LED Lamp 583SYGD/S530-E2 Datasheet - Brilliant Yellow Green - 20mA - 5mcd - English Technical Document

1. Product Overview

The 583SYGD/S530-E2 is a high-brightness LED lamp component designed for applications requiring reliable and robust illumination. It emits a brilliant yellow-green light, achieved through an AlGaInP chip encapsulated in a green diffused resin. This series offers a choice of various viewing angles and is available in tape and reel packaging for automated assembly processes.

The product is compliant with key environmental and safety regulations, including the EU RoHS directive, EU REACH, and halogen-free requirements (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm), ensuring its suitability for modern electronic manufacturing.

1.1 Core Advantages and Target Market

The primary advantages of this LED include its high luminous intensity for its class, a very wide 170-degree viewing angle for broad illumination, and consistent performance. Its design prioritizes reliability under standard operating conditions. The target applications are primarily in consumer electronics backlighting, including television sets, computer monitors, telephones, and general computing equipment where consistent, colored indicator or backlighting is required.

2. Technical Parameter Analysis

This section provides a detailed, objective interpretation of the key electrical, optical, and thermal parameters specified in the datasheet. Understanding these values is critical for proper circuit design and ensuring long-term reliability.

2.1 Absolute Maximum Ratings

The Absolute Maximum Ratings define the stress limits beyond which permanent damage to the device may occur. These are not conditions for normal operation.

• Continuous Forward Current (IF): 25 mA. Exceeding this current continuously will generate excessive heat, degrading the LED's internal structure and luminous output.
• Peak Forward Current (IFP): 60 mA (at 1/10 duty cycle, 1 kHz). This rating allows for short current pulses, useful for multiplexing or PWM dimming schemes, but the average current must remain within the continuous rating.
• Reverse Voltage (VR): 5 V. Applying a reverse voltage greater than this can cause immediate junction breakdown. Circuit protection (e.g., a series diode) is recommended if reverse bias is possible.
• Power Dissipation (Pd): 60 mW. This is the maximum power the package can dissipate as heat at 25°C ambient. Actual usable dissipation decreases as ambient temperature rises.
• Operating & Storage Temperature: -40°C to +85°C (Operating), -40°C to +100°C (Storage). These define the environmental limits for functionality and non-operational storage.
• Soldering Temperature (Tsol): 260°C for 5 seconds. This is critical for PCB assembly, defining the maximum thermal profile the LED can withstand during reflow or hand soldering.

2.2 Electro-Optical Characteristics

These characteristics are measured at Ta=25°C and IF=20mA unless otherwise stated. They represent the typical performance expected from the device.

• Luminous Intensity (Iv): 2.5 mcd (Min), 5 mcd (Typ). This is the measure of perceived light output in the direction of peak intensity. The minimum value is guaranteed, while the typical is the average from production.
• Viewing Angle (2θ1/2): 170° (Typ). This exceptionally wide angle indicates the LED emits light over nearly a full hemisphere, making it suitable for applications requiring wide-area, diffuse illumination rather than a focused beam.
• Peak Wavelength (λp): 575 nm (Typ). The wavelength at which the spectral power distribution is maximum. For this yellow-green LED, it falls in the 575nm region.
• Dominant Wavelength (λd): 573 nm (Typ). This is the single wavelength perceived by the human eye, which may differ slightly from the peak wavelength. The datasheet notes a measurement uncertainty of ±1.0nm.
• Spectrum Radiation Bandwidth (Δλ): 20 nm (Typ). This defines the spectral width (Full Width at Half Maximum) of the emitted light, indicating color purity.
• Forward Voltage (VF): 1.7V (Min), 2.0V (Typ), 2.4V (Max) at 20mA. This is the voltage drop across the LED when operating. Circuit designs must account for the maximum VF to ensure sufficient drive voltage. A current-limiting resistor or constant-current driver is essential.
• Reverse Current (IR): 10 μA (Max) at VR=5V. This is the leakage current when the device is reverse-biased at its maximum rating.

3. Binning System Explanation

The datasheet references a labeling system that includes ranks for key parameters, indicating the product is sorted (binned) post-manufacturing.

• CAT: Ranks of Luminous Intensity. LEDs are grouped based on measured light output.
• HUE: Ranks of Dominant Wavelength. LEDs are sorted into groups based on their precise color point (e.g., 573nm ± a few nm).
• REF: Ranks of Forward Voltage. LEDs are binned according to their Vf to ensure consistent behavior in parallel circuits or for voltage matching.

For precise color and brightness matching in an application, specifying or understanding the bin codes is necessary.

4. Performance Curve Analysis

The provided graphs offer deeper insight into the LED's behavior under varying conditions.

4.1 Relative Intensity vs. Wavelength

This spectral distribution curve shows the light output as a function of wavelength, centered around 575nm with a typical bandwidth of 20nm. It confirms the monochromatic nature of the light output.

4.2 Directivity Pattern

The radiation pattern graph illustrates the 170-degree viewing angle, showing how intensity decreases from the center (0 degrees). The pattern is typical of a lamp-style LED with a diffused lens, providing very wide, even illumination.

4.3 Forward Current vs. Forward Voltage (I-V Curve)

This curve shows the exponential relationship between current and voltage. The knee voltage is around 1.7V-2.0V. Operating above this knee, the Vf increases only slightly with large increases in current, highlighting why LEDs are best driven by a current source rather than a voltage source.

4.4 Relative Intensity vs. Forward Current

This graph demonstrates the LED's light output (relative intensity) increases with forward current. However, it is not perfectly linear, and efficiency may drop at very high currents due to increased heat. Operating at or below the recommended 20mA ensures optimal performance and longevity.

4.5 Thermal Performance Curves

Relative Intensity vs. Ambient Temperature: Shows that light output decreases as the ambient temperature increases. This is a key characteristic of LEDs; thermal management is crucial to maintain brightness.
Forward Current vs. Ambient Temperature: Likely illustrates the need for current derating at high temperatures to prevent exceeding the maximum junction temperature and to maintain reliability. The datasheet emphasizes that heat management must be considered during the design stage.

5. Mechanical and Package Information

The package is a standard 5mm round LED lamp format. Key dimensional notes include:
- All dimensions are in millimeters.
- The height of the flange must be less than 1.5mm.
- General tolerance is ±0.25mm unless otherwise specified.
The dimension drawing provides critical measurements for PCB footprint design, including lead spacing (2.54mm typical), lens diameter, and overall height. Proper hole alignment is stressed to avoid mounting stress.

6. Soldering and Assembly Guidelines

Detailed procedures are provided to ensure assembly does not damage the LED.

6.1 Lead Forming

• Bend leads at a point at least 3mm from the epoxy bulb base.
• Perform forming before soldering.
• Avoid stressing the package; misaligned PCB holes can cause stress and resin cracking.
• Cut leads at room temperature.

6.2 Storage

• Store at ≤30°C and ≤70% RH after receipt. Shelf life is 3 months under these conditions.
• For longer storage (up to 1 year), use a sealed container with nitrogen and desiccant.
• Avoid rapid temperature changes in humid environments to prevent condensation.

6.3 Soldering Process

Critical Rule: Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.

Hand Soldering: Iron tip temperature max 300°C (for a 30W max iron), soldering time max 3 seconds.

Wave/DIP Soldering: Preheat max 100°C for 60 sec max. Solder bath temperature max 260°C for 5 seconds max.

A recommended soldering profile graph is provided, emphasizing a controlled ramp-up, peak temperature dwell, and controlled cool-down. A rapid cooling process is not recommended. Soldering (dip or hand) should not be performed more than once. Avoid mechanical shock while the LED is hot.

6.4 Cleaning

If necessary, clean only with isopropyl alcohol at room temperature for ≤1 minute. Do not use ultrasonic cleaning unless pre-qualified, as it can damage the internal structure.

6.5 Heat Management

The datasheet explicitly states that heat management must be considered during design. The operating current should be derated based on the ambient temperature, referring to the derating curve. Controlling the temperature around the LED is essential for maintaining light output and device lifetime.

6.6 ESD (Electrostatic Discharge) Precautions

The LED is sensitive to ESD and surge voltage, which can damage the die. Proper ESD handling procedures (grounded workstations, wrist straps) must be used during assembly and handling.

7. Packaging and Ordering Information

The LEDs are packaged to protect from electrostatic discharge and moisture.

• Packing Materials: Anti-static bag, placed inside an inner carton, which is then packed into an outside carton.
• Packing Quantity: Minimum 200 to 500 pieces per bag. 5 bags per inner carton. 10 inner cartons per outside carton (total: 10,000 to 25,000 pieces per master carton, depending on bag count).
• Label Explanation: Labels include CPN (Customer Part Number), P/N (Manufacturer Part Number), QTY, CAT (Intensity bin), HUE (Wavelength bin), REF (Voltage bin), and LOT No.

8. Application Suggestions and Design Considerations

Typical Applications: Backlighting for TV sets, monitors, telephones, and computers where a yellow-green indicator or aesthetic lighting is needed. The wide viewing angle makes it suitable for panel lighting where even illumination is desired.

