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LTP-181FFM LED Dot Matrix Display Datasheet - 1.86-inch (47.4mm) Height - Green & Hyper Red - 16x16 Matrix - English Technical Document

Complete technical datasheet for the LTP-181FFM, a 1.86-inch (47.4mm) height, 16x16 dot matrix LED display featuring Green and AlInGaP Hyper Red LEDs. Includes specifications, pinout, electrical ratings, and optical characteristics.
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PDF Document Cover - LTP-181FFM LED Dot Matrix Display Datasheet - 1.86-inch (47.4mm) Height - Green & Hyper Red - 16x16 Matrix - English Technical Document

1. Product Overview

The LTP-181FFM is a medium-sized, bi-color dot matrix display module designed for applications requiring clear alphanumeric or symbolic information display. Its core function is to provide a visual output interface composed of individually addressable light-emitting diodes (LEDs) arranged in a grid pattern.

1.1 Core Advantages and Target Market

This device is engineered with several key advantages that make it suitable for industrial, commercial, and instrumentation applications. It features a 1.86-inch (47.4 mm) character height, which offers excellent readability from a distance. The display provides high brightness and high contrast, ensuring visibility even in well-lit environments. A wide viewing angle allows the information to be seen clearly from various positions relative to the display surface.

From a reliability standpoint, it boasts solid-state reliability inherent to LED technology, meaning no moving parts and long operational life. It has low power requirements, making it energy-efficient. A significant mechanical feature is that the modules are stackable both vertically and horizontally, enabling the creation of larger display panels or multi-line displays without complex interfacing. The LEDs are also categorized for luminous intensity, ensuring consistent brightness across different units and within the matrix itself, which is critical for uniform appearance.

The target market includes applications such as public information displays, industrial control panels, test and measurement equipment, transportation signage, and any system where robust, reliable, and clear status or data presentation is required.

2. Technical Specifications Deep Dive

The LTP-181FFM is a 16 rows by 16 columns dot matrix display. It utilizes two different LED semiconductor technologies for its bi-color capability.

2.1 Device Description and Technology

The green LED chips are fabricated from Gallium Phosphide (GaP) on a GaP substrate. The red LED chips utilize Aluminum Indium Gallium Phosphide (AlInGaP) technology, specifically noted as "Hyper red," indicating high efficiency and purity in the red spectrum. These red chips are grown on a non-transparent Gallium Arsenide (GaAs) substrate. The display features a black face to enhance contrast by absorbing ambient light, and a diffusion film is added over the LEDs to blend the individual dots into a more uniform character appearance, reducing the "dotty" look.

2.2 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. They are specified at an ambient temperature (TA) of 25°C.

2.3 Electrical & Optical Characteristics

These are the guaranteed performance parameters under specified test conditions at TA = 25°C.

2.3.1 Green LED Characteristics

2.3.2 AlInGaP Hyper Red LED Characteristics

Note: Luminous intensity measurements use a sensor and filter approximating the CIE photopic eye-response curve.

3. Binning System Explanation

The datasheet indicates the LEDs are categorized for luminous intensity. This is a critical binning process.

4. Performance Curve Analysis

The datasheet references Typical Electrical/Optical Characteristic Curves. While the specific graphs are not detailed in the provided text, standard curves for such devices typically include:

5. Mechanical and Packaging Information

5.1 Package Dimensions

The datasheet includes a detailed mechanical drawing (not rendered here). Key notes from the drawing specify that all dimensions are in millimeters (mm) and the default tolerance is ±0.25 mm (0.01 inch) unless a specific feature note states otherwise. This drawing defines the overall footprint, mounting hole positions, LED matrix viewing area, and the precise location and pitch of the 48 pins.

5.2 Pin Connection and Circuit Diagram

The device has a 48-pin dual-in-line package. The pinout is complex due to the multiplexed 16x16 matrix. Pins are designated as either Common Anode for Rows or Cathode for Columns, with specific pins for Green and Red LEDs. For example, Pin 3 is Cathode Column 1 for Green, while Pin 11 is Cathode Column 1 for Red. This arrangement allows the controller to select a row (by applying a positive voltage to its common anode) and then illuminate specific green or red dots in that row by sinking current through the corresponding column cathode pins.

An internal circuit diagram is referenced, which would typically show the interconnection of all 256 LEDs (16x16), clarifying which anode rows and cathode columns control each specific LED dot for both colors.

