LED Lamp Array A264B/SYG/S530-E2 Datasheet - Brilliant Yellow Green - 20mA - English Technical Document

1. Product Overview

The A264B/SYG/S530-E2 is a low-power, high-efficiency LED lamp array designed for indicator applications. It consists of a plastic holder that allows for flexible combinations of individual LED lamps. This modular and stackable design offers significant advantages in terms of assembly flexibility and space utilization on printed circuit boards (PCBs) or panels.

1.1 Core Advantages

• Low Power Consumption & High Efficiency: Optimized for energy-sensitive applications.
• Design Flexibility: The array format allows for easy combination of different colored lamps to create custom indicator patterns.
• Ease of Assembly: Features a good locking mechanism and is designed for straightforward mounting.
• Stackable Configuration: Can be stacked both vertically and horizontally, enabling compact and dense layouts.
• Versatile Mounting: Suitable for direct mounting on PCBs or panels.
• Environmental Compliance: The product is Pb-free, compliant with RoHS and EU REACH regulations, and meets halogen-free standards (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm).

1.2 Target Applications

Primarily used as status or function indicators in various electronic instruments and equipment. Typical applications include indicating operational modes, degrees, positions, or specific functions where clear visual signaling is required.

2. Technical Specifications Deep Dive

2.1 Device Selection

The specific part number 264-10SYGD/S530-E2-L utilizes an AlGaInP chip material to produce a Brilliant Yellow Green color. The resin color is green diffused, which helps in achieving a wider viewing angle and softer light emission.

2.2 Absolute Maximum Ratings (Ta=25°C)

These ratings define the limits beyond which permanent damage to the device may occur. Operation under or at these conditions is not guaranteed.

• Continuous Forward Current (I_F): 25 mA
• Peak Forward Current (I_FP): 60 mA (Duty 1/10 @ 1kHz)
• Reverse Voltage (V_R): 5 V
• Power Dissipation (P_d): 60 mW
• Operating Temperature (T_opr): -40 to +85 °C
• Storage Temperature (T_stg): -40 to +100 °C
• Soldering Temperature (T_sol): 260 °C for 5 seconds (wave or reflow)

2.3 Electro-Optical Characteristics (Ta=25°C)

These are the typical performance parameters measured under specified test conditions (I_F=20mA unless noted).

• Forward Voltage (V_F): 1.7V (Min), 2.0V (Typ), 2.4V (Max)
• Reverse Current (I_R): 10 µA Max (V_R=5V)
• Luminous Intensity (I_V): 25 mcd (Min), 50 mcd (Typ)
• Viewing Angle (2θ_1/2): 60 deg (Typ)
• Peak Wavelength (λ_p): 575 nm (Typ)
• Dominant Wavelength (λ_d): 573 nm (Typ)
• Spectrum Radiation Bandwidth (Δλ): 20 nm (Typ)

3. Performance Curve Analysis

The datasheet provides several key graphs for design analysis. While the exact curves cannot be reproduced here, their implications are critical.

3.1 Relative Intensity vs. Wavelength

This curve shows the spectral power distribution, peaking around 575 nm (yellow-green). The 20 nm typical bandwidth indicates a relatively pure color emission.

3.2 Directivity Pattern

The 60-degree viewing angle (2θ_1/2) is confirmed by this curve, showing the angular distribution of light intensity. It depicts a typical Lambertian or near-Lambertian pattern common for diffused LEDs.

3.3 Forward Current vs. Forward Voltage (I-V Curve)

This graph is essential for driver design. It shows the exponential relationship between current and voltage. The typical V_F of 2.0V at 20mA is a key operating point. Designers must use current-limiting resistors or constant-current drivers based on this curve to ensure stable operation.

3.4 Relative Intensity vs. Forward Current

This curve demonstrates the light output's dependence on drive current. While intensity generally increases with current, it may become sub-linear at higher currents due to efficiency droop and thermal effects, emphasizing the need for proper current management.

3.5 Temperature Dependence

Two graphs analyze thermal effects:
Relative Intensity vs. Ambient Temperature: Shows how light output decreases as temperature rises. This is crucial for applications in high-temperature environments.
Forward Current vs. Ambient Temperature: Likely illustrates the necessary current de-rating to maintain reliability or a specific performance level as temperature increases.

4. Mechanical and Package Information

4.1 Package Dimensions

The datasheet includes a detailed dimensional drawing. Key notes specify that all dimensions are in millimeters with a standard tolerance of ±0.25mm unless otherwise stated. Lead spacing is measured at the point where the leads emerge from the package body, which is critical for PCB footprint design.

4.2 Polarity Identification

Typically for LED arrays, the cathode (negative) lead is identified by a flat spot on the plastic holder, a shorter lead, or a specific marking on the body. The exact method should be cross-referenced with the dimensional drawing.

5. Soldering and Assembly Guidelines

Proper handling is vital for reliability.

5.1 Lead Forming

• Bend leads at a point at least 3mm from the epoxy bulb base.
• Perform forming before soldering.
• Avoid stressing the package; misalignment during PCB mounting can cause damage.

5.2 Storage

• Store at ≤ 30°C and ≤ 70% RH. Shelf life is 3 months from shipment.
• For longer storage (up to 1 year), use a sealed container with nitrogen and desiccant.
• Avoid rapid temperature changes in humid environments to prevent condensation.

5.3 Soldering Process

Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.

• Hand Soldering: Iron tip temperature ≤ 300°C (30W max), soldering time ≤ 3 seconds.
• Dip/Wave Soldering: Preheat ≤ 100°C (60 sec max), solder bath ≤ 260°C for ≤ 5 seconds.
• Avoid stress on leads during high-temperature phases.
• Do not solder more than once.
• Allow LEDs to cool gradually to room temperature after soldering, protecting them from shock.

5.4 Cleaning

• Use isopropyl alcohol at room temperature for ≤ 1 minute if necessary.
• Avoid ultrasonic cleaning unless pre-qualified, as it can damage the LED structure.

5.5 Heat Management

Although a low-power device, proper thermal design in the application is necessary. Current should be de-rated appropriately at higher ambient temperatures, as indicated in the performance curves, to ensure long-term reliability and maintain light output.

6. Packaging and Ordering Information

6.1 Packing Specification

The LEDs are packed in moisture-resistant, anti-static materials to protect against electrostatic discharge (ESD) and environmental humidity.

• Packing Quantity: 250 pieces per anti-static bag. 6 bags per inner carton. 10 inner cartons per master (outside) carton. Total: 15,000 pieces per master carton.

6.2 Label Explanation

Labels on the packaging contain key information for traceability and verification:

• CPN: Customer's Part Number
• P/N: Manufacturer's Part Number
• QTY: Quantity
• CAT/Ranks: Binning category (e.g., for luminous intensity or wavelength)
• HUE: Dominant Wavelength
• REF: Forward Voltage range
• LOT No: Manufacturing Lot Number for traceability

7. Application Suggestions and Design Considerations

7.1 Typical Application Circuits

For standard 5V or 3.3V logic systems, a series current-limiting resistor is mandatory. The resistor value (R) can be calculated using Ohm's Law: R = (V_supply - V_F) / I_F. Using the typical V_F of 2.0V and a desired I_F of 20mA with a 5V supply: R = (5V - 2.0V) / 0.020A = 150 Ω. A resistor with a power rating of at least (5V-2.0V)*0.02A = 0.06W is sufficient.

7.2 Design for Stacking

When designing PCBs for vertically or horizontally stacked arrays, ensure the mechanical drawings are followed precisely for pin alignment and spacing. Account for potential shadowing or light blocking in stacked configurations.

7.3 Visibility and Contrast

The brilliant yellow-green color (573-575 nm) is highly visible to the human eye. Consider the surrounding panel color and ambient lighting conditions to ensure optimal contrast. The diffused lens provides a wide viewing angle suitable for panels viewed from various angles.

8. Technical Comparison and Differentiation

While a direct comparison with other part numbers is not in this datasheet, the A264B/SYG/S530-E2's key differentiators are its array format and stackability. Unlike single discrete LEDs, this product simplifies the assembly of multi-indicator clusters, reduces part count, and ensures consistent spacing and alignment. Its compliance with modern environmental standards (RoHS, REACH, Halogen-Free) is also a significant advantage for global markets.

9. Frequently Asked Questions (Based on Technical Parameters)

9.1 What is the difference between Peak and Dominant Wavelength?

Peak Wavelength (λ_p): The wavelength at which the emitted optical power is maximum (575 nm Typ). Dominant Wavelength (λ_d): The single wavelength perceived by the human eye that matches the color of the LED (573 nm Typ). They are often close but not identical, especially for saturated colors.

9.2 Can I drive this LED at its maximum continuous current of 25mA?

While you can operate it at 25mA, it is at the absolute maximum rating. For improved long-term reliability and to account for potential temperature rises in the application, driving at the typical condition of 20mA or lower is strongly recommended. Always refer to the de-rating guidelines based on ambient temperature.

9.3 Why is the 3mm distance from the solder joint to the bulb so important?

This distance prevents excessive heat from the soldering process from traveling up the lead and damaging the internal semiconductor die or the epoxy encapsulant, which could lead to premature failure or discoloration of the lens.

10. Practical Use Case Example

Scenario: Multi-Function Status Indicator for a Network Router
A designer needs to indicate Power, Internet Connection, Wi-Fi Activity, and LAN port status. Instead of sourcing and placing four separate LEDs, they can use two A264B arrays stacked vertically. Each array can hold two lamps. By populating the arrays with different colored LEDs (e.g., Green for Power, Yellow-Green for Internet, etc.), they create a compact, aligned bank of indicators. The stackable feature ensures a clean, professional look with minimal board space and simplified assembly compared to discrete components.

11. Operating Principle

The LED operates on the principle of electroluminescence in a semiconductor. When a forward voltage is applied across the p-n junction (exceeding the forward voltage V_F), electrons and holes recombine in the active region (made of AlGaInP material in this case). This recombination releases energy in the form of photons (light). The specific composition of the AlGaInP semiconductor determines the bandgap energy, which directly defines the wavelength (color) of the emitted light, in this case, yellow-green. The diffused epoxy lens encapsulates the chip, provides mechanical protection, and shapes the light output beam.

12. Technology Trends

Indicator LEDs continue to evolve towards higher efficiency (more light output per mA), lower power consumption, and smaller package sizes. There is also a strong trend towards broader adoption of environmentally friendly materials and manufacturing processes, as evidenced by this product's compliance with RoHS, REACH, and halogen-free standards. The concept of modular, stackable arrays aligns with the industry's push for design simplification and manufacturing efficiency, allowing for more complex indicator schemes without proportionally increasing assembly complexity.