LED Lamp 523-2UYD/S530-A3 Datasheet - 5mm Round - Yellow Diffused - 2.4V - 60mW - English Technical Document

1. Product Overview

The 523-2UYD/S530-A3 is a high-brightness, 5mm round LED lamp designed for applications requiring reliable illumination and wide-angle visibility. It utilizes an AlGaInP chip to produce a super yellow diffused light output. The device is characterized by its robust construction, compliance with major environmental directives, and suitability for automated assembly processes.

1.1 Core Features and Advantages

• High Brightness: Specifically engineered for applications demanding superior luminous intensity.
• Wide Viewing Angle: Offers a typical 180-degree viewing angle (2θ1/2) for broad visibility.
• Package Options: Available on tape and reel for efficient, high-volume PCB assembly.
• Environmental Compliance: The product conforms to RoHS, EU REACH, and is Halogen Free (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm).
• Reliability: Designed to be reliable and robust for long-term operation in various conditions.

1.2 Target Applications

This LED is well-suited for a variety of indicator and backlighting applications in consumer and industrial electronics, including but not limited to: television sets, computer monitors, telephones, and general computing equipment.

2. In-Depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

• Continuous Forward Current (I_F): 25 mA
• Peak Forward Current (I_FP): 60 mA (Duty 1/10 @ 1kHz)
• Reverse Voltage (V_R): 5 V
• Power Dissipation (P_d): 60 mW
• Operating Temperature (T_opr): -40°C to +85°C
• Storage Temperature (T_stg): -40°C to +100°C
• Soldering Temperature (T_sol): 260°C for 5 seconds

2.2 Electro-Optical Characteristics (T_a=25°C)

These parameters define the typical performance of the LED under specified test conditions (I_F=20mA unless noted).

• Luminous Intensity (I_v): Typical 32 mcd (Min. 16 mcd). Measurement uncertainty is ±10%.
• Viewing Angle (2θ_1/2): Typical 180 degrees.
• Peak Wavelength (λ_p): Typical 591 nm.
• Dominant Wavelength (λ_d): Typical 589 nm. Measurement uncertainty is ±1.0 nm.
• Spectrum Radiation Bandwidth (Δλ): Typical 15 nm.
• Forward Voltage (V_F): Typical 2.0V, Maximum 2.4V. Measurement uncertainty is ±0.1V.
• Reverse Current (I_R): Maximum 10 μA at V_R=5V.

3. Performance Curve Analysis

The datasheet provides several key graphs that illustrate the device's behavior under varying conditions. These are critical for design engineers to predict performance in real-world applications.

3.1 Relative Intensity vs. Wavelength

This curve shows the spectral power distribution, peaking around 591 nm (yellow), with a typical bandwidth of 15 nm, confirming the color purity of the emitted light.

3.2 Directivity Pattern

The polar plot confirms the Lambertian-like emission pattern with a very wide 180-degree viewing angle, making it ideal for applications requiring wide-area visibility.

3.3 Forward Current vs. Forward Voltage (I-V Curve)

The graph shows the exponential relationship typical of a diode. At the recommended 20mA operating point, the forward voltage is typically 2.0V. Designers must ensure the current-limiting resistor is calculated based on this V_F to prevent exceeding the maximum current rating.

3.4 Relative Intensity vs. Forward Current

This curve demonstrates that light output is approximately linear with current in the normal operating range. Driving the LED beyond its maximum continuous current will increase brightness but at the cost of reduced lifetime and potential thermal damage.

3.5 Thermal Performance Curves

Relative Intensity vs. Ambient Temperature: Shows that luminous intensity decreases as ambient temperature increases. This thermal derating must be accounted for in designs where the LED operates in elevated temperature environments.
Forward Current vs. Ambient Temperature: Illustrates the relationship for a constant voltage drive. For stable light output, a constant current driver is strongly recommended over a constant voltage source with a series resistor.

4. Mechanical and Package Information

4.1 Package Dimensions

The LED features a standard 5mm round radial leaded package. Key dimensions include a lead spacing of 2.54mm (0.1\"), a typical overall height, and a lens diameter. The flange height is specified to be less than 1.5mm. All dimensional tolerances are ±0.25mm unless otherwise specified. The detailed mechanical drawing in the datasheet should be referenced for precise PCB footprint design.

4.2 Polarity Identification

The longer lead denotes the anode (positive), and the shorter lead denotes the cathode (negative). This is the standard convention for radial LEDs. The cathode lead may also be identified by a flat spot on the plastic lens base.

5. Soldering and Assembly Guidelines

5.1 Lead Forming

• Bending must occur at least 3mm from the epoxy bulb base to avoid stress on the internal die and wire bonds.
• Form leads before soldering.
• Avoid applying stress to the package. Ensure PCB hole alignment is precise to prevent forced insertion.
• Cut leads at room temperature.

5.2 Recommended Soldering Conditions

Hand Soldering: Iron tip temperature maximum 300°C (30W max), soldering time maximum 3 seconds, maintain minimum 3mm distance from solder joint to epoxy bulb.
Wave/DIP Soldering: Preheat temperature maximum 100°C (60 sec max), solder bath temperature maximum 260°C for 5 seconds, maintain minimum 3mm distance from solder joint to epoxy bulb. A recommended soldering profile graph is provided, emphasizing the importance of controlled ramp-up, peak temperature dwell, and controlled cooldown to minimize thermal shock.

5.3 Storage Conditions

LEDs should be stored at ≤30°C and ≤70% Relative Humidity. The storage life after shipment is 3 months. For longer storage (up to one year), use a sealed container with a nitrogen atmosphere and desiccant. Avoid rapid temperature changes in humid environments to prevent condensation.

5.4 Cleaning

If necessary, clean only with isopropyl alcohol at room temperature for no more than one minute. Avoid ultrasonic cleaning unless pre-qualified, as it can damage the internal structure.

6. Thermal Management and ESD Precautions

6.1 Heat Management

Proper thermal design is crucial. The operating current should be derated appropriately based on the ambient temperature, as indicated by the de-rating curve. Controlling the temperature around the LED in the application is necessary to ensure long-term reliability and maintain luminous output.

6.2 ESD (Electrostatic Discharge) Sensitivity

This product is sensitive to electrostatic discharge and surge voltage. Standard ESD handling precautions should be observed during assembly and handling, including the use of grounded workstations and wrist straps.

7. Packaging and Ordering Information

7.1 Packing Specification

The LEDs are packed in moisture-resistant, anti-static bags. The standard packing flow is: 200-500 pieces per bag → 5 bags per inner carton → 10 inner cartons per master (outside) carton.

7.2 Label Explanation

Labels on the packaging contain codes for traceability and binning:
P/N: Production Number.
CAT: Ranks of Luminous Intensity (brightness bin).
HUE: Ranks of Dominant Wavelength (color bin).
REF: Ranks of Forward Voltage (voltage bin).
LOT No: Manufacturing Lot Number for traceability.

8. Application Design Considerations

8.1 Circuit Design

Always use a series current-limiting resistor when driving from a voltage source. Calculate the resistor value using R = (V_supply - V_F) / I_F, where V_F is the typical or maximum forward voltage from the datasheet and I_F is the desired operating current (≤25mA). For optimal stability and longevity, consider using a dedicated constant-current LED driver IC, especially in applications with variable supply voltages or temperature.

8.2 PCB Layout

Ensure the PCB footprint matches the package dimensions exactly. Provide adequate clearance around the epoxy bulb to avoid shadowing or mechanical interference. For designs requiring multiple LEDs, maintain sufficient spacing to prevent thermal coupling between devices.

8.3 Optical Integration

The diffused lens provides a wide, soft light pattern suitable for indicator lights and panel illumination. For applications requiring more focused light, external lenses or light guides may be necessary. The yellow color is effective for attention-grabbing status indicators.

9. Technical Comparison and Differentiation

The 523-2UYD/S530-A3 differentiates itself through its combination of high typical luminous intensity (32 mcd at 20mA) and an extremely wide 180-degree viewing angle. Many standard 5mm LEDs offer narrower viewing angles (e.g., 30-60 degrees). This makes it superior for applications where visibility from a wide range of angles is critical. Its compliance with the latest environmental regulations (RoHS, REACH, Halogen-Free) also makes it suitable for modern electronic products with strict material requirements.

10. Frequently Asked Questions (FAQ)

Q: What is the difference between Peak Wavelength and Dominant Wavelength?
A: Peak Wavelength (λ_p) is the wavelength at which the emission spectrum has its maximum intensity. Dominant Wavelength (λ_d) is the single wavelength of monochromatic light that matches the perceived color of the LED. For this yellow LED, they are very close (591 nm vs. 589 nm typical).

Q: Can I drive this LED at its peak current of 60mA?
A: The peak forward current of 60mA is only rated for pulsed operation (duty cycle 1/10 at 1kHz). For continuous operation, you must not exceed the continuous forward current rating of 25mA. Exceeding this will significantly reduce lifetime and may cause immediate failure.

Q: How do the HUE, CAT, and REF codes affect my design?
A: These are binning codes. For consistent color and brightness across multiple units in an assembly, it is advisable to specify and use LEDs from a single bin or a tight bin combination. Mixing bins can lead to visible differences in color or brightness between adjacent LEDs.

Q: Is a heat sink required?
A> For operation at or below 25mA in ambient temperatures within the specified range, a dedicated heat sink is typically not required for a single LED. However, thermal management at the PCB level (e.g., copper pads) and current derating for high ambient temperatures are essential. For arrays or higher drive currents, thermal analysis is necessary.

11. Practical Design Case Study

Scenario: Designing a status indicator panel for a piece of industrial equipment. The panel needs multiple yellow indicator lights visible from various operator positions around the machine.
Solution: The 523-2UYD/S530-A3 is an excellent choice. Its 180-degree viewing angle ensures visibility from almost any angle. A constant current driver circuit set to 20mA is designed to power an array of these LEDs. The driver ensures consistent brightness even if the forward voltage (V_F) varies slightly between units or with temperature. The LEDs are mounted on the PCB with proper spacing, and the current-limiting is designed considering the maximum ambient temperature near the equipment's enclosure to ensure derating guidelines are followed, guaranteeing long-term reliability.

12. Operating Principle

This LED is based on an AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor chip. When a forward voltage exceeding the diode's threshold is applied, electrons and holes recombine in the active region of the semiconductor, releasing energy in the form of photons. The specific composition of the AlGaInP alloy determines the bandgap energy, which in turn defines the wavelength (color) of the emitted light—in this case, yellow. The diffused epoxy resin lens encapsulates the chip, providing mechanical protection, shaping the light output into a wide beam, and converting the point-source light into a more uniform, softened emission.

13. Technology Trends

While 5mm radial LEDs remain a staple for through-hole applications, the industry trend is strongly towards surface-mount device (SMD) packages like 0603, 0805, and 2835 for higher density PCB assembly. However, through-hole LEDs like the 523 series continue to be relevant in applications requiring higher single-point brightness, easier manual assembly/rework, or where robustness against vibration is a priority. Advances in AlGaInP and InGaN chip technology continue to improve the luminous efficacy (lumens per watt) and color consistency of LEDs across all package types. Furthermore, there is an increasing emphasis on full-spectrum characterization and tighter binning to meet the demands of applications requiring precise color rendering and uniformity.