LED Lamp 494-10SURT/S530-A3 Datasheet - 5mm Package - 2.0V Forward Voltage - Brilliant Red Color - English Technical Document

1. Product Overview

This document details the specifications for a high-brightness, 5mm through-hole LED lamp. The device is part of a series engineered for applications demanding superior luminous output. It utilizes an AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor chip to produce a brilliant red color, encapsulated in a red transparent epoxy resin. The product is designed for reliability and robustness, making it suitable for a variety of electronic indicator and backlighting applications.

1.1 Core Advantages

• High Brightness: Specifically designed for applications requiring higher luminous intensity.
• Compliance: The product complies with key environmental regulations including RoHS, EU REACH, and is Halogen Free (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm).
• Packaging Options: Available on tape and reel for automated assembly processes.
• Viewing Angle Choice: Offered with various viewing angles to suit different application needs.

1.2 Target Market & Applications

The primary applications for this LED lamp include consumer electronics and computer peripherals where clear, bright visual indicators are essential. Typical use cases are:

• Television Sets (Status indicators, backlighting)
• Computer Monitors
• Telephones
• General Computer Equipment

2. In-Depth Technical Parameter Analysis

This section provides a detailed, objective interpretation of the device's electrical, optical, and thermal specifications.

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

• Continuous Forward Current (I_F): 25 mA. This is the maximum DC current that can be continuously applied.
• Peak Forward Current (I_FP): 60 mA. This pulsed current rating (at 1/10 duty cycle, 1 kHz) is for brief, non-continuous operation.
• Reverse Voltage (V_R): 5 V. Exceeding this voltage in reverse bias can cause junction breakdown.
• Power Dissipation (P_d): 60 mW. The maximum power the device can dissipate as heat.
• Operating & Storage Temperature: -40°C to +85°C (operating), -40°C to +100°C (storage).
• Soldering Temperature: 260°C for 5 seconds. This defines the reflow soldering profile tolerance.

2.2 Electro-Optical Characteristics

Measured at a standard test condition of 20mA forward current and 25°C ambient temperature (T_a).

• Luminous Intensity (I_v): Typical value is 32 mcd (millicandela), with a minimum of 16 mcd. This quantifies the perceived brightness of the red light output.
• Viewing Angle (2θ_1/2): 100 degrees (typical). This is the full angle at which the luminous intensity drops to half its peak value, defining the beam spread.
• Peak Wavelength (λ_p): 632 nm (typical). The wavelength at which the spectral power distribution is maximum.
• Dominant Wavelength (λ_d): 624 nm (typical). The single wavelength that best matches the perceived color of the LED.
• Forward Voltage (V_F): Ranges from 1.7V (min) to 2.4V (max), with a typical value of 2.0V at 20mA. This is crucial for circuit design and current-limiting resistor calculation.
• Reverse Current (I_R): Maximum of 10 µA at 5V reverse bias.

Measurement Tolerances: Forward Voltage (±0.1V), Luminous Intensity (±10%), Dominant Wavelength (±1.0nm). These uncertainties must be considered in precision designs.

3. Performance Curve Analysis

The datasheet provides several characteristic curves that illustrate device behavior under varying conditions.

3.1 Spectral Distribution & Directivity

The Relative Intensity vs. Wavelength curve shows a narrow emission spectrum centered around 632 nm, characteristic of AlGaInP red LEDs. The Directivity pattern (polar diagram) visually represents the 100-degree viewing angle, showing how intensity falls off from the central axis.

3.2 Electrical & Thermal Relationships

• Forward Current vs. Forward Voltage (I-V Curve): This non-linear curve is essential for determining the dynamic resistance of the LED and for designing appropriate drive circuitry. It shows the exponential relationship typical of a diode.
• Relative Intensity vs. Forward Current: Demonstrates that light output increases with current, but not necessarily linearly across the entire range. This informs decisions on drive current for desired brightness.
• Relative Intensity vs. Ambient Temperature: Shows the negative temperature coefficient of luminous output. As temperature rises, efficiency and light output generally decrease.
• Forward Current vs. Ambient Temperature: Often used in conjunction with de-rating guidelines, this curve helps determine the maximum safe operating current at elevated ambient temperatures.

4. Mechanical & Packaging Information

4.1 Package Dimensions

The device is housed in a standard 5mm radial leaded package. Key dimensional notes include:

• All dimensions are in millimeters.
• The flange height must be less than 1.5mm (0.059\").
• Standard tolerance is ±0.25mm unless otherwise specified.

The dimensional drawing specifies lead spacing, lens diameter and shape, and overall height, which are critical for PCB footprint design and ensuring proper fit in enclosures.

4.2 Polarity Identification

The cathode is typically identified by a flat spot on the lens rim and/or a shorter lead. Correct polarity must be observed during installation to prevent reverse bias damage.

5. Soldering & Assembly Guidelines

Proper handling is critical to maintain device reliability and performance.

5.1 Lead Forming

• Bend leads at a point at least 3mm from the epoxy bulb base.
• Perform forming before soldering.
• Avoid stressing the package. Misaligned PCB holes causing lead stress can degrade the epoxy and the LED.
• Cut leads at room temperature.

5.2 Soldering Parameters

Hand Soldering: Iron tip temperature max 300°C (30W max), soldering time max 3 seconds, maintain minimum 3mm distance from solder joint to epoxy bulb.
Wave/DIP Soldering: Preheat max 100°C (60 sec max), solder bath max 260°C for 5 seconds, maintain 3mm distance from joint to bulb.
General Rules: Avoid stress on leads at high temperature. Do not solder more than once. Allow to cool to room temperature gradually without mechanical shock. Use the lowest effective temperature.

5.3 Storage & Handling

• Storage: Recommended at ≤30°C and ≤70% RH. Shelf life is 3 months from shipment. For longer storage (up to 1 year), use a sealed container with nitrogen and desiccant.
• ESD (Electrostatic Discharge): The device is sensitive to ESD. Standard ESD precautions (grounded workstations, wrist straps) should be employed during handling.
• Cleaning: If necessary, clean only with isopropyl alcohol at room temperature for ≤1 minute. Avoid ultrasonic cleaning unless specifically pre-qualified for the application, as it can damage the die.

5.4 Heat Management

Proper thermal management is essential for longevity. The operating current should be de-rated appropriately at higher ambient temperatures, as indicated by the de-rating curve. The temperature surrounding the LED in the final application must be controlled.

6. Packaging & Ordering Information

6.1 Packing Specification

The LEDs are packed using moisture-resistant, anti-static materials to prevent damage during shipping and storage. The packing hierarchy is:

1. Anti-static Bag: Contains 200 to 1000 pieces.
2. Inner Carton: Contains 4 bags.
3. Outside Carton: Contains 10 inner cartons.

6.2 Label Explanation & Binning

The packaging label includes codes for product identification and performance binning:

• P/N: Production Number (e.g., 494-10SURT/S530-A3).
• CAT: Ranks of Luminous Intensity (Brightness bin).
• HUE: Ranks of Dominant Wavelength (Color bin).
• REF: Ranks of Forward Voltage (Voltage bin).
• LOT No: Traceable manufacturing lot number.

This binning system ensures electrical and optical parameters fall within specified sub-ranges, allowing for consistent performance in automated production.

7. Application Design Considerations

7.1 Circuit Design

A current-limiting resistor is mandatory when driving the LED from a voltage source. The resistor value (R) can be calculated using Ohm's Law: R = (V_supply - V_F) / I_F. Use the maximum V_F from the datasheet (2.4V) for a robust design that ensures I_F does not exceed 20mA even with component tolerances. For a 5V supply: R = (5V - 2.4V) / 0.020A = 130 Ω. A standard 150 Ω resistor would provide a safe margin.

7.2 PCB Layout

Ensure PCB hole spacing matches the LED's lead spacing precisely to avoid mechanical stress. Provide adequate clearance around the epoxy bulb for the recommended 3mm soldering distance.

7.3 Thermal Design

In applications with high ambient temperature or where multiple LEDs are densely packed, consider the thermal de-rating. If the local temperature exceeds the recommended range, reduce the drive current to prevent accelerated lumen depreciation and potential failure.

8. Technical Comparison & Differentiation

This AlGaInP-based red LED offers distinct advantages compared to older technologies like GaAsP (Gallium Arsenide Phosphide):

• Higher Efficiency & Brightness: AlGaInP provides significantly higher luminous efficacy, resulting in brighter output at the same drive current.
• Superior Color Purity: The dominant wavelength of 624 nm produces a deeper, more saturated \"brilliant red\" compared to the often orange-tinted red of GaAsP LEDs.
• Better Temperature Stability: AlGaInP devices generally exhibit more stable performance over temperature ranges, though de-rating is still necessary.

9. Frequently Asked Questions (FAQ)

9.1 Can I drive this LED at 30mA for more brightness?

No. The Absolute Maximum Rating for continuous forward current is 25 mA. Operating at 30 mA exceeds this rating, which can cause excessive junction temperature, rapid lumen depreciation, and catastrophic failure. For higher brightness, select an LED rated for a higher current.

9.2 What is the difference between Peak and Dominant Wavelength?

Peak Wavelength (λ_p): The physical wavelength where the emitted optical power is highest.
Dominant Wavelength (λ_d): The single wavelength perceived by the human eye that matches the LED's color. For red LEDs, λ_d is often slightly shorter than λ_p. λ_d is more relevant for color specification in applications.

9.3 Why is the 3mm distance from the solder joint so important?

The epoxy resin encapsulating the semiconductor die is sensitive to high temperature. Soldering too close to the bulb can transfer excessive heat, potentially causing internal cracks (\"thermal shock\"), delamination, or changes in the optical properties of the resin, leading to premature failure or reduced light output.

10. Operational Principles & Technology Trends

10.1 Basic Operating Principle

This is a semiconductor photonic device. When a forward voltage exceeding the diode's turn-on voltage (approx. 1.7-2.4V) is applied, electrons and holes are injected into the active region (the AlGaInP quantum well). When these charge carriers recombine, they release energy in the form of photons (light). The specific composition of the AlGaInP alloy determines the bandgap energy, which directly defines the wavelength (color) of the emitted light—in this case, red.

10.2 Industry Trends

While through-hole LEDs like this 5mm lamp remain widely used for indicators and simple lighting, the industry trend is strongly towards surface-mount device (SMD) packages (e.g., 0603, 0805, 2835). SMDs offer advantages for modern manufacturing: smaller size, lower profile, better suitability for automated pick-and-place assembly, and often improved thermal management via direct PCB attachment. However, through-hole LEDs retain advantages in prototyping, hobbyist applications, and situations where superior single-point brightness or wider viewing angles from a discrete package are needed.