6. Soldering and Assembly Guidelines

The primary guidance provided is the soldering temperature profile: 260°C for 3 seconds, measured at a point 1/16 inch (1.59 mm) below the package body. This is a standard wave soldering or hand soldering reference point to prevent excessive heat from damaging the internal LEDs or plastic package. For reflow soldering, a standard lead-free profile with a peak temperature around 260°C would be applicable, but the specific time above liquidus (TAL) should be controlled to meet the 3-second guideline at the pin level.

Handling should follow standard ESD (Electrostatic Discharge) precautions for semiconductor devices. Storage should be within the specified -35°C to +85°C temperature range in a low-humidity environment.

7. Application Suggestions

7.1 Typical Application Scenarios

7.2 Design Considerations

8. Technical Comparison and Differentiation

Compared to generic single-color or smaller dot matrix displays, the LTP-181FFM offers distinct advantages:

9. Frequently Asked Questions (Based on Technical Parameters)

Q1: What is the difference between "peak" and "dominant" wavelength?
A: Peak wavelength (λp) is the wavelength at which the emitted light has its maximum intensity. Dominant wavelength (λd) is the wavelength of the monochromatic light that matches the perceived color of the LED. For LEDs, λd is often more relevant to human color perception.

Q2: Why is the test current for luminous intensity different for Green (35mA) and Red (15mA)?
A: This reflects the different efficiencies of the two semiconductor technologies. The AlInGaP Hyper Red LED is more efficient, producing its typical luminous intensity (1500 µcd) at a lower drive current than the GaP Green LED needs for its typical intensity (1400 µcd).

Q3: How do I calculate the required series resistor for a column?
A: Use Ohm's Law: R = (Vsupply - VF - Vdrop_driver) / IF. Use the maximum VF from the datasheet (e.g., 3.7V at 80mA for green) to ensure the current never exceeds the limit even with a low-VF LED. Account for the voltage drop of the column driver transistor/MOSFET (Vdrop_driver). The current IF is the desired per-dot peak current (e.g., 80mA), but remember this current is shared across all dots in a column that are active during a single row's time slice in a multiplexed design.

Q4: What does "1/16 DUTY" mean in the test conditions?
A: It indicates the display is being driven in a multiplexed mode with a 1/16 duty cycle. This is standard for a 16-row matrix. Each row is powered on for only 1/16th of the total refresh cycle time. The luminous intensity is measured under this condition, which is how the display will be used in practice. The peak current during the "on" time is higher than the average current to compensate for the low duty cycle and achieve the desired average brightness.

10. Design and Usage Case Study

Scenario: Designing a Multi-Line Production Counter Display.
An engineer needs a display for a factory floor showing the current production count and target for a machine. They choose two LTP-181FFM modules stacked vertically.

Implementation: A single microcontroller drives both displays. The firmware manages a 16-row multiplexing routine, refreshing each row sequentially. The top module displays "COUNT: [number]" in green. The bottom module displays "TARGET: [number]" in green. If the machine stops due to an error, the relevant line or a separate "ERROR" message can flash in red on the corresponding module. The stackable design simplifies mechanical mounting. The high brightness and wide viewing angle ensure the information is visible to operators from various points on the floor. The intensity binning guarantees both modules have a consistent, uniform appearance side-by-side.

11. Operating Principle Introduction

The LTP-181FFM operates on the principle of LED matrix multiplexing. It is not practical to have 256 individual wires (for a 16x16 monochrome) or more for bi-color. Instead, the LEDs are arranged in a grid where the anodes of all LEDs in a single row are connected together (Common Anode Row), and the cathodes of all LEDs in a single column for a specific color are connected together (Cathode Column).

To illuminate a specific dot (e.g., the green dot at Row 5, Column 3), the controller performs these steps in rapid succession within the refresh cycle: 1) It sets the Common Anode for Row 5 to a positive voltage (e.g., +5V). 2) It connects the Cathode for Column 3 (Green) to ground (0V), completing the circuit and allowing current to flow through that specific green LED. All other rows are off, and all other column lines are held high (open circuit). By scanning through all 16 rows very quickly (e.g., at 100Hz or more), the persistence of vision creates the illusion that all desired dots in the 16x16 matrix are lit simultaneously. The bi-color capability simply adds a separate set of cathode pins for the red LEDs, which are controlled independently.

12. Technology Trends

While the LTP-181FFM uses established GaP (Green) and AlInGaP (Red) technologies, the broader LED display field is evolving. Trends include:

The LTP-181FFM represents a reliable, high-performance solution in its class, balancing size, brightness, bi-color functionality, and design flexibility for a wide range of embedded display applications.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.