Table of Contents
- 1. Product Overview
- 1.1 General Description
- 1.2 Key Features
- 1.3 Application Scenarios
- 2. In-Depth Technical Parameter Analysis
- 2.1 Electrical and Optical Characteristics
- 2.2 Absolute Maximum Ratings
- 3. Binning System Explanation
- 4. Performance Curve Analysis
- 4.1 Forward Voltage vs. Forward Current (IV Curve)
- 4.2 Relative Intensity vs. Forward Current
- 4.3 Relative Intensity vs. Case Temperature
- 4.4 Spectral Distribution
- 4.5 Radiation Pattern
- 4.6 Forward Current vs. Case Temperature
- 5. Mechanical and Packaging Information
- 5.1 Package Dimensions and Layout
- 5.2 Packaging for Automated Assembly
- 6. Soldering and Assembly Guidelines
- 6.1 SMT Reflow Soldering Instructions
- 7. Packaging and Ordering Information
- 8. Application Recommendations and Design Considerations
- 9. Technical Comparison and Differentiation
- 10. Frequently Asked Questions (Based on Technical Parameters)
- 11. Practical Use Cases and Implementation Examples
- 12. Principle of Operation Introduction
- 13. Development Trends in Horticultural Lighting LEDs
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
This section provides a comprehensive overview of the infrared LED emitter, detailing its design, key features, and primary applications in modern horticultural lighting systems.
1.1 General Description
The product is a surface-mount device (SMD) LED utilizing an Epoxy Molding Compound (EMC) package. This packaging technology offers enhanced reliability, superior thermal management, and robust performance in demanding environments. The compact dimensions are 3.00mm in length, 3.00mm in width, and 2.53mm in height, making it suitable for high-density PCB layouts. The primary function is to emit light at a peak wavelength of 730 nanometers (nm), which falls within the far-red spectrum, a region crucial for photomorphogenic responses in plants.
1.2 Key Features
- Compact Size: Dimensions of 3.00mm x 3.00mm x 2.53mm.
- Specific Wavelength: Peak emission wavelength (\u03bbp) of 730nm, targeting the photoreceptor Phytochrome.
- RoHS Compliance: Manufactured without lead or other restricted hazardous substances.
- Solderability: Designed for lead-free reflow soldering processes.
- Moisture Sensitivity: Rated at Moisture Sensitivity Level (MSL) 3, requiring appropriate handling and baking if exposed.
- Packaging: Supplied on reels with a standard quantity of 3000 pieces per reel.
- High Reliability: EMC package ensures stable performance under various operating conditions.
1.3 Application Scenarios
This LED is specifically engineered for horticultural and agricultural lighting applications where far-red light is essential. Key use cases include:
- Commercial Flower Production: Controlling flowering cycles and plant morphology.
- Tissue Culture Laboratories: Promoting specific growth phases in sterile environments.
- Vertical Farms and Plant Factories: Integrating into multi-spectrum lighting recipes for optimized year-round crop production.
- Greenhouse Supplemental Lighting: Extending the photoperiod or providing specific spectral qualities to enhance plant growth and development.
- Post-Harvest Preservation: Applications in refrigeration to potentially influence freshness and shelf-life, though this is an emerging area of research.
2. In-Depth Technical Parameter Analysis
A detailed examination of the electrical, optical, and thermal characteristics as defined under standard test conditions (Ts=25\u00b0C).
2.1 Electrical and Optical Characteristics
The table below outlines the critical performance parameters. The test current for most optical specifications is 350mA.
- Forward Voltage (VF): Ranges from a minimum of 1.8V to a maximum of 2.6V at 350mA. The typical value is not specified, but the range indicates the expected voltage drop across the device.
- Peak Wavelength (\u03bbp): Defined between 730nm and 740nm. This tight binning ensures consistent spectral output for precise agricultural applications.
- Total Radiant Flux (\u03a6e): Measures the total optical power emitted, ranging from 180mW to 480mW. This wide range necessitates careful binning for application design.
- Viewing Angle (2\u03b81/4): Approximately 60 degrees, defining the angular distribution of the emitted light.
- Thermal Resistance (RTHJ-S): Junction-to-solder point thermal resistance is 14\u00b0C/W. This value is critical for thermal management design to prevent overheating.
- Reverse Current (IR): Maximum of 10\u00b5A at a reverse voltage of 5V, indicating the diode\u2019s leakage characteristics.
2.2 Absolute Maximum Ratings
These ratings define the stress limits beyond which permanent damage may occur. Operation at or near these limits is not advised.
- Power Dissipation (PD): Maximum 1.3 Watts. This is the total power the package can dissipate.
- Forward Current (IF): Maximum continuous DC current of 500mA. A pulsed current rating may be higher but is not specified here.
- Reverse Voltage (VR): Maximum 5V. Exceeding this can cause breakdown.
- Electrostatic Discharge (ESD): Withstands 2000V (Human Body Model), indicating moderate handling robustness.
- Temperature Ranges: Operating temperature from -40\u00b0C to +85\u00b0C; storage temperature from -40\u00b0C to +100\u00b0C.
- Maximum Junction Temperature (TJ): Absolute maximum of 115\u00b0C. The system must be designed to keep the junction temperature well below this limit during operation.
3. Binning System Explanation
While a formal binning code is not explicitly provided in the document, the specified parameter ranges effectively constitute a binning structure. Designers must account for these variations when designing circuits and light engines.
- Wavelength Binning: The 730-740nm range is relatively narrow for a far-red LED, ensuring spectral consistency critical for phytochrome activation in plants.
- Radiant Flux Binning: The wide output range (180-480mW) suggests that for applications requiring uniform light intensity, LEDs may need to be selected or binned into subgroups by the manufacturer or the assembler.
- Forward Voltage Binning: The 1.8-2.6V range requires consideration in driver design, especially for series-connected arrays, to ensure current uniformity.
4. Performance Curve Analysis
The typical characteristic curves provide insight into the device\u2019s behavior under varying conditions.
4.1 Forward Voltage vs. Forward Current (IV Curve)
The curve shows a non-linear relationship typical of diodes. At the recommended operating current of 350mA, the forward voltage is expected to be near the center of the 1.8-2.6V range. The curve helps in selecting appropriate driver voltage compliance.
4.2 Relative Intensity vs. Forward Current
This curve demonstrates the optical output saturation characteristic. Intensity increases with current but may not be linear, especially as thermal effects become significant at higher currents. Operating near 350mA appears to be in a efficient region.
4.3 Relative Intensity vs. Case Temperature
The output decreases as the case temperature (Ts) increases. This thermal droop effect is critical for horticultural applications where consistent light output over long periods is required. Adequate heat sinking is essential to mitigate output loss.
4.4 Spectral Distribution
The spectrum plot confirms the dominant peak at 730nm with a typical full width at half maximum (FWHM) common to AlGaAs-based LEDs. There is minimal emission in the visible spectrum, making it purely a far-red source.
4.5 Radiation Pattern
The polar diagram illustrates a lambertian-like emission pattern with a 60-degree viewing angle, useful for calculating spatial irradiation distribution on plant canopies.
4.6 Forward Current vs. Case Temperature
This derating curve indicates the maximum allowable forward current decreases as the ambient or case temperature rises. This is a crucial graph for determining safe operating conditions in enclosed fixtures.
5. Mechanical and Packaging Information
5.1 Package Dimensions and Layout
Detailed mechanical drawings specify the exact footprint.
- Top/Bottom View: Shows the 3.00mm x 3.00mm outline. The cathode identifier is marked.
- Side View: Confirms the 2.53mm height, including dome and leads.
- Polarity Identification: The cathode is typically marked by a notch, chamfer, or other visual indicator on the package. Correct orientation is vital for PCB assembly.
- Soldering Pad Pattern: Recommended PCB land pattern dimensions are provided to ensure reliable solder joint formation and proper mechanical alignment during reflow.
- Tolerances: All unspecified dimensional tolerances are \u00b10.2mm.
5.2 Packaging for Automated Assembly
The device is supplied in tape-and-reel packaging compatible with standard SMT pick-and-place equipment.
- Carrier Tape: Dimensions for pocket size, pitch, and tape width are specified to ensure compatibility with feeder systems.
- Reel Dimensions: Standard reel diameter, width, and hub size details are provided for logistics and machine setup.
- Packaging Quantity: 3000 pieces per reel is the standard packing unit.
6. Soldering and Assembly Guidelines
6.1 SMT Reflow Soldering Instructions
The LED is rated for lead-free reflow soldering processes. A typical reflow profile must be followed:
- Preheat Stage: Gradual heating to activate flux and minimize thermal shock.
- Soak Zone: Allows for temperature stabilization across the PCB.
- Reflow Zone: Peak temperature must not exceed the maximum package tolerance (typically 260\u00b0C for a few seconds, though the exact value should be confirmed from the full profile data). The moisture sensitivity level (MSL 3) dictates that if the packaging is opened, components must be used within 168 hours or baked before reflow.
- Cooling: Controlled cooling to form reliable solder joints.
It is critical to avoid excessive mechanical stress during placement and to ensure the soldering profile does not exceed the LED\u2019s thermal limits to prevent lens cracking or internal delamination.
7. Packaging and Ordering Information
While specific part numbers are omitted per guidelines, the packaging specification is clear.
- Standard Package: Tape and Reel.
- Quantity per Reel: 3000 units.
- Labeling: Reel labels typically include part number, quantity, lot number, and date code for traceability.
- Carton Packaging: Multiple reels are packed in cardboard boxes for shipping and storage, with details on box dimensions and packing quantity.
8. Application Recommendations and Design Considerations
Circuit Design: Use a constant current driver suitable for the forward voltage range. For series connections, ensure the driver voltage compliance covers the sum of the maximum VF of all LEDs plus headroom. Parallel connection is not recommended without additional current balancing.
Thermal Management: The thermal resistance of 14\u00b0C/W necessitates an effective thermal path. Use a PCB with sufficient thermal vias and, if needed, an external heatsink. Monitor the solder point temperature to ensure TJ remains below 115\u00b0C, preferably lower for longevity.
Optical Integration: The 60-degree viewing angle provides a good balance between beam spread and intensity. For focused applications, secondary optics may be required. Consider the spectral needs of the target plants; 730nm is often used in combination with red (660nm) and blue LEDs for full-spectrum recipes.
9. Technical Comparison and Differentiation
Compared to standard visible-light LEDs or older package types, this device offers specific advantages:
- vs. Plastic Package LEDs: The EMC package provides superior resistance to humidity and thermal stress, leading to longer lifespan and maintained output in greenhouse environments.
- vs. Broader Spectrum LEDs: The narrow 730nm peak offers targeted photobiological action without wasting energy on unused wavelengths, improving system efficacy (\u00b5mol/J).
- vs. Larger Packages: The 3030 footprint allows for higher density arrays, enabling more uniform light distribution over a canopy.
10. Frequently Asked Questions (Based on Technical Parameters)
Q: What is the typical operating current?
A: While the absolute maximum is 500mA, the electrical/optical characteristics are tested at 350mA, which is likely the recommended operating point for optimal performance and longevity.
Q: How do I interpret the wide radiant flux range (180-480mW)?
A: This indicates natural manufacturing variation. For consistent light output in a fixture, consult the supplier for flux binning options or implement optical feedback control in your system.
Q: Can this LED be used in pulsed operation?
A: The datasheet does not specify pulsed ratings. For pulsed driving (e.g., for photosynthesis research), the instantaneous current may be higher, but the average power and junction temperature must not exceed the maximum ratings. Specific testing is recommended.
Q: How critical is the 730nm wavelength for plants?
A: It is very specific. Phytochrome, a key plant photoreceptor, exists in two interconvertible forms (Pr and Pfr). 730nm light primarily converts Pfr to Pr, influencing processes like shade avoidance, flowering initiation, and seed germination.
11. Practical Use Cases and Implementation Examples
Case Study 1: Vertical Farm Lettuce Production
In a multi-layer vertical farm, arrays of these 730nm LEDs are combined with 660nm red and 450nm blue LEDs. The far-red light is used during the final growth stage to promote leaf expansion and reduce elongation, resulting in a more compact, marketable lettuce head. The 3030 package size allows for dense placement on linear modules, ensuring even light coverage.
Case Study 2: Greenhouse Strawberry Flowering Control
In a traditional greenhouse, these LEDs are installed as supplemental lighting. By providing a low intensity of 730nm light at the end of the day (end-of-day lighting), growers can manipulate the phytochrome balance to induce and synchronize flowering in strawberry plants, leading to more predictable and higher-yield harvests.
12. Principle of Operation Introduction
This is a semiconductor light-emitting diode. When a forward voltage is applied across the anode and cathode, electrons and holes recombine in the active region of the semiconductor chip (typically based on Aluminum Gallium Arsenide - AlGaAs for this wavelength). This recombination process releases energy in the form of photons. The specific bandgap energy of the semiconductor material determines the wavelength of the emitted light. For 730nm, the bandgap energy is approximately 1.7 electron volts (eV). The EMC package serves to protect the delicate semiconductor die, provide a primary optical lens to shape the beam, and facilitate heat dissipation away from the chip.
13. Development Trends in Horticultural Lighting LEDs
The market for horticultural LEDs is rapidly evolving. Key trends relevant to this product include:
- Increased Efficiency: Ongoing R&D aims to improve the wall-plug efficiency (radiant flux per electrical watt) of far-red LEDs, reducing the operational cost of grow lights.
- Enhanced Reliability: Further improvements in EMC and other package materials to withstand higher temperatures and humidity for even longer lifetimes (often targeting 50,000+ hours).
- Spectral Tuning: While this is a monochromatic emitter, there is growing interest in multi-chip packages or novel phosphors that combine multiple wavelengths (e.g., deep red and far-red) into a single package for simplified system design.
- Smart and Dynamic Lighting: Integration with sensors and control systems to deliver variable light spectra and intensities based on real-time plant needs, crop stage, or environmental conditions. The consistent performance of devices like this 730nm LED is foundational for such precision agriculture systems.
- Standardization: Development of industry standards for measuring and reporting horticulturally relevant metrics, such as photon flux in the photosynthetic photon flux density (PPFD) range and specific photon flux for far-red radiation.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |