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LED Lamp 583SURD/S530-A3 Datasheet - 5mm Round - Voltage 2.0V - Brilliant Red - 20mcd - English Technical Document

Complete technical datasheet for the 583SURD/S530-A3 LED lamp. Features include brilliant red color, 130-degree viewing angle, 20mcd luminous intensity, and RoHS/REACH compliance. Ideal for TV, monitor, and computer applications.
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PDF Document Cover - LED Lamp 583SURD/S530-A3 Datasheet - 5mm Round - Voltage 2.0V - Brilliant Red - 20mcd - English Technical Document

1. Product Overview

The 583SURD/S530-A3 is a high-brightness, through-hole LED lamp designed for applications requiring reliable and robust illumination. It utilizes an AlGaInP chip to produce a brilliant red color with a diffused red resin lens. The series is characterized by its availability in various viewing angles and packaging options, including tape and reel. It is compliant with environmental standards such as RoHS, EU REACH, and is halogen-free, making it suitable for modern electronic designs with strict regulatory requirements.

1.1 Core Advantages

1.2 Target Market & Applications

This LED is primarily targeted at consumer electronics and display backlighting markets. Its typical applications include:

2. Technical Parameter Deep Dive

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation at or near these limits is not recommended.

2.2 Electro-Optical Characteristics (Ta=25°C)

These parameters define the typical performance of the LED under standard test conditions (IF=20mA).

Measurement Tolerances: Forward Voltage (±0.1V), Luminous Intensity (±10%), Dominant Wavelength (±1.0nm).

3. Performance Curve Analysis

The datasheet provides several characteristic curves that are crucial for design engineers.

3.1 Relative Intensity vs. Wavelength

This curve shows the spectral power distribution, peaking at 632 nm (typical) with a bandwidth of approximately 20 nm, confirming the brilliant red color output.

3.2 Directivity Pattern

The radiation pattern illustrates the 130-degree viewing angle, showing how light intensity decreases from the center axis. This is important for understanding the illumination footprint.

3.3 Forward Current vs. Forward Voltage (I-V Curve)

This graph depicts the exponential relationship between current and voltage. The typical forward voltage is 2.0V at 20mA. Designers must use a current-limiting resistor based on this curve and their supply voltage.

3.4 Relative Intensity vs. Forward Current

This curve shows that light output increases with current but may not be perfectly linear, especially as current approaches the maximum rating. It informs decisions on drive current for desired brightness.

3.5 Temperature Dependence

Two key curves are provided: Relative Intensity vs. Ambient Temperature: Shows that luminous output decreases as ambient temperature increases. This is critical for thermal management in enclosed spaces. Forward Current vs. Ambient Temperature: Indicates how the forward voltage characteristic shifts with temperature, which can affect constant-current drive circuits.

4. Mechanical & Package Information

4.1 Package Dimension

The LED features a standard 5mm round radial leaded package. Key dimensions include: - Lead spacing: Approximately 2.54mm (standard) - Epoxy lens diameter: 5mm - Total height: Subject to flange height constraint (must be less than 1.5mm) - General tolerance: ±0.25mm unless otherwise specified.

Polarity Identification: The longer lead is the anode (+), and the shorter lead is the cathode (-). The flat side on the flange of the LED body may also indicate the cathode side.

5. Soldering & Assembly Guidelines

5.1 Lead Forming

5.2 Storage Conditions

5.3 Soldering Parameters

Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.

Hand Soldering: - Iron tip temperature: 300°C Max (30W Max iron) - Soldering time per lead: 3 seconds Max

Wave (DIP) Soldering: - Preheat temperature: 100°C Max (60 seconds Max) - Solder bath temperature & time: 260°C Max for 5 seconds Max

Critical Soldering Notes: - Avoid stress on leads at high temperatures. - Do not solder (dip or hand) more than once. - Protect the LED from mechanical shock/vibration until it cools to room temperature after soldering. - Avoid rapid cooling from peak temperature. - Use the lowest possible soldering temperature that achieves a reliable joint.

5.4 Cleaning

6. Application Design Considerations

6.1 Heat Management

LED performance and lifetime are highly dependent on junction temperature. - Consider heat dissipation during the PCB and system design phase. - De-rate the operating current appropriately based on the ambient temperature, referring to de-rating curves (implied, though not explicitly graphed in this datasheet). - Control the temperature surrounding the LED in the final application.

6.2 ESD (Electrostatic Discharge) Protection

The LED die is sensitive to electrostatic discharge and surge voltages, which can cause immediate or latent damage. - Implement standard ESD handling protocols during assembly (e.g., grounded workstations, wrist straps). - Consider circuit protection (e.g., transient voltage suppression diodes) in the application if the LED is exposed to potential voltage spikes.

6.3 Current Driving

Always drive LEDs with a constant current or a voltage source with a series current-limiting resistor. The resistor value (R) can be calculated using: R = (Vsupply - VF) / IF. Using the typical VF of 2.0V and a desired IF of 20mA with a 5V supply: R = (5V - 2.0V) / 0.02A = 150 Ω. Choose the nearest standard value and ensure the resistor's power rating is sufficient (P = I2R).

7. Packaging & Ordering Information

7.1 Packing Specification

The LEDs are packed to prevent damage from moisture and electrostatic discharge. - Primary Packing: Anti-electrostatic bags. - Secondary Packing: Inner cartons containing multiple bags. - Tertiary Packing: Outside cartons containing multiple inner cartons.

Packing Quantity: - Minimum 200 to 500 pieces per anti-static bag. - 4 bags per inner carton. - 10 inner cartons per outside carton.

7.2 Label Explanation

Labels on packaging contain critical information for traceability and binning: - CPN: Customer's Production Number - P/N: Production Number (e.g., 583SURD/S530-A3) - QTY: Packing Quantity - CAT: Ranks of Luminous Intensity (Brightness bin) - HUE: Ranks of Dominant Wavelength (Color bin) - REF: Ranks of Forward Voltage (Voltage bin) - LOT No: Manufacturing Lot Number for traceability

8. Technical Comparison & Differentiation

While a direct comparison with other part numbers is not provided in this single datasheet, the 583SURD/S530-A3 can be evaluated based on its stated specifications: - Brightness: With a typical 20mcd at 20mA, it offers good output for a standard 5mm red LED. - Viewing Angle: The 130-degree angle is wider than some alternatives, providing a broader emission pattern suitable for indicator and backlighting applications. - Compliance: Full RoHS, REACH, and halogen-free compliance is a significant advantage for products targeting global markets with strict environmental regulations. - Reliability: The robust construction and detailed handling/soldering guidelines suggest a design focused on long-term reliability.

9. Frequently Asked Questions (FAQ)

9.1 What is the difference between peak wavelength and dominant wavelength?

Peak wavelength (632 nm) is the wavelength at which the emitted optical power is maximum. Dominant wavelength (624 nm) is the single wavelength perceived by the human eye that matches the color of the LED. Dominant wavelength is more relevant for color specification.

9.2 Can I drive this LED at 30mA for more brightness?

No. The Absolute Maximum Rating for continuous forward current is 25 mA. Exceeding this rating can cause irreversible damage, reduce lifetime, or lead to catastrophic failure. Always operate within the specified limits.

9.3 Why is the storage condition important?

The epoxy resin used in the LED package can absorb moisture from the air. During the high-temperature soldering process, this trapped moisture can rapidly expand, causing internal delamination or cracking (\"popcorning\"), which destroys the LED. Proper storage controls moisture absorption.

9.4 How do I interpret the \"CAT,\" \"HUE,\" and \"REF\" codes on the label?

These are binning codes. Due to manufacturing variations, LEDs are sorted (binned) after production. \"CAT\" indicates the brightness range (e.g., 15-20mcd, 20-25mcd). \"HUE\" indicates the color/wavelength range. \"REF\" indicates the forward voltage range. Using LEDs from the same bin ensures consistency in brightness and color across your product.

10. Design-in Case Study Example

Scenario: Designing a status indicator panel for a network router with five identical red LED indicators.

  1. Component Selection: The 583SURD/S530-A3 is chosen for its brightness, wide viewing angle (good for panel viewing), and compliance with environmental standards required for the global market.
  2. Circuit Design: The router's internal logic supply is 3.3V. Using the typical VF of 2.0V and a target IF of 15mA (for long life and lower heat), the series resistor is calculated: R = (3.3V - 2.0V) / 0.015A ≈ 86.7 Ω. A standard 91 Ω resistor is selected, resulting in IF ≈ 14.3mA.
  3. PCB Layout: LEDs are placed with proper polarity markings. A minimum 3mm clearance is maintained between the planned solder joint on the lead and the LED body footprint. Thermal relief pads are not strictly necessary for low current but are used for easier soldering.
  4. Assembly: LEDs are stored in a controlled environment before use. During wave soldering, the specified profile (preheat to 100°C, 260°C peak for 5s) is strictly followed. The board is allowed to cool gradually without forced air.
  5. Result: The panel provides uniform, bright red indicators with consistent color and intensity across all five LEDs, thanks to specifying tight binning codes (e.g., same HUE and CAT) during procurement.

11. Technology Principle Introduction

The 583SURD/S530-A3 is based on an AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor chip. When a forward voltage is applied across the p-n junction, electrons and holes recombine, releasing energy in the form of photons. The specific composition of the AlGaInP alloy determines the bandgap energy, which directly corresponds to the wavelength (color) of the emitted light—in this case, red (~624-632 nm). The diffused red epoxy resin lens serves to protect the chip, shape the radiation pattern (130-degree viewing angle), and enhance the color saturation by acting as a filter. This through-hole package is a mature and cost-effective technology for applications where surface-mount devices (SMDs) are not required.

12. Industry Trends & Context

While surface-mount device (SMD) LEDs dominate new designs for their smaller size and suitability for automated pick-and-place assembly, through-hole LEDs like the 5mm round package remain relevant. Their key advantages include superior heat dissipation via longer leads (beneficial for higher power versions), ease of manual prototyping and repair, and robustness in high-vibration environments. The trend within this segment is towards higher efficiency (more light output per mA), stricter environmental compliance (halogen-free, lower carbon footprint), and tighter binning for color and brightness consistency, all of which are reflected in the specifications of this component. They continue to be widely used in industrial equipment, automotive interiors, appliances, and consumer electronics where their specific benefits are valued.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.