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LED Emitter 3030 Specification Sheet - Size 3.0x3.0x2.53mm - Voltage 1.8-2.6V - Power 1.3W - 730nm Infrared - English Technical Document

Detailed technical specifications for a 3.0x3.0x2.53mm EMC packaged infrared LED with 730nm peak wavelength, designed for horticultural lighting applications such as grow lamps, plant factories, and tissue culture.
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PDF Document Cover - LED Emitter 3030 Specification Sheet - Size 3.0x3.0x2.53mm - Voltage 1.8-2.6V - Power 1.3W - 730nm Infrared - English Technical Document

1. Product Overview

This section provides a comprehensive overview of the infrared LED emitter, detailing its design, key features, and primary applications in modern horticultural lighting systems.

1.1 General Description

The product is a surface-mount device (SMD) LED utilizing an Epoxy Molding Compound (EMC) package. This packaging technology offers enhanced reliability, superior thermal management, and robust performance in demanding environments. The compact dimensions are 3.00mm in length, 3.00mm in width, and 2.53mm in height, making it suitable for high-density PCB layouts. The primary function is to emit light at a peak wavelength of 730 nanometers (nm), which falls within the far-red spectrum, a region crucial for photomorphogenic responses in plants.

1.2 Key Features

1.3 Application Scenarios

This LED is specifically engineered for horticultural and agricultural lighting applications where far-red light is essential. Key use cases include:

2. In-Depth Technical Parameter Analysis

A detailed examination of the electrical, optical, and thermal characteristics as defined under standard test conditions (Ts=25\u00b0C).

2.1 Electrical and Optical Characteristics

The table below outlines the critical performance parameters. The test current for most optical specifications is 350mA.

2.2 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage may occur. Operation at or near these limits is not advised.

3. Binning System Explanation

While a formal binning code is not explicitly provided in the document, the specified parameter ranges effectively constitute a binning structure. Designers must account for these variations when designing circuits and light engines.

4. Performance Curve Analysis

The typical characteristic curves provide insight into the device\u2019s behavior under varying conditions.

4.1 Forward Voltage vs. Forward Current (IV Curve)

The curve shows a non-linear relationship typical of diodes. At the recommended operating current of 350mA, the forward voltage is expected to be near the center of the 1.8-2.6V range. The curve helps in selecting appropriate driver voltage compliance.

4.2 Relative Intensity vs. Forward Current

This curve demonstrates the optical output saturation characteristic. Intensity increases with current but may not be linear, especially as thermal effects become significant at higher currents. Operating near 350mA appears to be in a efficient region.

4.3 Relative Intensity vs. Case Temperature

The output decreases as the case temperature (Ts) increases. This thermal droop effect is critical for horticultural applications where consistent light output over long periods is required. Adequate heat sinking is essential to mitigate output loss.

4.4 Spectral Distribution

The spectrum plot confirms the dominant peak at 730nm with a typical full width at half maximum (FWHM) common to AlGaAs-based LEDs. There is minimal emission in the visible spectrum, making it purely a far-red source.

4.5 Radiation Pattern

The polar diagram illustrates a lambertian-like emission pattern with a 60-degree viewing angle, useful for calculating spatial irradiation distribution on plant canopies.

4.6 Forward Current vs. Case Temperature

This derating curve indicates the maximum allowable forward current decreases as the ambient or case temperature rises. This is a crucial graph for determining safe operating conditions in enclosed fixtures.

5. Mechanical and Packaging Information

5.1 Package Dimensions and Layout

Detailed mechanical drawings specify the exact footprint.

5.2 Packaging for Automated Assembly

The device is supplied in tape-and-reel packaging compatible with standard SMT pick-and-place equipment.

6. Soldering and Assembly Guidelines

6.1 SMT Reflow Soldering Instructions

The LED is rated for lead-free reflow soldering processes. A typical reflow profile must be followed:

It is critical to avoid excessive mechanical stress during placement and to ensure the soldering profile does not exceed the LED\u2019s thermal limits to prevent lens cracking or internal delamination.

7. Packaging and Ordering Information

While specific part numbers are omitted per guidelines, the packaging specification is clear.

8. Application Recommendations and Design Considerations

Circuit Design: Use a constant current driver suitable for the forward voltage range. For series connections, ensure the driver voltage compliance covers the sum of the maximum VF of all LEDs plus headroom. Parallel connection is not recommended without additional current balancing.

Thermal Management: The thermal resistance of 14\u00b0C/W necessitates an effective thermal path. Use a PCB with sufficient thermal vias and, if needed, an external heatsink. Monitor the solder point temperature to ensure TJ remains below 115\u00b0C, preferably lower for longevity.

Optical Integration: The 60-degree viewing angle provides a good balance between beam spread and intensity. For focused applications, secondary optics may be required. Consider the spectral needs of the target plants; 730nm is often used in combination with red (660nm) and blue LEDs for full-spectrum recipes.

9. Technical Comparison and Differentiation

Compared to standard visible-light LEDs or older package types, this device offers specific advantages:

10. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the typical operating current?

A: While the absolute maximum is 500mA, the electrical/optical characteristics are tested at 350mA, which is likely the recommended operating point for optimal performance and longevity.

Q: How do I interpret the wide radiant flux range (180-480mW)?

A: This indicates natural manufacturing variation. For consistent light output in a fixture, consult the supplier for flux binning options or implement optical feedback control in your system.

Q: Can this LED be used in pulsed operation?

A: The datasheet does not specify pulsed ratings. For pulsed driving (e.g., for photosynthesis research), the instantaneous current may be higher, but the average power and junction temperature must not exceed the maximum ratings. Specific testing is recommended.

Q: How critical is the 730nm wavelength for plants?

A: It is very specific. Phytochrome, a key plant photoreceptor, exists in two interconvertible forms (Pr and Pfr). 730nm light primarily converts Pfr to Pr, influencing processes like shade avoidance, flowering initiation, and seed germination.

11. Practical Use Cases and Implementation Examples

Case Study 1: Vertical Farm Lettuce Production

In a multi-layer vertical farm, arrays of these 730nm LEDs are combined with 660nm red and 450nm blue LEDs. The far-red light is used during the final growth stage to promote leaf expansion and reduce elongation, resulting in a more compact, marketable lettuce head. The 3030 package size allows for dense placement on linear modules, ensuring even light coverage.

Case Study 2: Greenhouse Strawberry Flowering Control

In a traditional greenhouse, these LEDs are installed as supplemental lighting. By providing a low intensity of 730nm light at the end of the day (end-of-day lighting), growers can manipulate the phytochrome balance to induce and synchronize flowering in strawberry plants, leading to more predictable and higher-yield harvests.

12. Principle of Operation Introduction

This is a semiconductor light-emitting diode. When a forward voltage is applied across the anode and cathode, electrons and holes recombine in the active region of the semiconductor chip (typically based on Aluminum Gallium Arsenide - AlGaAs for this wavelength). This recombination process releases energy in the form of photons. The specific bandgap energy of the semiconductor material determines the wavelength of the emitted light. For 730nm, the bandgap energy is approximately 1.7 electron volts (eV). The EMC package serves to protect the delicate semiconductor die, provide a primary optical lens to shape the beam, and facilitate heat dissipation away from the chip.

13. Development Trends in Horticultural Lighting LEDs

The market for horticultural LEDs is rapidly evolving. Key trends relevant to this product include:

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.