiconductor die from electrostatic discharge (ESD) during handling, storage, and transport. It is typically a metalized plastic laminate.
2. Inner Carton: A cardboard box that contains multiple electrostatic bags. It provides physical protection and organizes units for internal handling.
3. Outer Carton: The main shipping container. It is a robust cardboard box designed to protect the inner cartons during logistics and storage, bearing necessary shipping labels and handling instructions.

The document also mentions Packing Quantity, which specifies the number of LED units contained within each level of packaging (e.g., per bag, per inner carton).

6.2 Soldering and Assembly Guidelines

While not in the snippet, standard guidelines would include:

• Reflow Soldering Profile: Recommended time-temperature graph for surface-mount assembly, including preheat, soak, reflow peak temperature, and cooling rates. Adherence prevents thermal shock.
• Handling Precautions: Instructions to use ESD-safe workstations, avoid mechanical stress on the lens, and not to touch the optical surface.
• Storage Conditions: Recommendations for temperature and humidity ranges to prevent moisture absorption (which can cause "popcorning" during reflow) and material degradation.

7. Ordering Information

The model naming convention would encode key parameters like color (linked to λp), flux bin, voltage bin, and packaging option. The specific code allows users to order the exact variant required for their design. Labels on the outer carton would include this part number, quantity, lot number, and date code for traceability.

8. Application Notes and Design Considerations

Typical Applications: Based on the focus on packaging and a key optical parameter, this LED is suitable for applications requiring reliable, color-specific indicators or light sources, such as control panels, automotive interior lighting, status indicators on appliances, and backlighting for small displays.

Design Considerations:

• Current Limiting: Always drive an LED with a constant current source or a current-limiting resistor to prevent thermal runaway.
• Thermal Path: Design the PCB to conduct heat away from the LED's thermal pad (if present). Use thermal vias and adequate copper area.
• Optical Design: Consider the viewing angle and spatial radiation pattern when designing lenses or light guides.
• ESD Protection: Implement ESD protection diodes on circuit board inputs if the LED is in a user-accessible location.

9. Frequently Asked Questions (FAQs)

Q: Why is the peak wavelength (λp) so important?
A: λp is the primary determinant of the LED's dominant color. For color-critical applications, even a few nanometers of shift can be unacceptable. It is the main parameter for color binning.

Q: What is the purpose of the three-level packaging?
A: It ensures both electrical protection (ESD bag), physical organization (inner carton), and shipping durability (outer carton). This minimizes damage and contamination from factory to assembly line.

Q: The document says "Expired Period: Forever." Does this mean the product is obsolete?
A: No. In this context, it means this specific revision (Rev. 2) of the datasheet does not have a planned expiration or supersession date. The specifications are fixed for this product version.

10. Practical Use Case

Scenario: Designing a status indicator panel for industrial equipment.
The designer needs a red indicator LED. They reference this datasheet to select an LED with a λp in the desired red wavelength bin (e.g., 625 nm) to ensure a consistent, vivid red color across all units on the panel. They note the packaging specifies an electrostatic bag, so they instruct their receiving department to handle the components at an ESD-safe station. The packing quantity information helps them plan their inventory and order the correct number of inner cartons. During PCB layout, they design a pad pattern matching the LED's footprint and include thermal relief. In the assembly instructions, they specify the reflow profile from the datasheet to their contract manufacturer.

11. Technical Principle Introduction

An LED is a semiconductor p-n junction diode. When forward-biased, electrons from the n-region recombine with holes from the p-region in the active region, releasing energy in the form of photons (light). The wavelength (color) of the emitted light is determined by the energy bandgap of the semiconductor material used (e.g., InGaN for blue/green, AlInGaP for red/amber). The "peak wavelength" is the specific photon energy emitted with the highest intensity from this process. The packaging protects the delicate semiconductor die and includes a molded epoxy lens that shapes the light output and protects the die from the environment.

12. Industry Trends

The LED industry continues to evolve towards higher efficiency (more lumens per watt), improved color rendering, and higher reliability. Miniaturization remains a trend, allowing for denser arrays and new form factors. There is also a growing emphasis on smart and connected lighting, requiring LEDs compatible with driver circuits that support dimming and color tuning. Furthermore, supply chain transparency and detailed, machine-readable datasheets (like this one with clear revision control) are becoming standard to support automated manufacturing and quality control processes.