LED Lamp 1383UYD/S530-A3 Specification - Brilliant Yellow - 20mA - 800mcd - English Technical Document

1. Product Overview

This document provides the technical specifications for the 1383UYD/S530-A3 LED lamp. This component is a surface-mount device (SMD) designed to deliver high brightness in a compact package. It is part of a series optimized for applications requiring superior luminous output and reliability.

1.1 Core Advantages and Target Market

The primary advantages of this LED include its high luminous intensity, availability in tape and reel packaging for automated assembly, and compliance with key environmental and safety standards such as RoHS, REACH, and halogen-free requirements. It is specifically engineered to be reliable and robust under various operating conditions. The target applications are primarily in consumer electronics, including television sets, computer monitors, telephones, and general computing equipment where indicator or backlighting functions are required.

2. In-Depth Technical Parameter Analysis

This section provides a detailed, objective interpretation of the key electrical, optical, and thermal parameters defined for the LED.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation under or at these limits is not guaranteed.

• Continuous Forward Current (IF): 25 mA. This is the maximum DC current that can be applied continuously without risking degradation.
• Peak Forward Current (IFP): 60 mA. This higher current is permissible only under pulsed conditions (duty cycle 1/10 @ 1 kHz) to handle transient peaks.
• Reverse Voltage (VR): 5 V. Exceeding this voltage in reverse bias can cause junction breakdown.
• Power Dissipation (Pd): 60 mW. This is the maximum power the package can dissipate, calculated as Forward Voltage (VF) * Forward Current (IF).
• Operating & Storage Temperature: Ranges from -40°C to +85°C (operating) and -40°C to +100°C (storage). These define the environmental limits for functional and non-functional periods.
• Soldering Temperature (Tsol): 260°C for 5 seconds. This specifies the maximum thermal profile the device can withstand during wave or reflow soldering.

2.2 Electro-Optical Characteristics

These parameters are measured under standard test conditions (Ta=25°C, IF=20mA) and define the device's performance.

• Luminous Intensity (Iv): 400 mcd (Min), 800 mcd (Typ). This is the primary measure of brightness. The typical value of 800 mcd indicates a high-brightness output for its class.
• Viewing Angle (2θ1/2): 25° (Typ). This narrow viewing angle indicates the light is emitted in a more focused beam, suitable for directed illumination or indicator applications.
• Peak & Dominant Wavelength (λp / λd): 591 nm (Typ) / 589 nm (Typ). These values confirm the emitted color as Brilliant Yellow. The close proximity of peak and dominant wavelengths indicates good color purity.
• Spectrum Radiation Bandwidth (Δλ): 15 nm (Typ). This defines the spectral width of the emitted light at half maximum intensity.
• Forward Voltage (VF): 1.7V (Min), 2.0V (Typ), 2.4V (Max) at 20mA. This is the voltage drop across the LED when operating. Circuit design must account for this range.
• Reverse Current (IR): 10 µA (Max) at VR=5V. This is the leakage current when the device is reverse-biased.

Note on Measurement Uncertainty: The datasheet specifies tolerances for key measurements: ±0.1V for VF, ±10% for Iv, and ±1.0nm for λd. These must be considered in precision applications.

3. Performance Curve Analysis

The typical characteristic curves provide insight into the device's behavior under non-standard conditions.

3.1 Relative Intensity vs. Wavelength

This curve graphically represents the spectral output, showing a sharp peak around 591 nm, confirming the yellow color emission with a defined bandwidth of approximately 15 nm.

3.2 Directivity Pattern

The polar diagram illustrates the spatial distribution of light intensity, correlating with the 25° viewing angle. It shows a Lambertian or near-Lambertian emission pattern common for LED lamps.

3.3 Forward Current vs. Forward Voltage (IV Curve)

This curve shows the exponential relationship typical of a diode. The forward voltage increases logarithmically with current. At the typical operating point of 20mA, the voltage is approximately 2.0V.

3.4 Relative Intensity vs. Forward Current

This graph demonstrates that luminous intensity is approximately linear with forward current in the operating range (up to the maximum rated current). This allows for simple brightness dimming via current control.

3.5 Temperature Dependence

Two key curves show the impact of ambient temperature (Ta):

• Relative Intensity vs. Ambient Temp: Shows a decrease in light output as temperature increases, a characteristic of LED efficiency droop.
• Forward Current vs. Ambient Temp: Likely intended to show how forward voltage changes with temperature for a fixed current, affecting the required drive voltage.

These curves are critical for thermal management design to maintain consistent performance.

4. Mechanical and Packaging Information

4.1 Package Dimensions

The LED is housed in a standard lamp-style SMD package. Key dimensional notes from the datasheet include:

• All dimensions are in millimeters (mm).
• The height of the component's flange must be less than 1.5mm.
• The default tolerance for unspecified dimensions is ±0.25mm.

A detailed dimensioned drawing is provided in the original datasheet, specifying lead spacing, body size, and overall height.

4.2 Polarity Identification

Polarity is typically indicated by a visual marker on the package, such as a notch, flat edge, or differently sized leads (cathode lead is often shorter or marked). The specific marker should be cross-referenced with the package diagram.

5. Soldering and Assembly Guidelines

Proper handling is crucial for reliability. The guidelines are based on the device's construction and material limits.

5.1 Lead Forming

• Bending must occur at least 3mm from the epoxy bulb to avoid stress on the seal.
• Forming must be done before soldering.
• Avoid stressing the package; use proper tools.
• Cut leads at room temperature.
• Ensure PCB holes align perfectly with LED leads to avoid mounting stress.

5.2 Storage Conditions

• Recommended: ≤30°C and ≤70% Relative Humidity (RH).
• Standard storage life after shipment: 3 months.
• For longer storage (up to 1 year): Use a sealed container with a nitrogen atmosphere and desiccant.
• Avoid rapid temperature changes in humid environments to prevent condensation.

5.3 Soldering Process

General Rule: Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.

Hand Soldering:

• Iron tip temperature: Max 300°C (for a max 30W iron).
• Soldering time per lead: Max 3 seconds.

Dip/Wave Soldering:

• Preheat temperature: Max 100°C (for max 60 seconds).
• Solder bath temperature & time: Max 260°C for 5 seconds.

Critical Post-Soldering Notes:

• Avoid mechanical stress or vibration on the LED while it is hot.
• Cool down from peak temperature gradually; avoid rapid quenching.
• Dip or hand soldering should not be performed more than once.
• Always use the lowest effective soldering temperature.

5.4 Cleaning

• If necessary, clean only with isopropyl alcohol at room temperature for ≤1 minute.
• Air dry at room temperature.
• Avoid ultrasonic cleaning unless absolutely necessary and pre-qualified, as it can damage the internal structure.

5.5 Heat Management

Effective thermal design is essential:

• Consider heat dissipation during the application design phase.
• De-rate the operating current appropriately based on the ambient temperature, using the de-rating curve (referenced in the datasheet).
• Control the temperature surrounding the LED in the final application.

5.6 Electrostatic Discharge (ESD) Protection

The device is sensitive to ESD and voltage surges. Standard ESD handling precautions must be observed during all stages of handling, assembly, and testing. Use grounded workstations, wrist straps, and conductive containers.

6. Packaging and Ordering Information

6.1 Packing Specification

The LEDs are packaged to prevent damage from moisture, static, and physical shock:

• Primary Packing: Anti-electrostatic bags.
• Secondary Packing: Inner cartons (5 bags per carton).
• Tertiary Packing: Outside cartons (10 inner cartons per box).

6.2 Packing Quantity

Minimum order quantities are structured as follows:

• 200-500 pieces per anti-static bag.
• 5 bags per inner carton.
• 10 inner cartons per outside carton.

6.3 Label Explanation

Labels on packaging contain key identifiers:

• CPN: Customer's Part Number.
• P/N: Manufacturer's Part Number (e.g., 1383UYD/S530-A3).
• QTY: Quantity contained.
• CAT / HUE: Binning information for luminous intensity category and dominant wavelength (hue).
• LOT No: Traceable manufacturing lot number.

7. Application Notes and Design Considerations

7.1 Typical Application Circuits

To operate this LED, a current-limiting circuit is mandatory. The simplest method is a series resistor. The resistor value (R) can be calculated using Ohm's Law: R = (Vsupply - VF) / IF. For example, with a 5V supply, a typical VF of 2.0V, and a desired IF of 20mA: R = (5V - 2.0V) / 0.02A = 150 Ω. A driver IC is recommended for constant current control, especially for applications requiring stable brightness or dimming.

7.2 PCB Layout Recommendations

• Ensure pad geometry matches the package dimension drawing.
• Provide adequate copper area or thermal vias for heat dissipation if operating near maximum ratings.
• Maintain the 3mm clearance from the solder pad to any other component or the LED's epoxy body as per soldering guidelines.

7.3 Optical Integration

Given the 25° viewing angle, consider the use of lenses, light guides, or diffusers if a wider or differently shaped light distribution is required in the final application.

8. Technical Comparison and Differentiation

While a direct competitor comparison is not provided in the source document, key differentiating features of this LED can be inferred:

• High Brightness: A typical luminous intensity of 800mcd is notable for a standard lamp package.
• Environmental Compliance: Full compliance with RoHS, REACH, and halogen-free standards is a significant advantage for global markets and environmentally conscious designs.
• Robust Construction: The detailed soldering and handling instructions suggest a design focused on surviving standard assembly processes.
• Material: Use of AlGaInP semiconductor material is standard for high-efficiency yellow and amber LEDs.

9. Frequently Asked Questions (FAQ)

Q1: Can I drive this LED with a 3.3V supply?
A: Yes. Using the series resistor formula: R = (3.3V - 2.0V) / 0.02A = 65 Ω. Ensure the resistor power rating is sufficient (P = I²R = 0.026 mW).

Q2: What is the difference between Peak and Dominant Wavelength?
A: Peak Wavelength (λp) is the wavelength at the highest intensity point in the spectrum. Dominant Wavelength (λd) is the single wavelength of monochromatic light that matches the perceived color. They are often close, as seen here (591nm vs 589nm).

Q3: Why is the storage life limited to 3 months?
A> This is related to moisture sensitivity. The plastic package can absorb ambient moisture, which may turn to steam and cause delamination or cracking ("popcorning") during high-temperature soldering if not properly stored or baked before use.

Q4: How do I interpret the de-rating curve?
A: The de-rating curve (referenced but not shown in the provided excerpt) would plot the maximum allowable forward current against the ambient temperature. As temperature rises, the maximum safe current decreases to prevent overheating and premature failure.

10. Design and Usage Case Study

Scenario: Designing a status indicator panel for a network router.
The Brilliant Yellow 1383UYD/S530-A3 LED is selected for its high brightness and clear color. Multiple LEDs are placed on a PCB to indicate power, network activity, and system errors. A microcontroller GPIO pin drives each LED via a 150Ω series resistor connected to a 5V rail. The narrow 25° viewing angle is perfect for the panel's small apertures, ensuring light is directed straight out to the user without excessive spill. During assembly, the PCB is assembled using a wave soldering process with a profile strictly adhering to the 260°C for 5 seconds limit. The LEDs are stored in their sealed, moisture-barrier bags until just before use and are handled on an ESD-safe workstation. This approach ensures reliable, long-term operation of the indicators.

11. Technical Principle Introduction

This LED is based on an AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor chip. When a forward voltage is applied, electrons and holes recombine in the active region of the semiconductor, releasing energy in the form of photons. The specific composition of the AlGaInP alloy determines the bandgap energy, which directly corresponds to the wavelength (color) of the emitted light—in this case, yellow (~589-591 nm). The epoxy resin package serves to protect the chip, act as a primary lens to shape the light output, and provide mechanical structure for the leads.

12. Industry Trends and Developments

The LED industry continues to evolve towards higher efficiency (more lumens per watt), improved color rendering, and greater reliability. While this is a standard lamp-type package, trends influencing such components include:

• Miniaturization: Ongoing reduction in package size for the same or higher light output.
• Enhanced Thermal Performance: New package materials and designs to better manage heat, allowing for higher drive currents and longer lifespan.
• Stricter Standards: Increasing demand for compliance with environmental regulations (like the EU's expanding RoHS and REACH) and supply chain transparency.
• Smart Integration: While not applicable to this discrete component, the broader market sees growth in integrated smart LEDs with built-in drivers and control logic.

Devices like the 1383UYD/S530-A3 represent mature, reliable technology that forms the backbone of countless indicator and basic lighting applications.