Design Considerations:
1. Drive Circuit: Always use a series current-limiting resistor or a constant-current driver. Calculate the resistor value based on the supply voltage (Vs), the maximum forward voltage (Vf_max), and the desired current (I_f, e.g., 20mA): R = (Vs - Vf_max) / I_f.
2. Thermal Design: Ensure the PCB and surrounding area allow for heat dissipation, especially if multiple LEDs are used or if the ambient temperature is high. Consider using a heatsink or thermally conductive materials if necessary.
3. Optical Design: The diffused lens provides wide, soft light. For more focused light, an external secondary optic would be required.
4. Reliability: Adhere strictly to the absolute maximum ratings and soldering guidelines. Operating below the recommended 20mA can significantly extend operational lifetime.

9. Technical Comparison and Differentiation

While a direct competitor comparison is not in the datasheet, key differentiators of this part can be inferred:
- Very Wide Viewing Angle (170°): Broader than many standard 5mm LEDs, offering more diffuse light.
- Environmental Compliance: Full RoHS, REACH, and Halogen-Free compliance is explicitly stated, which is critical for modern electronics.
- Detailed Application Notes: The datasheet provides extensive guidance on soldering, storage, and handling, which supports design for manufacturability and reliability.

10. Frequently Asked Questions (FAQ)

Q: Can I drive this LED at 30mA for more brightness?
A: No. The Absolute Maximum Rating for continuous forward current is 25mA. Exceeding this risks permanent damage and reduced lifetime. Operate at or below the test condition of 20mA for reliable performance.

Q: What resistor do I need for a 5V supply?
A: Using the maximum Vf of 2.4V and a target current of 20mA: R = (5V - 2.4V) / 0.02A = 130 Ohms. Use the next standard value (e.g., 150 Ohms) for a slightly safer current. Always verify actual current in circuit.

Q: Can I use this for outdoor applications?
A: The operating temperature range is -40°C to +85°C, which covers many outdoor conditions. However, the package is not specifically rated for waterproofing or UV resistance. For outdoor use, additional environmental protection (conformal coating, sealed enclosure) would be necessary.

Q: Why is the storage condition so specific (3 months)?
A>LED packages can absorb moisture from the air. During high-temperature soldering, this trapped moisture can vaporize rapidly and cause internal delamination or cracking (\"popcorning\"). The 3-month shelf life is based on typical moisture sensitivity level (MSL) ratings. For longer storage, the dry-bag method is prescribed.

11. Practical Design and Usage Case

Case: Designing a Status Indicator Panel: A designer needs multiple uniform yellow-green indicators on a control panel. They select the 583SYGD/S530-E2 for its color and wide viewing angle. To ensure consistency, they work with the supplier to procure LEDs from the same manufacturing lot and specific HUE and CAT bins. On the PCB, they place the LEDs with the recommended footprint, ensuring holes are aligned to prevent lead stress. They use a constant-current driver IC set to 18mA (slightly below the 20mA spec) to maximize longevity and minimize thermal stress. During assembly, they follow the hand-soldering guidelines, using a temperature-controlled iron. The result is a panel with bright, uniform, and reliable indicators.

12. Operating Principle Introduction

Light Emitting Diodes (LEDs) are semiconductor devices that emit light when an electric current passes through them. This phenomenon is called electroluminescence. In the 583SYGD/S530-E2, the active region is made of an Aluminum Gallium Indium Phosphide (AlGaInP) compound semiconductor. When a forward voltage is applied, electrons and holes are injected into the active region from opposite sides of the p-n junction. When these charge carriers recombine, they release energy in the form of photons (light). The specific composition of the AlGaInP alloy determines the bandgap energy, which in turn dictates the wavelength (color) of the emitted light—in this case, yellow-green (~573-575nm). The green diffused epoxy resin package acts as both a protective enclosure and a lens, shaping the light output into the characteristic wide beam pattern.

13. Technology Trends and Context

The 5mm LED lamp format, like the 583SYGD/S530-E2, represents a mature and widely used through-hole technology. Current trends in the LED industry are heavily focused on surface-mount device (SMD) packages (e.g., 2835, 3535, 5050) for their smaller size, better thermal performance via PCB pads, and suitability for high-speed automated pick-and-place assembly. However, through-hole LEDs remain relevant for applications requiring higher individual component robustness, easier manual prototyping, repair, or in situations where the larger lens size is optically beneficial. The emphasis in datasheets like this one on halogen-free materials and comprehensive environmental compliance reflects the broader industry trend towards greener electronics and stricter supply chain regulations. Furthermore, the detailed thermal and reliability guidance indicates an industry-wide focus on maximizing LED lifetime and performance through proper application design, which is critical as LEDs penetrate more demanding applications beyond simple indicators.