LED Lamp 519-1SURSYGW/S530-A3 Datasheet - Bi-Color/Bi-Polar - Voltage 2.0V - Power 60mW - Brilliant Red/Yellow Green - English Technical Document

1. Product Overview

The 519-1 series is a compact LED lamp designed for indicator and backlighting applications. It integrates two matched AlGaInP chips within a single package, ensuring uniform light output and a consistent wide viewing angle. The product is available in two primary configurations: bi-color types (combining Brilliant Red and Brilliant Yellow Green emissions) and bi-polar types (available in White Diffused or Color Diffused variants). This design offers flexibility for status indication, panel illumination, and user interface feedback in various electronic devices.

The core advantage of this series lies in its solid-state reliability, leading to an exceptionally long operational life. It is fully compatible with integrated circuit (IC) drive logic, featuring low forward voltage and power consumption, making it suitable for battery-powered or energy-sensitive designs. The product is manufactured using lead-free (Pb-free) processes and complies with the Restriction of Hazardous Substances (RoHS) directive.

1.1 Target Market & Applications

This LED lamp is engineered for integration into consumer electronics, communication devices, and computing equipment where reliable, low-power visual indicators are required. Its primary application domains include:

• Television Sets: Used for power status, standby mode, or function indicator lights.
• Computer Monitors: Employed as power or activity indicators.
• Telephones: Suitable for line status, message waiting, or hands-free mode indicators.
• Computers & Peripherals: Applicable for hard drive activity lights, power buttons, or network status indicators on routers and modems.

2. In-Depth Technical Parameter Analysis

This section provides a detailed, objective interpretation of the key electrical, optical, and thermal parameters defined in the datasheet. Understanding these specifications is crucial for proper circuit design and reliable operation.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation under or at these limits is not guaranteed and should be avoided in normal use.

• Continuous Forward Current (I_F): 25 mA for both SUR (Red) and SYG (Yellow Green) chips. Exceeding this current will generate excessive heat, degrading the epoxy resin and the semiconductor junction, leading to rapid luminous decay or catastrophic failure.
• Peak Forward Current (I_FP): 60 mA (at 1/10 duty cycle, 1 kHz). This rating allows for brief current pulses, useful for multiplexing schemes or creating brighter short-duration flashes, but the average current must remain within the continuous rating.
• Reverse Voltage (V_R): 5 V. LEDs have very low reverse breakdown voltage. Applying a reverse bias greater than 5V can cause immediate and irreversible junction breakdown. Circuit protection (e.g., a series diode in anti-parallel) is essential if the LED is exposed to potential reverse voltage conditions.
• Power Dissipation (P_d): 60 mW. This is the maximum allowable power (V_F * I_F) that can be dissipated as heat. Operating near this limit requires careful thermal management of the PCB and ambient environment.
• Operating & Storage Temperature: Ranges from -40°C to +85°C (operating) and -40°C to +100°C (storage). The device is suitable for industrial temperature environments.
• Soldering Temperature: 260°C for 5 seconds. This defines the reflow or wave soldering profile tolerance. Prolonged exposure to high temperature during assembly can damage the internal wire bonds or the epoxy lens.

2.2 Electro-Optical Characteristics

These are the typical performance parameters measured under standard test conditions (Ta=25°C, I_F=20mA). Designers should use the typical (Typ.) values for initial calculations but design circuits robust enough to accommodate the min/max spread.

• Forward Voltage (V_F): Typical 2.0V, ranging from 1.7V to 2.4V for both colors. The circuit's current-limiting resistor must be calculated using the maximum V_F to ensure the current never exceeds the maximum rating under worst-case conditions. A constant-current driver is recommended for precise brightness control.
• Luminous Intensity (I_V): The Red chip (SUR) has a typical intensity of 12.5 mcd, while the Yellow Green (SYG) is 5.0 mcd. This significant difference must be accounted for in bi-color applications to achieve perceived brightness balance; often, different drive currents or pulse-width modulation (PWM) duty cycles are used for each color.
• Viewing Angle (2θ_1/2): A very wide 180 degrees. This is a key feature, making the LED suitable for applications where the indicator needs to be visible from a broad range of angles, such as on a desktop device.
• Wavelength: The Red chip has a peak wavelength (λ_p) of 632 nm and a dominant wavelength (λ_d) of 624 nm. The Yellow Green chip has λ_p of 575 nm and λ_d of 573 nm. The spectrum radiation bandwidth (Δλ) is 20 nm for both, indicating the spectral purity of the emitted light.

3. Performance Curve Analysis

The datasheet provides several characteristic curves that illustrate how the LED's performance varies with operating conditions. These are essential for advanced design and understanding real-world behavior.

3.1 Relative Intensity vs. Wavelength & Directivity

The spectral distribution curves show the monochromatic nature of the AlGaInP chips. The Red emission is centered around 624-632 nm, and the Yellow Green around 573-575 nm. The directivity plots confirm the near-Lambertian (cosine) emission pattern, resulting in the wide 180-degree viewing angle. The intensity is highest when viewed head-on (0°) and decreases gradually towards the sides.

3.2 Forward Current vs. Forward Voltage (I-V Curve)

This curve exhibits the classic exponential diode characteristic. Below the turn-on voltage (~1.7V), very little current flows. Above this threshold, the current increases rapidly with a small increase in voltage. This highlights why LEDs must be driven by a current-limited source, not a voltage source. A small change in supply voltage can cause a large, potentially destructive, change in current.

3.3 Relative Intensity vs. Forward Current & Ambient Temperature

The light output (relative intensity) increases linearly with forward current up to the rated maximum. However, driving at higher currents increases junction temperature, which in turn affects performance. The curves showing intensity vs. ambient temperature demonstrate thermal quenching: as temperature rises, the luminous efficiency of the semiconductor decreases, leading to lower light output for the same drive current. This is a critical consideration for applications operating in high-temperature environments.

3.4 Chromaticity Coordinate vs. Forward Current (SYG)

For the Yellow Green chip, the datasheet includes a curve showing how the color coordinates shift with drive current. Typically, increasing current density can cause a slight shift in the peak wavelength (color shift). Designers requiring strict color consistency should operate the LED at a stable, defined current.

4. Mechanical & Package Information

4.1 Package Dimensions

The LED features a standard radial leaded package. Key dimensions include the lead spacing, body diameter, and overall height. The drawing specifies that the flange height must be less than 1.5mm. All dimensions have a default tolerance of ±0.25mm unless otherwise specified. The pinout is clearly marked: Pin 1 is the cathode for the SYG (Yellow Green) chip, Pin 2 is the common anode, and Pin 3 is the cathode for the SUR (Red) chip. Correct polarity identification is vital for bi-color operation.

5. Soldering & Assembly Guidelines

Proper handling during assembly is critical to maintaining LED performance and reliability.

5.1 Lead Forming

• Bending must occur at least 3mm from the base of the epoxy bulb to avoid transferring stress to the internal die and wire bonds.
• All forming must be completed before the soldering process.
• PCB holes must align precisely with the LED leads. Forcing misaligned LEDs into place creates stress that can crack the epoxy or damage the internal structure.

5.2 Storage

• Recommended storage conditions are 30°C or less and 70% Relative Humidity or less, with a shelf life of 3 months from shipment.
• For longer storage (up to one year), the devices should be kept in a sealed, moisture-barrier bag with desiccant, preferably in a nitrogen atmosphere, to prevent moisture absorption which can cause "popcorning" during reflow soldering.

5.3 Soldering Process

The datasheet provides specific recommendations for both hand and dip soldering:

• Hand Soldering: Iron tip temperature maximum 300°C (for a 30W iron), soldering time maximum 3 seconds per lead, maintaining a minimum 3mm distance from the solder joint to the epoxy bulb.
• Dip/Wave Soldering: Preheating to a maximum of 100°C for up to 60 seconds, followed by a solder bath at a maximum of 260°C for 5 seconds, again with the 3mm distance rule.
• Critical Rule: The soldering process (dip or hand) should not be performed more than once on the same LED. Repeated thermal cycling weakens the package.

6. Packaging & Ordering Information

6.1 Packing Specification

The LEDs are packaged to prevent electrostatic discharge (ESD) and moisture ingress. They are first placed in anti-static bags. These bags are then packed into inner cartons, with multiple inner cartons placed into a master outside carton. The standard packing quantity is a minimum of 200 to 500 pieces per anti-static bag, with 4 bags per inner carton, and 10 inner cartons per outside carton.

6.2 Label Explanation

The packaging labels include several codes essential for traceability and specification:

• P/N: The manufacturer's part number (e.g., 519-1SURSYGW/S530-A3).
• CPN: Customer's part number (if assigned).
• QTY: The quantity of devices in the specific bag or box.
• CAT: Indicates the binning ranks for Luminous Intensity and Forward Voltage. This allows selection of LEDs with tightly matched performance.
• HUE: Color rank or bin, specifying the wavelength tolerance.
• LOT No: The manufacturing lot number for full traceability.

7. Application Design Considerations

7.1 Driving Circuit Design

For simple DC operation, a series current-limiting resistor is mandatory. The resistor value (R_s) is calculated as: R_s = (V_supply - V_{F_max}) / I_{F_desired}. Always use V_{F_max} from the datasheet for a safe design. For bi-color applications, a common-anode configuration is standard. Two separate current-limiting resistors are needed—one for the red cathode and one for the yellow-green cathode—allowing independent control. For brightness matching due to different luminous intensities, the resistor values can be adjusted, or PWM control can be implemented at different duty cycles for each color.

7.2 Thermal Management

While the LED itself has low power dissipation, continuous operation at maximum ratings in a confined space or high ambient temperature can lead to junction temperature rise. Ensure adequate airflow around the device. The PCB layout should provide some copper area around the LED leads to act as a heat sink, especially if driving near the maximum current.

7.3 Optical Integration

The wide viewing angle makes this LED suitable for direct viewing without secondary optics. However, if light piping or diffusion is used in the end product's housing, the material should have high transmittance at the specific wavelengths (624 nm and 573 nm) to avoid unnecessary attenuation. The difference in intensity between the two colors should be considered when designing a shared light guide for bi-color indication.

8. Technical Comparison & Differentiation

The 519-1 series differentiates itself through its dual-chip, bi-color/bi-polar capability in a single, standard radial package. Compared to using two separate single-color LEDs, it saves PCB space and simplifies assembly. The use of AlGaInP technology provides high-efficiency red and yellow-green emission with good color saturation. The wide 180-degree viewing angle is superior to many standard LEDs with narrower beams, making it ideal for applications where the viewing position is not fixed. Its compatibility with both hand and automated soldering processes makes it versatile for various production scales.

9. Frequently Asked Questions (Based on Technical Parameters)

9.1 Can I drive the red and green chips simultaneously to create an orange/yellow color?

Yes, by driving both chips at appropriate currents, their light will mix additively. However, because they are discrete point sources of different colors, the mixed color may appear speckled unless a diffuser is used. The resulting color point will depend on the intensity ratio of the two chips.

9.2 Why is the maximum reverse voltage only 5V?

LEDs are fundamentally diodes optimized for forward conduction. The semiconductor junction in an LED has a very thin depletion region, making it susceptible to reverse breakdown at low voltages. Exceeding 5V in reverse bias can cause avalanche breakdown, permanently damaging the device.

9.3 How do I interpret the "CAT" and "HUE" codes on the label for my design?

These are binning codes. "CAT" groups LEDs by their forward voltage and luminous intensity. "HUE" groups them by dominant wavelength. For applications requiring uniform appearance (e.g., a panel of multiple indicators), specifying and using LEDs from the same bin (same CAT and HUE codes) is crucial to ensure consistent brightness and color across all units.

10. Practical Design Case Study

Scenario: Designing a status indicator for a network router with three states: Off (no light), Activity Flashing (Yellow Green), and Error (Solid Red).

Implementation: A single 519-1SURSYGW LED can be used. The common anode is connected to a 3.3V supply rail via a current-limiting resistor calculated for the red chip's V_{F_max}. A microcontroller's GPIO pins are connected to the two cathodes (Red and Yellow Green), each through a small-signal NPN transistor or a MOSFET configured as a low-side switch. The microcontroller firmware controls the transistors: for Red solid, it enables the red cathode switch continuously; for Yellow Green flashing, it enables the yellow-green cathode switch with a PWM signal at the desired flash rate. This design minimizes component count and PCB space compared to using two discrete LEDs.

11. Operating Principle

The LED operates on the principle of electroluminescence in a semiconductor p-n junction. When a forward bias voltage exceeding the material's bandgap energy is applied, electrons from the n-type region and holes from the p-type region are injected into the junction region. When these charge carriers recombine, they release energy in the form of photons (light). The specific material used—Aluminum Gallium Indium Phosphide (AlGaInP) for this LED—determines the bandgap energy and thus the wavelength (color) of the emitted light. Brilliant Red corresponds to a lower bandgap, while Yellow Green corresponds to a higher bandgap, achieved by varying the precise composition of the AlGaInP alloy.

12. Technology Trends

Indicator LEDs like the 519-1 series continue to evolve. General industry trends include further increases in luminous efficacy (more light output per watt of electrical input), enabling even lower power consumption for the same brightness. There is a move towards higher reliability and longer lifetime under harsh conditions (higher temperature, humidity). Packaging trends focus on miniaturization while maintaining or improving thermal performance. Furthermore, integration of control electronics (like constant-current drivers or PWM controllers) directly into the LED package is becoming more common for advanced applications, simplifying the external circuit design for the end user.