LED Lamp Array A264B/SUR/S530-A3 Datasheet - Brilliant Red - 20mA - 125mcd - English Technical Document

1. Product Overview

The A264B/SUR/S530-A3 is a discrete LED lamp array component designed for use as a status or function indicator in various electronic instruments and equipment. It is constructed using a plastic holder that allows for the combination of individual lamps, providing a versatile solution for panel mounting.

1.1 Core Features and Advantages

The product offers several key advantages for design engineers:

• Low Power Consumption: Designed for efficient operation, minimizing the power draw of indicator circuits.
• High Efficiency and Low Cost: Provides a cost-effective solution for visual indication with good luminous output.
• Design Flexibility: Offers good control and free combinations of LED lamp colors within the array format.
• Ease of Assembly: Features a design that is easy to lock into place and assemble. The array is stackable both vertically and horizontally, offering layout versatility.
• Versatile Mounting: Can be mounted on printed circuit boards (PCBs) or directly onto panels.
• Environmental Compliance: The product is compliant with RoHS (Restriction of Hazardous Substances), EU REACH regulations, and is Halogen Free (with limits of Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm).

1.2 Target Applications

This LED lamp array is primarily intended for use as an indicator to show status, degree, function, position, or other parameters within electronic instruments and devices. Its typical applications include control panels, test equipment, industrial machinery interfaces, and consumer electronics where clear visual feedback is required.

2. Technical Parameter Deep Dive

2.1 Device Selection and Material Composition

The specific part number detailed in this datasheet is 264-10SURD/S530-A3-L. The key material specifications are:

• Chip Material: AlGaInP (Aluminum Gallium Indium Phosphide). This semiconductor material is commonly used for producing high-brightness red, orange, and yellow LEDs.
• Emitted Color: Brilliant Red.
• Resin Color: Red Diffused. The diffused lens helps to widen the viewing angle and soften the light output.

2.2 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. All values are specified at an ambient temperature (Ta) of 25°C.

• Continuous Forward Current (I_F): 25 mA. This is the maximum DC current that can be applied continuously.
• Peak Forward Current (I_FP): 60 mA. This is the maximum pulsed current, allowable under a duty cycle of 1/10 at a frequency of 1 kHz.
• Reverse Voltage (V_R): 5 V. Exceeding this voltage in reverse bias can damage the LED junction.
• Power Dissipation (P_d): 60 mW. The maximum power the device can dissipate.
• Operating Temperature (T_opr): -40°C to +85°C. The ambient temperature range for normal operation.
• Storage Temperature (T_stg): -40°C to +100°C.
• Soldering Temperature (T_sol): 260°C for 5 seconds. This defines the reflow soldering profile tolerance.

2.3 Electro-Optical Characteristics

These are the typical performance parameters measured at Ta=25°C and a standard test current of I_F=20mA, unless otherwise noted.

• Forward Voltage (V_F): 1.7V (Min), 2.0V (Typ), 2.4V (Max). The voltage drop across the LED when conducting 20mA.
• Reverse Current (I_R): 10 µA (Max) at V_R=5V. A very low leakage current in the off state.
• Luminous Intensity (I_V): 63 mcd (Min), 125 mcd (Typ). This is the measure of the perceived power of the visible light emitted. The typical value of 125 millicandelas is suitable for many indicator applications.
• Viewing Angle (2θ_1/2): 60° (Typ). This is the full angle at which the luminous intensity is half of the peak intensity (measured at 0°). A 60° angle provides a reasonably wide viewing cone.
• Peak Wavelength (λ_p): 632 nm (Typ). The wavelength at which the optical output power is maximum.
• Dominant Wavelength (λ_d): 624 nm (Typ). The single wavelength perceived by the human eye that best matches the color of the LED.
• Spectrum Radiation Bandwidth (Δλ): 20 nm (Typ). The spectral width of the emitted light, measured at half the maximum intensity (FWHM).

3. Performance Curve Analysis

The datasheet provides several characteristic curves that illustrate the device's behavior under varying conditions. Understanding these is crucial for robust circuit design.

3.1 Relative Intensity vs. Wavelength

This curve shows the spectral distribution of the emitted light, peaking around 632 nm (typical) with a bandwidth (FWHM) of approximately 20 nm, confirming the brilliant red color output.

