LED Lamp 1003SYGD/S530-E2 Datasheet - 3mm Round - 2.0V - 20mA - Brilliant Yellow Green - English Technical Document

1. Product Overview

The 1003SYGD/S530-E2 is a high-brightness, through-hole LED lamp designed for general-purpose indicator applications. It utilizes an AlGaInP chip to produce a brilliant yellow-green light output. The device is characterized by its reliability, robustness, and compliance with environmental standards, being lead-free and RoHS compliant. It is supplied in a standard 3mm round diffused package with a green resin color that matches the emitted light, enhancing contrast and visibility.

1.1 Core Advantages

• High Brightness: Specifically engineered for applications requiring higher luminous intensity.
• Wide Viewing Angle: Features a 110-degree half-intensity angle (2θ1/2), ensuring good visibility from various perspectives.
• Choice of Packaging: Available on tape and reel for automated assembly processes.
• Environmental Compliance: The product is lead-free and adheres to RoHS directives.
• Color Variety: Part of a series available in different colors and intensities to suit diverse design needs.

1.2 Target Market & Applications

This LED is primarily targeted at the consumer electronics and industrial control markets where reliable, low-cost status indication is required. Its typical applications include, but are not limited to:

• Power and status indicators on television sets and computer monitors.
• Backlighting for keypads and function buttons on telephones.
• Indicator lights on various computer peripherals and internal components.
• General-purpose panel indicators in instrumentation and control panels.

2. In-Depth Technical Parameter Analysis

This section provides a detailed, objective interpretation of the key electrical, optical, and thermal parameters specified in the datasheet.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

• Continuous Forward Current (IF): 25 mA. The maximum DC current that can be applied continuously to the LED.
• Peak Forward Current (IFP): 60 mA. Applicable only under pulsed conditions (duty cycle 1/10 @ 1kHz) to briefly achieve higher light output.
• Reverse Voltage (VR): 5 V. Exceeding this voltage in reverse bias can cause junction breakdown.
• Power Dissipation (Pd): 60 mW. The maximum power the package can dissipate, calculated as VF * IF.
• Operating & Storage Temperature: Ranges from -40°C to +85°C and -40°C to +100°C, respectively, defining the environmental limits for reliable operation and non-operational storage.
• Soldering Temperature (Tsol): 260°C for 5 seconds. Defines the maximum thermal profile the LED can withstand during wave or hand soldering.

2.2 Electro-Optical Characteristics

These parameters are measured at a standard test condition of Ta=25°C and IF=20mA, providing the baseline performance.

• Luminous Intensity (Iv): 12.5 mcd (Typical). This is the measured light output in the forward direction. The minimum guaranteed value is 6.3 mcd.
• Viewing Angle (2θ1/2): 110° (Typical). The angular span where the luminous intensity is at least half of the peak intensity. The diffused lens creates this wide, uniform viewing pattern.
• Dominant Wavelength (λd): 573 nm (Typical). The perceived color of the light, which is in the yellow-green region of the spectrum.
• Peak Wavelength (λp): 575 nm (Typical). The wavelength at which the spectral power distribution is maximum.
• Forward Voltage (VF): 2.0 V (Typical), with a range from 1.7V to 2.4V at 20mA. This parameter is crucial for current-limiting resistor calculation in circuit design.
• Reverse Current (IR): Maximum 10 μA at VR=5V. Indicates the leakage current when the LED is reverse-biased.

Note on Measurement Uncertainty: The datasheet specifies tolerances for key measurements: ±0.1V for VF, ±10% for Iv, and ±1.0nm for λd. These must be considered in precision applications.

3. Performance Curve Analysis

The provided characteristic curves offer valuable insights into the LED's behavior under varying conditions.

3.1 Spectral Distribution & Directivity

The Relative Intensity vs. Wavelength curve shows a typical narrow-band emission spectrum centered around 575nm, characteristic of AlGaInP materials. The Directivity curve visually confirms the wide, Lambertian-like radiation pattern with a 110° half-angle.

3.2 Current-Voltage (I-V) Relationship

The Forward Current vs. Forward Voltage curve is exponential, typical of a diode. At the recommended 20mA operating point, the voltage is approximately 2.0V. Designers must use a series resistor to set the current, as a small change in voltage can cause a large change in current.

3.3 Optical Output vs. Drive Current

The Relative Intensity vs. Forward Current curve is generally linear at lower currents but may show signs of efficiency droop (sub-linear increase) as current approaches the maximum rating, due to increased thermal effects.

3.4 Temperature Dependence

The Relative Intensity vs. Ambient Temperature curve shows that light output decreases as temperature increases. This is a fundamental property of LEDs. The Forward Current vs. Ambient Temperature curve at a constant voltage demonstrates that for a fixed series resistor, the current would slightly decrease with rising temperature due to the negative temperature coefficient of the forward voltage.

4. Mechanical & Package Information

4.1 Package Dimensions

The LED is housed in a standard 3mm round diffused package. Key dimensional notes from the datasheet include:

• All dimensions are in millimeters (mm).
• The flange height must be less than 1.5mm (0.059\").
• The default tolerance for unspecified dimensions is ±0.25mm.
• The detailed dimensioned drawing in the datasheet specifies lead spacing, lens diameter, overall height, and lead forming dimensions critical for PCB footprint design.

4.2 Polarity Identification

The cathode is typically identified by a flat spot on the rim of the LED lens and/or by the shorter lead. Correct polarity must be observed during installation.

5. Soldering & Assembly Guidelines

Proper handling is essential to maintain LED performance and reliability.

5.1 Lead Forming

• Bending must occur at least 3mm from the base of the epoxy bulb to avoid stress on the package.
• Form leads before soldering.
• Avoid applying stress to the package. Cut leads at room temperature.
• Ensure PCB holes align perfectly with LED leads to prevent mounting stress.

5.2 Storage Conditions

• Store at ≤30°C and ≤70% Relative Humidity (RH). Shelf life is 3 months under these conditions.
• For longer storage (up to 1 year), use a sealed container with nitrogen and desiccant.
• Avoid rapid temperature changes in humid environments to prevent condensation.

5.3 Soldering Recommendations

Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.

• Hand Soldering: Iron tip temperature ≤300°C (for a max. 30W iron), soldering time ≤3 seconds.
• Wave/Dip Soldering: Preheat ≤100°C for ≤60 seconds. Solder bath at ≤260°C for ≤5 seconds.
• Avoid stress on leads during high-temperature phases. Limit dip/hand soldering to one cycle.
• Protect the LED from mechanical shock until it cools to room temperature after soldering.
• Use the lowest possible soldering temperature that achieves a reliable joint.

5.4 Cleaning

• If necessary, clean only with isopropyl alcohol at room temperature for ≤1 minute.
• Avoid ultrasonic cleaning. If absolutely required, pre-qualify the process to ensure no damage occurs.

5.5 Heat Management

Although this is a low-power device, proper thermal design is still important for long-term reliability, especially if operated near maximum ratings. The current should be de-rated appropriately at higher ambient temperatures, referencing any de-rating curves if provided.

6. Packaging & Ordering Information

6.1 Packing Specification

The LEDs are packed to ensure protection from electrostatic discharge (ESD) and moisture.

• Primary Packing: 200-500 pieces per anti-static bag.
• Secondary Packing: 5 bags per inner carton.
• Tertiary Packing: 10 inner cartons per master (outside) carton.

6.2 Label Explanation

Labels on packaging include information such as Customer's Part Number (CPN), Production Number (P/N), Packing Quantity (QTY), quality Ranks (CAT), Dominant Wavelength (HUE), Reference (REF), and Lot Number (LOT No.).

7. Application Design Considerations

7.1 Circuit Design

Always use a current-limiting resistor in series with the LED. The resistor value (R) can be calculated using Ohm's Law: R = (Vcc - VF) / IF, where Vcc is the supply voltage, VF is the LED forward voltage (use 2.0V typical or 2.4V max for a conservative design), and IF is the desired forward current (e.g., 20mA). Ensure the resistor's power rating is sufficient (P = (Vcc - VF) * IF).

7.2 PCB Layout

Follow the recommended package dimensions for the hole pattern. Ensure adequate clearance around the LED dome to avoid mechanical interference. For designs requiring consistent brightness across multiple LEDs, consider binning for forward voltage and luminous intensity.

7.3 Lifetime & Reliability

LED lifetime is typically defined as the point where luminous intensity degrades to 50% of its initial value (L70, L50). Operating the LED below its absolute maximum ratings, especially in terms of current and temperature, is the primary method to maximize operational lifetime.

8. Technical Comparison & Differentiation

The 1003SYGD/S530-E2 differentiates itself in the market of 3mm through-hole LEDs through its specific combination of attributes:

• Material: The use of AlGaInP semiconductor material provides high efficiency in the yellow-green to red spectrum range, compared to older technologies.
• Brightness vs. Viewing Angle: It offers a balanced compromise between high typical luminous intensity (12.5mcd) and a very wide viewing angle (110°), making it suitable for applications where visibility from off-angles is important.
• Environmental Focus: Its lead-free and RoHS-compliant construction aligns with modern environmental regulations for electronic products.

9. Frequently Asked Questions (FAQs)

9.1 What resistor should I use for a 5V supply?

Using the typical VF of 2.0V and a target IF of 20mA: R = (5V - 2.0V) / 0.02A = 150 Ω. The power dissipated in the resistor is (5V-2.0V)*0.02A = 0.06W, so a standard 1/8W (0.125W) or 1/4W resistor is suitable. For a conservative design using VF(max)=2.4V, R = (5V-2.4V)/0.02A = 130 Ω.

9.2 Can I drive this LED with a 3.3V supply?

Yes. Using VF(typ)=2.0V and IF=20mA: R = (3.3V - 2.0V) / 0.02A = 65 Ω. Verify that the voltage drop across the LED (VF) is less than your supply voltage, even considering the maximum VF of 2.4V (3.3V > 2.4V, so it is feasible).

9.3 How does temperature affect brightness?

As ambient temperature increases, the luminous intensity of the LED decreases. This is a physical characteristic of semiconductor light sources. For critical applications where consistent brightness is required over a temperature range, feedback control or temperature compensation may be necessary.

9.4 Is this LED suitable for outdoor use?

The operating temperature range (-40°C to +85°C) allows for use in many outdoor environments. However, the package is not specifically rated for waterproofing or high UV resistance. For direct outdoor exposure, additional environmental protection (conformal coating, sealed enclosures) would be required to prevent moisture ingress and lens degradation.

10. Design-in Case Study Example

Scenario: Designing a status indicator panel for a network router with multiple LEDs (Power, LAN, WAN, Wi-Fi). The panel needs to be readable from a wide angle in a typical office environment.

Component Selection: The 1003SYGD/S530-E2 is chosen for its wide 110° viewing angle, ensuring visibility from various desk positions. The yellow-green color offers high visual contrast against black or gray panels and is distinct from common red/green indicators.

Circuit Implementation: A 3.3V rail is available on the router's main PCB. A 68 Ω (standard value close to the calculated 65 Ω) current-limiting resistor is placed in series with each LED, setting the current to approximately 19mA, providing ample brightness while staying well within the 25mA maximum rating. The LEDs are mounted on a small daughterboard with proper lead spacing.

Result: The indicators provide clear, uniform illumination across the required viewing cone, with reliable operation ensured by adhering to the specified soldering and storage guidelines during manufacturing.

11. Operating Principle Introduction

Light Emitting Diodes (LEDs) are semiconductor devices that emit light through a process called electroluminescence. When a forward voltage is applied across the p-n junction, electrons from the n-type region recombine with holes from the p-type region within the active layer (in this case, made of AlGaInP). This recombination releases energy in the form of photons (light particles). The specific wavelength (color) of the emitted light is determined by the energy bandgap of the semiconductor material. A wider bandgap produces shorter wavelengths (bluer light), while a narrower bandgap produces longer wavelengths (redder light). The AlGaInP material system is particularly efficient for producing light in the yellow, orange, and red spectrum. The epoxy lens serves to shape the light output beam and protect the semiconductor chip.

12. Technology Trends

The through-hole LED technology represented by this component is considered a mature and well-established solution. Current industry trends show a strong shift towards surface-mount device (SMD) LEDs for most new designs due to their smaller size, suitability for automated pick-and-place assembly, and often better thermal performance. However, through-hole LEDs like the 3mm round type remain relevant for applications requiring higher single-point brightness, easier manual prototyping and repair, robustness in high-vibration environments, or where through-hole mounting provides a more secure mechanical connection. The underlying semiconductor material technology (AlGaInP) continues to see incremental improvements in efficiency and lifetime.