Table of Contents
- 1. Product Overview
- 1.1 Core Advantages and Target Market
- 2. Technical Specifications Deep Dive
- 2.1 Device Description and Technology
- 2.2 Absolute Maximum Ratings
- 2.3 Electrical & Optical Characteristics
- 2.3.1 Green LED Characteristics
- 2.3.2 AlInGaP Hyper Red LED Characteristics
- 3. Binning System Explanation
- 4. Performance Curve Analysis
- 5. Mechanical and Packaging Information
- 5.1 Package Dimensions
- 5.2 Pin Connection and Circuit Diagram
- 6. Soldering and Assembly Guidelines
- 7. Application Suggestions
- 7.1 Typical Application Scenarios
- 7.2 Design Considerations
- 8. Technical Comparison and Differentiation
- 9. Frequently Asked Questions (Based on Technical Parameters)
- 10. Design and Usage Case Study
- 11. Operating Principle Introduction
- 12. Technology Trends
1. Product Overview
The LTP-181FFM is a medium-sized, bi-color dot matrix display module designed for applications requiring clear alphanumeric or symbolic information display. Its core function is to provide a visual output interface composed of individually addressable light-emitting diodes (LEDs) arranged in a grid pattern.
1.1 Core Advantages and Target Market
This device is engineered with several key advantages that make it suitable for industrial, commercial, and instrumentation applications. It features a 1.86-inch (47.4 mm) character height, which offers excellent readability from a distance. The display provides high brightness and high contrast, ensuring visibility even in well-lit environments. A wide viewing angle allows the information to be seen clearly from various positions relative to the display surface.
From a reliability standpoint, it boasts solid-state reliability inherent to LED technology, meaning no moving parts and long operational life. It has low power requirements, making it energy-efficient. A significant mechanical feature is that the modules are stackable both vertically and horizontally, enabling the creation of larger display panels or multi-line displays without complex interfacing. The LEDs are also categorized for luminous intensity, ensuring consistent brightness across different units and within the matrix itself, which is critical for uniform appearance.
The target market includes applications such as public information displays, industrial control panels, test and measurement equipment, transportation signage, and any system where robust, reliable, and clear status or data presentation is required.
2. Technical Specifications Deep Dive
The LTP-181FFM is a 16 rows by 16 columns dot matrix display. It utilizes two different LED semiconductor technologies for its bi-color capability.
2.1 Device Description and Technology
The green LED chips are fabricated from Gallium Phosphide (GaP) on a GaP substrate. The red LED chips utilize Aluminum Indium Gallium Phosphide (AlInGaP) technology, specifically noted as "Hyper red," indicating high efficiency and purity in the red spectrum. These red chips are grown on a non-transparent Gallium Arsenide (GaAs) substrate. The display features a black face to enhance contrast by absorbing ambient light, and a diffusion film is added over the LEDs to blend the individual dots into a more uniform character appearance, reducing the "dotty" look.
2.2 Absolute Maximum Ratings
These ratings define the limits beyond which permanent damage to the device may occur. They are specified at an ambient temperature (TA) of 25°C.
- Average Power Dissipation per Dot: Green: 36 mW, Hyper Red: 40 mW.
- Peak Forward Current per Dot: Green: 100 mA, Hyper Red: 90 mA.
- Average Forward Current per Dot: Green: 13 mA, Hyper Red: 15 mA. This rating must be derated linearly above 25°C at a rate of 0.17 mA/°C for green and 0.2 mA/°C for red.
- Reverse Voltage per Dot: 5 V for both colors.
- Operating & Storage Temperature Range: -35°C to +85°C.
- Solder Temperature: 260°C for 3 seconds, measured 1/16 inch (≈1.59 mm) below the seating plane of the package.
2.3 Electrical & Optical Characteristics
These are the guaranteed performance parameters under specified test conditions at TA = 25°C.
2.3.1 Green LED Characteristics
- Average Luminous Intensity (IV): Typical 1400 µcd, with a minimum of 500 µcd. Test Condition: Peak current (Ip) = 35 mA, 1/16 duty cycle.
- Peak Emission Wavelength (λp): 565 nm (Typical). Test Condition: Forward current (IF) = 20 mA.
- Spectral Line Half-Width (Δλ): 30 nm (Typical). IF = 20 mA.
- Dominant Wavelength (λd): 569 nm (Typical). IF = 20 mA.
- Forward Voltage (VF) per Dot: Typical 2.6 V (Max 3.7 V) at IF=80mA; Typical 2.1 V at IF=20mA.
- Reverse Current (IR) per Dot: Maximum 100 µA at VR = 5V.
- Luminous Intensity Matching Ratio (IV-m): Maximum 1.6:1 between any two dots. Ip = 35 mA, 1/16 duty.
2.3.2 AlInGaP Hyper Red LED Characteristics
- Average Luminous Intensity (IV): Typical 1500 µcd, with a minimum of 500 µcd. Test Condition: Ip = 15 mA, 1/16 duty cycle.
- Peak Emission Wavelength (λp): 650 nm (Typical). IF = 20 mA.
- Spectral Line Half-Width (Δλ): 35 nm (Typical). IF = 20 mA.
- Dominant Wavelength (λd): 639 nm (Typical). IF = 20 mA.
- Forward Voltage (VF) per Dot: Typical 2.8 V (Max 3.7 V implied) at IF=80mA; Typical 2.6 V at IF=20mA.
- Reverse Current (IR) per Dot: Maximum 100 µA at VR = 5V.
- Luminous Intensity Matching Ratio (IV-m): Maximum 1.6:1. Ip = 15 mA, 1/16 duty.
Note: Luminous intensity measurements use a sensor and filter approximating the CIE photopic eye-response curve.
3. Binning System Explanation
The datasheet indicates the LEDs are categorized for luminous intensity. This is a critical binning process.
- Luminous Intensity Binning: The specified matching ratio of 1.6:1 maximum ensures that within a single display module, no individual LED dot is more than 60% brighter than the dimmest dot under the same drive conditions. This is essential for achieving uniform brightness across characters and the entire display area, preventing "hot spots" or dim segments.
- Wavelength: While typical values for peak (565nm, 650nm) and dominant (569nm, 639nm) wavelengths are given, production variation is managed to ensure the green and red colors fall within acceptable visual bands. The spectral half-width data (30nm, 35nm) indicates the color purity.
- Forward Voltage: The specified ranges (e.g., 2.1V to 3.7V for green at high current) account for natural variation in semiconductor manufacturing. Drive circuitry must be designed to accommodate this range to ensure consistent brightness.
4. Performance Curve Analysis
The datasheet references Typical Electrical/Optical Characteristic Curves. While the specific graphs are not detailed in the provided text, standard curves for such devices typically include:
- I-V (Current-Voltage) Curve: Shows the relationship between forward current and forward voltage for a single LED dot. It is non-linear, with a turn-on/threshold voltage (around 1.8-2.0V for these colors) after which current increases rapidly with small voltage increases. This curve is crucial for designing current-limiting circuitry.
- Luminous Intensity vs. Forward Current (IF): Displays how light output increases with current. It is generally linear over a wide range but will saturate at very high currents due to thermal effects.
- Luminous Intensity vs. Ambient Temperature: Shows how light output decreases as the junction temperature of the LED rises. This derating is directly related to the average current derating specified in the Absolute Maximum Ratings.
- Spectral Distribution: A plot of relative intensity versus wavelength, showing the peak and dominant wavelengths and the spectral half-width, confirming the color characteristics.
5. Mechanical and Packaging Information
5.1 Package Dimensions
The datasheet includes a detailed mechanical drawing (not rendered here). Key notes from the drawing specify that all dimensions are in millimeters (mm) and the default tolerance is ±0.25 mm (0.01 inch) unless a specific feature note states otherwise. This drawing defines the overall footprint, mounting hole positions, LED matrix viewing area, and the precise location and pitch of the 48 pins.
5.2 Pin Connection and Circuit Diagram
The device has a 48-pin dual-in-line package. The pinout is complex due to the multiplexed 16x16 matrix. Pins are designated as either Common Anode for Rows or Cathode for Columns, with specific pins for Green and Red LEDs. For example, Pin 3 is Cathode Column 1 for Green, while Pin 11 is Cathode Column 1 for Red. This arrangement allows the controller to select a row (by applying a positive voltage to its common anode) and then illuminate specific green or red dots in that row by sinking current through the corresponding column cathode pins.
An internal circuit diagram is referenced, which would typically show the interconnection of all 256 LEDs (16x16), clarifying which anode rows and cathode columns control each specific LED dot for both colors.
6. Soldering and Assembly Guidelines
The primary guidance provided is the soldering temperature profile: 260°C for 3 seconds, measured at a point 1/16 inch (1.59 mm) below the package body. This is a standard wave soldering or hand soldering reference point to prevent excessive heat from damaging the internal LEDs or plastic package. For reflow soldering, a standard lead-free profile with a peak temperature around 260°C would be applicable, but the specific time above liquidus (TAL) should be controlled to meet the 3-second guideline at the pin level.
Handling should follow standard ESD (Electrostatic Discharge) precautions for semiconductor devices. Storage should be within the specified -35°C to +85°C temperature range in a low-humidity environment.
7. Application Suggestions
7.1 Typical Application Scenarios
- Industrial Control Panels: Displaying machine status, production counts, error codes, or setpoint values.
- Test and Measurement Equipment: Showing numerical readings, units, and mode indicators.
- Information Displays: In public spaces for simple messages, queue numbers, or transportation schedules.
- Stacked Display Systems: Multiple modules can be combined to show longer text messages, larger fonts, or multi-line data.
7.2 Design Considerations
- Drive Circuitry: A microcontroller with sufficient I/O pins or dedicated LED display driver ICs (like MAX7219 or similar multiplexing drivers) is required to manage the 16:1 multiplexing (16 rows). The driver must supply the peak current needed for the selected dots (e.g., 80mA per dot, divided by duty cycle).
- Current Limiting: External current-limiting resistors or constant-current drivers are mandatory for each cathode column (or groups thereof) to prevent exceeding the Absolute Maximum Current and to set the desired brightness. Calculations must use the maximum VF to ensure safe current under all conditions.
- Thermal Management: The average current derating with temperature must be observed. In high ambient temperatures, the multiplexing duty cycle or peak current may need to be reduced to keep junction temperature within safe limits and maintain brightness consistency.
- Viewing Angle: The wide viewing angle is beneficial but should be considered during mechanical enclosure design to align with the intended viewer positions.
8. Technical Comparison and Differentiation
Compared to generic single-color or smaller dot matrix displays, the LTP-181FFM offers distinct advantages:
- Bi-Color Capability: The use of dedicated Green and high-efficiency AlInGaP Hyper Red LEDs allows for two-color information presentation (e.g., green for normal status, red for alarms/warnings), enhancing information density and clarity.
- Large Character Height (1.86\"): Provides superior long-distance readability compared to smaller 5x7 or 8x8 matrices, filling a niche between small indicators and large signage.
- Intensity Binning: The guaranteed 1.6:1 intensity matching ratio is a mark of quality, ensuring professional-grade display uniformity that cheaper, unbinned displays may lack.
- Stackable Design: The mechanical design facilitates easy assembly of multi-module displays, a feature not always present in displays meant for standalone use.
9. Frequently Asked Questions (Based on Technical Parameters)
Q1: What is the difference between "peak" and "dominant" wavelength?
A: Peak wavelength (λp) is the wavelength at which the emitted light has its maximum intensity. Dominant wavelength (λd) is the wavelength of the monochromatic light that matches the perceived color of the LED. For LEDs, λd is often more relevant to human color perception.
Q2: Why is the test current for luminous intensity different for Green (35mA) and Red (15mA)?
A: This reflects the different efficiencies of the two semiconductor technologies. The AlInGaP Hyper Red LED is more efficient, producing its typical luminous intensity (1500 µcd) at a lower drive current than the GaP Green LED needs for its typical intensity (1400 µcd).
Q3: How do I calculate the required series resistor for a column?
A: Use Ohm's Law: R = (Vsupply - VF - Vdrop_driver) / IF. Use the maximum VF from the datasheet (e.g., 3.7V at 80mA for green) to ensure the current never exceeds the limit even with a low-VF LED. Account for the voltage drop of the column driver transistor/MOSFET (Vdrop_driver). The current IF is the desired per-dot peak current (e.g., 80mA), but remember this current is shared across all dots in a column that are active during a single row's time slice in a multiplexed design.
Q4: What does "1/16 DUTY" mean in the test conditions?
A: It indicates the display is being driven in a multiplexed mode with a 1/16 duty cycle. This is standard for a 16-row matrix. Each row is powered on for only 1/16th of the total refresh cycle time. The luminous intensity is measured under this condition, which is how the display will be used in practice. The peak current during the "on" time is higher than the average current to compensate for the low duty cycle and achieve the desired average brightness.
10. Design and Usage Case Study
Scenario: Designing a Multi-Line Production Counter Display.
An engineer needs a display for a factory floor showing the current production count and target for a machine. They choose two LTP-181FFM modules stacked vertically.
Implementation: A single microcontroller drives both displays. The firmware manages a 16-row multiplexing routine, refreshing each row sequentially. The top module displays "COUNT: [number]" in green. The bottom module displays "TARGET: [number]" in green. If the machine stops due to an error, the relevant line or a separate "ERROR" message can flash in red on the corresponding module. The stackable design simplifies mechanical mounting. The high brightness and wide viewing angle ensure the information is visible to operators from various points on the floor. The intensity binning guarantees both modules have a consistent, uniform appearance side-by-side.
11. Operating Principle Introduction
The LTP-181FFM operates on the principle of LED matrix multiplexing. It is not practical to have 256 individual wires (for a 16x16 monochrome) or more for bi-color. Instead, the LEDs are arranged in a grid where the anodes of all LEDs in a single row are connected together (Common Anode Row), and the cathodes of all LEDs in a single column for a specific color are connected together (Cathode Column).
To illuminate a specific dot (e.g., the green dot at Row 5, Column 3), the controller performs these steps in rapid succession within the refresh cycle: 1) It sets the Common Anode for Row 5 to a positive voltage (e.g., +5V). 2) It connects the Cathode for Column 3 (Green) to ground (0V), completing the circuit and allowing current to flow through that specific green LED. All other rows are off, and all other column lines are held high (open circuit). By scanning through all 16 rows very quickly (e.g., at 100Hz or more), the persistence of vision creates the illusion that all desired dots in the 16x16 matrix are lit simultaneously. The bi-color capability simply adds a separate set of cathode pins for the red LEDs, which are controlled independently.
12. Technology Trends
While the LTP-181FFM uses established GaP (Green) and AlInGaP (Red) technologies, the broader LED display field is evolving. Trends include:
- Higher Efficiency Materials: The shift from AlInGaP on GaAs to even more efficient structures or the use of InGaN-based materials for red LEDs (though challenging) to improve efficiency and color gamut.
- Integrated Drivers: Newer display modules often incorporate the multiplexing driver IC and sometimes even a microcontroller interface (like I2C or SPI) directly on the module PCB, significantly simplifying the external circuit design compared to bare LED matrices like the LTP-181FFM.
- Surface-Mount Technology (SMT): Many modern LED matrices use SMT LEDs and packages, allowing for lower profile, automated assembly, and potentially higher resolution. The through-hole design of the LTP-181FFM is robust and suited for applications where manual soldering or repair might occur.
- Full-Color RGB Matrices: For more advanced graphical or multi-color text applications, matrices with integrated red, green, and blue (RGB) LEDs in each pixel are becoming more common, though they require more complex driving electronics.
The LTP-181FFM represents a reliable, high-performance solution in its class, balancing size, brightness, bi-color functionality, and design flexibility for a wide range of embedded display applications.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |