LED Lamp 523-2UYD/S530-A3 Datasheet - 5mm Round - Voltage 2.0V - Brilliant Yellow - 60mW - English Technical Document

1. Product Overview

The 523-2UYD/S530-A3 is a high-brightness, through-hole LED lamp designed for general-purpose indicator applications. It utilizes AlGaInP chip technology to produce a brilliant yellow diffused light output. The device is characterized by its reliable performance, wide viewing angle, and compliance with major environmental directives including RoHS, REACH, and halogen-free requirements.

1.1 Core Advantages

• High Brightness: Specifically engineered for applications requiring higher luminous intensity.
• Wide Viewing Angle: A typical 120-degree half-intensity angle ensures good visibility from various perspectives.
• Environmental Compliance: The product is compliant with EU RoHS and REACH regulations. It is also halogen-free, with Bromine (Br) and Chlorine (Cl) content each below 900 ppm and their sum below 1500 ppm.
• Packaging Flexibility: Available on tape and reel for automated assembly processes.
• Robust Construction: Designed for reliable and long-lasting operation in typical electronic environments.

1.2 Target Market & Applications

This LED is primarily targeted at the consumer electronics and information technology sectors. Its key applications include status indicators, backlighting, and panel illumination in devices such as television sets, computer monitors, telephones, and general computer peripherals.

2. Technical Parameters: In-Depth Objective Analysis

The following section provides a detailed, objective breakdown of the LED's key technical specifications as defined in the datasheet. All values are specified at an ambient temperature (Ta) of 25°C unless otherwise noted.

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under or at these conditions is not guaranteed and should be avoided for reliable operation.

• Continuous Forward Current (I_F): 25 mA - The maximum DC current that can be continuously applied.
• Peak Forward Current (I_FP): 60 mA - Applicable only under pulsed conditions with a duty cycle of 1/10 at 1 kHz.
• Reverse Voltage (V_R): 5 V - The maximum voltage that can be applied in the reverse direction.
• Power Dissipation (P_d): 60 mW - The maximum power the device can dissipate.
• Operating Temperature (T_opr): -40°C to +85°C - The ambient temperature range for normal operation.
• Storage Temperature (T_stg): -40°C to +100°C.
• Soldering Temperature (T_sol): 260°C for 5 seconds - The maximum permissible temperature during wave or hand soldering.

2.2 Electro-Optical Characteristics

These parameters define the device's performance under typical operating conditions (I_F = 20 mA).

• Luminous Intensity (I_v): 12.5 mcd (Typical), 6.3 mcd (Minimum). This is the perceived brightness of the LED. The measurement uncertainty is ±10%.
• Viewing Angle (2θ_1/2): 120° (Typical). The angular span where the luminous intensity is at least half of the peak intensity.
• Peak Wavelength (λ_p): 591 nm (Typical). The wavelength at which the spectral emission is strongest.
• Dominant Wavelength (λ_d): 589 nm (Typical). The single wavelength perceived by the human eye, defining the color. Measurement uncertainty is ±1.0 nm.
• Spectrum Radiation Bandwidth (Δλ): 15 nm (Typical). The width of the emitted spectrum at half the peak intensity.
• Forward Voltage (V_F): 2.0 V (Typical), ranging from 1.7 V (Min) to 2.4 V (Max). Measurement uncertainty is ±0.1 V.
• Reverse Current (I_R): 10 μA (Maximum) at V_R = 5 V.

3. Binning System Explanation

The datasheet indicates the use of a binning system to categorize LEDs based on key performance variations. This ensures consistency within a production batch for critical design parameters. The labels referenced are:

• CAT: Ranks of Luminous Intensity (I_v). Groups LEDs by their measured brightness output.
• HUE: Ranks of Dominant Wavelength (λ_d). Groups LEDs by their precise color point.
• REF: Ranks of Forward Voltage (V_F). Groups LEDs by their voltage drop at a specified current.

Designers should consult specific binning information from the manufacturer for precise selection in color- or brightness-critical applications.

4. Performance Curve Analysis

The datasheet provides several characteristic curves that illustrate the device's behavior under varying conditions. These are essential for robust circuit design.

4.1 Relative Intensity vs. Wavelength

This curve shows the spectral power distribution, peaking around 591 nm (yellow) with a typical bandwidth of 15 nm, confirming the monochromatic nature of the AlGaInP chip.

4.2 Directivity Pattern

The polar plot illustrates the 120-degree typical viewing angle, showing a Lambertian-like emission pattern common for diffused LEDs, providing wide, even illumination.

4.3 Forward Current vs. Forward Voltage (I-V Curve)

This curve demonstrates the exponential relationship typical of a diode. At the recommended 20 mA operating point, the forward voltage is approximately 2.0V. The curve is crucial for designing the current-limiting resistor.

4.4 Relative Intensity vs. Forward Current

The luminous output increases super-linearly with current. While the device is rated for 25 mA continuous current, the light output at 20 mA is the characterized standard. Operating above 20 mA increases brightness but also power dissipation and junction temperature.

4.5 Thermal Characteristics

Two key curves are provided:
Relative Intensity vs. Ambient Temperature: Shows that luminous output decreases as ambient temperature increases. This is a critical de-rating factor for high-temperature environments.
Forward Current vs. Ambient Temperature: Implicitly relates to the need for current de-rating at high temperatures to maintain reliability and prevent accelerated lumen depreciation.

5. Mechanical & Package Information

5.1 Package Dimensions

The LED is a standard 5mm round, radial-leaded package. Key dimensional notes from the drawing include:

• All dimensions are in millimeters (mm).
• The height of the flange (the rim at the base of the dome) must be less than 1.5mm.
• The default tolerance for unspecified dimensions is ±0.25mm.
• The drawing specifies lead spacing, dome diameter and height, and lead length and diameter, which are standard for through-hole PCB mounting.

5.2 Polarity Identification

The cathode is typically identified by a flat spot on the rim of the LED's plastic flange and/or by the shorter lead. The anode is the longer lead. Correct polarity must be observed during installation.

6. Soldering & Assembly Guidelines

Proper handling is essential to prevent damage to the LED.

6.1 Lead Forming

• Bending must occur at least 3mm from the base of the epoxy bulb.
• Form leads before soldering.
• Avoid stressing the package. Misaligned PCB holes causing lead stress can degrade the epoxy resin.
• Cut leads at room temperature.

6.2 Soldering Process

Hand Soldering: Iron tip temperature max 300°C (for a 30W max iron), soldering time max 3 seconds. Maintain a 3mm minimum distance from the solder joint to the epoxy bulb.
Wave (DIP) Soldering: Preheat temperature max 100°C (for 60 sec max). Solder bath temperature max 260°C for 5 seconds. Maintain 3mm minimum distance.
General Rules: Avoid stress on leads during high temperature. Do not solder more than once. Protect the LED from shock until it cools to room temperature. Avoid rapid cooling. A recommended soldering temperature profile graph is provided, showing a gradual ramp-up, a peak of 260°C for 5 seconds, and a controlled ramp-down.

6.3 Cleaning

If necessary, clean only with isopropyl alcohol at room temperature for no more than one minute. Do not use ultrasonic cleaning unless its effects have been pre-qualified for the specific assembly, as ultrasonic energy can damage the LED structure.

6.4 Storage Conditions

After shipment, LEDs should be stored at ≤30°C and ≤70% Relative Humidity. The recommended storage life is 3 months. For longer storage (up to one year), use a sealed container with a nitrogen atmosphere and moisture absorbent.

7. Thermal Management & ESD

7.1 Heat Management

Proper thermal design is critical. The operating current should be de-rated appropriately based on the ambient temperature, referring to the de-rating curve. Controlling the temperature surrounding the LED in the application extends lifetime and maintains light output.

7.2 Electrostatic Discharge (ESD) Sensitivity

The product is sensitive to electrostatic discharge or surge voltage. Standard ESD precautions should be followed during handling and assembly, including the use of grounded workstations and wrist straps.

8. Packaging & Ordering Information

8.1 Packing Specification

The LEDs are packed in anti-static, moisture-resistant materials.

• Unit Pack: Minimum 200 to 500 pieces per anti-static bag.
• Inner Carton: 5 bags per inner carton.
• Master (Outside) Carton: 10 inner cartons per master carton.

8.2 Label Explanation

Labels on packaging contain the following information:

• CPN: Customer's Production Number.
• P/N: Production Number (manufacturer's part number).
• QTY: Packing Quantity.
• CAT/HUE/REF: Binning codes for Luminous Intensity, Dominant Wavelength, and Forward Voltage, respectively.
• LOT No: Traceable Lot Number.

9. Application Design Considerations

9.1 Circuit Design

A simple series resistor is required to limit the current through the LED. The resistor value (R) can be calculated using Ohm's Law: R = (V_supply - V_F) / I_F. Using the typical V_F of 2.0V and a desired I_F of 20 mA with a 5V supply: R = (5V - 2.0V) / 0.020A = 150 Ω. The resistor power rating should be I²R = (0.02)² * 150 = 0.06W, so a standard 1/8W or 1/4W resistor is sufficient.

9.2 PCB Layout

Ensure PCB hole diameters match the lead diameter with appropriate tolerance. Holes must be aligned to avoid stressing the leads during insertion. For best soldering results, follow the 3mm minimum distance rule from the epoxy bulb.

9.3 Brightness Consistency

For applications requiring uniform appearance across multiple indicators, specify tight bins for luminous intensity (CAT) and dominant wavelength (HUE) from the supplier.

10. Technical Comparison & Differentiation

The 523-2UYD/S530-A3 differentiates itself through its specific combination of attributes:

• Chip Technology: Uses AlGaInP, which is highly efficient for yellow, orange, and red colors compared to older technologies like GaAsP.
• Color & Brightness: Offers a "brilliant yellow" color with good luminous intensity (12.5 mcd typ) for a standard 5mm LED.
• Viewing Angle: The 120-degree wide viewing angle is superior to narrower-angle LEDs for applications where off-axis visibility is important.
• Compliance: Comprehensive environmental compliance (RoHS, REACH, Halogen-Free) is a key advantage for modern electronics manufacturing.

11. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED at its maximum continuous current of 25 mA?
A: Yes, but note that the electro-optical characteristics are specified at 20 mA. Operating at 25 mA will produce higher light output but also increase power dissipation (P_d = V_F * I_F) and junction temperature, which may affect long-term reliability and cause faster lumen depreciation. Always consider thermal management.

Q: What is the difference between Peak Wavelength and Dominant Wavelength?
A: Peak Wavelength (591 nm) is the physical peak of the light spectrum the LED emits. Dominant Wavelength (589 nm) is the single wavelength the human eye perceives the color to be, calculated from the full spectrum and the eye's sensitivity. Dominant wavelength is more relevant for color specification.

Q: How critical is the 3mm distance rule for soldering?
A> Very critical. Soldering closer than 3mm to the epoxy bulb can transfer excessive heat into the LED package, potentially damaging the semiconductor chip, degrading the epoxy lens, or breaking the internal wire bonds, leading to immediate or latent failure.

12. Design-in Case Study

Scenario: Designing a status indicator panel for a network router with four yellow LEDs.
Requirements: Consistent brightness and color, visible from a wide angle, reliable operation in an environment up to 60°C.
Design Steps:

1. Selection: The 523-2UYD/S530-A3 is chosen for its bright yellow output, 120° viewing angle, and -40 to +85°C operating range.
2. Binning: To ensure visual consistency, the order specifies tight bins for CAT (Luminous Intensity) and HUE (Dominant Wavelength).
3. Circuit Design: Using a 3.3V system supply, the current-limiting resistor is calculated: R = (3.3V - 2.0V) / 0.020A = 65 Ω (use 68 Ω standard value). Power: (0.02^2)*68 = 0.027W.
4. Thermal Consideration: At a 60°C ambient, the de-rating curve must be consulted. The drive current may need to be reduced below 20 mA to maintain lifetime, or the PCB layout should ensure the LEDs are not placed near other heat sources.
5. Assembly: PCB holes are drilled to specification. During wave soldering, the profile is set to match the recommended 260°C for 5 seconds, ensuring the LED bodies are not submerged beyond the 3mm point.

13. Technology Principle Introduction

The LED is based on an AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor chip. When a forward voltage is applied, electrons and holes recombine in the active region of the chip, releasing energy in the form of photons (light). The specific composition of the AlGaInP alloy determines the bandgap energy, which directly corresponds to the wavelength (color) of the emitted light—in this case, yellow (~589-591 nm). The chip is encapsulated in a diffused yellow epoxy resin. The diffusion particles in the resin scatter the light, creating the wide 120-degree viewing angle and a softer, more uniform appearance compared to a clear lens.

14. Industry Trends & Context

While surface-mount device (SMD) LEDs dominate new designs for their small size and suitability for automated pick-and-place assembly, through-hole LEDs like the 5mm round package remain relevant. Their demand persists in several areas: educational kits and prototyping due to ease of hand-soldering; applications requiring very high reliability and robust mechanical connections; legacy product maintenance and manufacturing; and situations where the larger lens size is beneficial for light output or viewing angle. The trend for such components is towards higher efficiency, greater brightness per unit input power, and stricter compliance with global environmental and material regulations, all of which are reflected in this datasheet's specifications.