3.2 Directivity Pattern

The directivity plot illustrates the spatial distribution of light intensity. The typical 60° viewing angle is confirmed, showing a smooth decrease in intensity as the angle from the central axis increases.

3.3 Forward Current vs. Forward Voltage (I-V Curve)

This fundamental curve shows the exponential relationship between current and voltage for a diode. For this LED, at the typical operating point of 20 mA, the forward voltage is approximately 2.0V. The curve is essential for selecting the appropriate current-limiting resistor.

3.4 Relative Intensity vs. Forward Current

This curve demonstrates that the light output (intensity) increases with forward current. However, it is not perfectly linear, and operation beyond the absolute maximum ratings will not yield proportional increases and risks damage.

3.5 Temperature Dependence

Two key curves show the effect of ambient temperature (T_a):
Relative Intensity vs. Ambient Temp: The luminous intensity typically decreases as the ambient temperature rises. This derating must be considered for applications operating at high temperatures.
Forward Current vs. Ambient Temp: This curve, likely showing a constant-voltage drive scenario, indicates how the forward current might change with temperature due to shifts in the diode's V_F. For stable operation, constant-current driving is strongly recommended.

4. Mechanical and Packaging Information

4.1 Package Dimensions

The datasheet includes a detailed dimensional drawing of the LED lamp array. Key notes from the drawing include:
1. All dimensions are in millimeters (mm).
2. The general tolerance is ±0.25 mm unless a specific tolerance is indicated on the drawing.
3. Lead spacing is measured at the point where the leads emerge from the package body. Accurate measurement of this dimension is critical for PCB footprint design to avoid mechanical stress during assembly.

4.2 Polarity Identification

Polarity must be observed for correct operation. The package uses a standard LED polarity indicator: the longer lead is the Anode (+), and the shorter lead is the Cathode (-). The PCB footprint or panel cutout must be designed to match this orientation.

5. Soldering and Assembly Guidelines

Proper handling is essential to maintain reliability and performance.

5.1 Lead Forming

• Bending must occur at least 3 mm away from the base of the epoxy bulb to prevent stress on the internal die and wire bonds.
• Form leads before soldering the component.
• Avoid applying stress to the package during forming.
• Cut leads at room temperature.
• Ensure PCB holes align perfectly with the LED leads to avoid mounting stress.

5.2 Storage Conditions

• Store at ≤30°C and ≤70% Relative Humidity (RH). The recommended storage life after shipment is 3 months.
• For longer storage (up to 1 year), use a sealed container with a nitrogen atmosphere and desiccant.
• Avoid rapid temperature changes in humid environments to prevent condensation.

5.3 Soldering Process

General Rule: Maintain a minimum distance of 3 mm from the solder joint to the epoxy bulb.

Hand Soldering:
- Iron Tip Temperature: 300°C Max (for a 30W max iron).
- Soldering Time: 3 seconds Max per lead.

Wave or Dip Soldering:
- Preheat Temperature: 100°C Max (for up to 60 seconds).
- Solder Bath Temperature & Time: 260°C Max for 5 seconds Max.
- A recommended soldering temperature profile graph is provided, showing the time-temperature relationship for preheat, fluxing, laminar wave, and cooling.

Critical Soldering Notes:
- Avoid mechanical stress on the leads while the LED is hot.
- Do not solder the device more than once (one pass only).
- Protect the LED from shock/vibration until it cools to room temperature after soldering.
- Avoid rapid cooling from peak soldering temperature.
- Always use the lowest effective soldering temperature.

5.4 Cleaning

• If cleaning is necessary, use only isopropyl alcohol at room temperature for no more than one minute.
• Dry at room temperature before use.
• Do not use ultrasonic cleaning. If absolutely unavoidable, extensive pre-qualification is required to assess the impact of ultrasonic power and assembly conditions on the LED's integrity.

6. Packaging and Ordering Information

6.1 Packing Specification

The LEDs are packaged to prevent electrostatic discharge (ESD) and moisture damage:
1. Anti-Electrostatic Bag: Provides ESD protection during transport and storage.
2. Inner Carton: Contains multiple bags.
3. Outside Carton: The final shipping container.

6.2 Packing Quantity

The standard packing flow is:
- 250 pieces per anti-static bag.
- 6 bags per inner carton (total 1,500 pieces).
- 10 inner cartons per outside master carton (total 15,000 pieces).

6.3 Label Explanation

Labels on the packaging contain the following information:
- CPN: Customer's Production Number.
- P/N: Production Number (the manufacturer's part number).
- QTY: Packing Quantity.
- CAT: Ranks of Luminous Intensity (brightness bin).
- HUE: Ranks of Dominant Wavelength (color bin).
- REF: Ranks of Forward Voltage (voltage bin).
- LOT No: Lot Number for traceability.

7. Application Suggestions and Design Considerations

7.1 Typical Application Circuits

This LED is typically driven by a DC voltage source through a current-limiting resistor. The resistor value (R_s) can be calculated using Ohm's Law: R_s = (V_supply - V_F) / I_F. For a 5V supply and a target I_F of 20mA with a typical V_F of 2.0V: R_s = (5V - 2.0V) / 0.020A = 150 Ω. A slightly higher value (e.g., 180 Ω) can be used for increased safety margin and longevity.

7.2 Design Considerations

• Current Driving: Always drive LEDs with a constant current or a voltage source with a series resistor. Never connect directly to a voltage source without current limitation.
• Thermal Management: While the power dissipation is low, ensure adequate ventilation if multiple LEDs are used in a confined space, especially near the upper operating temperature limit.
• PCB Layout: Design the PCB footprint according to the package dimensions, respecting the 3mm minimum bend radius from the bulb for any required lead forming.
• ESD Precautions: Although not explicitly rated as a sensitive device, standard ESD handling procedures are recommended during assembly.

8. Technical Comparison and Differentiation

The A264B/SUR/S530-A3 differentiates itself through its array format and versatile mechanical design. Unlike single discrete LEDs, the array holder allows for pre-configured multi-lamp assemblies, simplifying panel design and assembly. Its stackability (both vertical and horizontal) offers unique layout flexibility not always found in standard LED packages. The combination of AlGaInP technology for high-brightness red, a wide 60° viewing angle, and full environmental compliance (RoHS, REACH, Halogen-Free) makes it a robust choice for modern electronic designs requiring reliable visual indicators.

9. Frequently Asked Questions (FAQ)

9.1 What is the recommended operating current?

The standard test condition is 20mA, which is a safe and common operating point providing good brightness. It should not exceed the Absolute Maximum Rating of 25mA continuous current.

9.2 Can I use this LED in an outdoor application?

The operating temperature range is -40°C to +85°C, which covers many outdoor conditions. However, the epoxy resin package may be susceptible to UV degradation and moisture ingress over prolonged exposure. For harsh outdoor environments, additional protective conformal coating or the use of LEDs specifically rated for outdoor use should be considered.

9.3 Why is constant current drive recommended?

The forward voltage (V_F) of an LED has a negative temperature coefficient (it decreases as temperature increases). If driven by a constant voltage, a rise in temperature causes V_F to drop, leading to an increase in current (I_F = (V_supply-V_F)/R). This increased current generates more heat, further lowering V_F and increasing current, potentially leading to thermal runaway. A constant current source prevents this by regulating I_F regardless of V_F variations.

9.4 How do I interpret the luminous intensity value?

The typical value is 125 millicandelas (mcd) at 20mA. Candela is a unit of luminous intensity, which is the perceived power of light per unit solid angle. For comparison, a standard indicator LED might range from 20 mcd to over 1000 mcd. A value of 125 mcd is bright enough for most indoor panel indicator applications.

10. Practical Design Case Study

Scenario: Designing a control panel with 10 status indicators, each requiring a brilliant red LED. Space is limited on the PCB, but panel real estate is available.

Solution using A264B Array: Instead of placing 10 individual LEDs on the PCB, the designer can use one or more of these lamp arrays. A single array holder can accommodate multiple LED lamps in a predefined pattern. The array is mounted on the panel itself, with leads passing through to the PCB. This approach:
1. Saves PCB Space: Reduces the number of discrete components and footprints on the main board.
2. Simplifies Assembly: The array snaps or locks into the panel, holding itself in place during soldering.
3. Improves Aesthetics: Provides a uniform, aligned appearance for the indicators on the panel front.
4. Enhances Serviceability: If an LED fails, potentially only the array module needs replacement rather than desoldering a single LED from a crowded PCB.

The electrical design remains the same—each LED within the array would have its own current-limiting resistor connected to the driver circuit on the PCB.