LED Lamp 333-2UYD/S530-A3 Datasheet - Brilliant Yellow - 20mA - 320mcd - English Technical Document

1. Product Overview

This document provides the complete technical specifications for a high-brightness, brilliant yellow LED lamp. The device is designed for applications requiring reliable performance and enhanced visibility. It utilizes an AlGaInP chip technology encapsulated in a yellow diffused resin, resulting in a distinct brilliant yellow emitted color. The series offers a choice of viewing angles and is available on tape and reel for automated assembly processes.

1.1 Core Advantages and Compliance

The product is designed with reliability and robustness as key features. It complies with major environmental and safety regulations, ensuring it meets modern manufacturing standards. Specifically, the device is compliant with the EU RoHS (Restriction of Hazardous Substances) directive, the EU REACH regulation, and is classified as Halogen-Free, with strict limits on Bromine (Br) and Chlorine (Cl) content (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm). This makes it suitable for a wide range of consumer and industrial electronics.

1.2 Target Market and Applications

This LED lamp is targeted at the backlighting and indicator markets within consumer electronics. Its primary applications include use as an indicator or backlight source in television sets, computer monitors, telephones, and various computer peripherals. The combination of its color, brightness, and package size makes it a versatile component for design engineers.

2. In-Depth Technical Parameter Analysis

This section provides a detailed, objective interpretation of the device's key electrical, optical, and thermal parameters as defined in the datasheet.

2.1 Absolute Maximum Ratings

The Absolute Maximum Ratings define the stress limits beyond which permanent damage to the device may occur. These are not conditions for normal operation.

• Continuous Forward Current (IF): 25 mA. Exceeding this current continuously will generate excessive heat, degrading the LED's lifetime and luminous output.
• Peak Forward Current (IFP): 60 mA (at a duty cycle of 1/10 and 1 kHz). This rating allows for short pulses of higher current, useful for multiplexing or pulsed operation schemes, but must be carefully managed to avoid overheating.
• Reverse Voltage (VR): 5 V. Applying a reverse voltage greater than this can cause immediate and catastrophic failure of the LED junction.
• Power Dissipation (Pd): 60 mW. This is the maximum power the package can dissipate under given conditions, calculated from forward voltage and current.
• Operating & Storage Temperature: The device can function from -40°C to +85°C and be stored from -40°C to +100°C. These wide ranges ensure reliability in harsh environments.
• Soldering Temperature: 260°C for 5 seconds. This defines the peak temperature and time tolerance for wave or reflow soldering processes.

2.2 Electro-Optical Characteristics

These parameters are measured under standard test conditions (Ta=25°C, IF=20mA unless specified) and define the device's performance.

• Luminous Intensity (Iv): Ranges from 100 mcd (minimum) to a typical value of 320 mcd. This is a measure of the perceived brightness of the yellow light to the human eye. The wide range indicates a binning process.
• Viewing Angle (2θ1/2): Typically 30 degrees. This is the full angle at which the luminous intensity is half of the peak intensity. A 30-degree angle indicates a relatively focused beam, suitable for directional indication.
• Peak & Dominant Wavelength (λp, λd): Typical values are 591 nm and 589 nm, respectively. Peak wavelength is the spectral peak, while dominant wavelength correlates to the perceived color (brilliant yellow).
• Spectrum Radiation Bandwidth (Δλ): Typically 15 nm. This defines the spectral purity of the emitted yellow light.
• Forward Voltage (VF): Ranges from 1.7V (min) to 2.4V (max), with a typical value of 2.0V at 20mA. This is critical for designing the current-limiting circuitry.
• Reverse Current (IR): Maximum of 10 μA at VR=5V. A low reverse current is desirable.

3. Binning System Explanation

The datasheet references a binning system for key parameters, which is essential for ensuring color and brightness consistency in production.

• CAT (Ranks of Luminous Intensity): This code on the packaging label indicates the specific luminous intensity bin for that batch of LEDs.
• HUE (Ranks of Dominant Wavelength): This code specifies the wavelength/color bin, ensuring the yellow color is within a defined tolerance.
• REF (Ranks of Forward Voltage): This code indicates the forward voltage bin, which helps in designing consistent driver circuits, especially when multiple LEDs are used in series.

Designers should consult the manufacturer's detailed binning charts (not provided in this core datasheet) to select the appropriate codes for their application's color and brightness uniformity requirements.

4. Performance Curve Analysis

The typical characteristic curves provide insight into how the LED behaves under varying conditions.

4.1 Relative Intensity vs. Wavelength

This curve shows the spectral power distribution, peaking around 591 nm (yellow) with a bandwidth of approximately 15 nm, confirming the monochromatic nature of the AlGaInP chip.

4.2 Directivity Pattern

The directivity plot visualizes the 30-degree viewing angle, showing how light intensity decreases as the angle moves away from the central axis.

4.3 Forward Current vs. Forward Voltage (IV Curve)

This curve is non-linear, typical of a diode. It shows the relationship between the applied forward voltage and the resulting current. The knee voltage is around 2.0V. Operating above this knee, small changes in voltage cause large changes in current, necessitating constant-current drive for stable operation.

4.4 Relative Intensity vs. Forward Current

Luminous intensity generally increases with forward current but will eventually saturate and then decrease due to efficiency droop and heating effects. The curve helps determine the optimal drive current for desired brightness versus efficiency and lifetime.

4.5 Temperature Dependence

Relative Intensity vs. Ambient Temperature: The luminous output of an LED decreases as the junction temperature increases. This curve quantifies that derating, which is crucial for applications operating in elevated ambient temperatures.
Forward Current vs. Ambient Temperature: This curve may show how the forward voltage characteristic shifts with temperature, which is important for constant-voltage drive scenarios.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED is housed in a standard 3mm radial (round) through-hole package. Key dimensional notes include:
- All dimensions are in millimeters.
- The flange height must be less than 1.5mm (0.059\").
- Standard tolerance is ±0.25mm unless otherwise specified.
The detailed dimensioned drawing (implied in the datasheet) specifies the lead spacing, body diameter, lens shape, and overall height, which are critical for PCB footprint design and ensuring proper fit in the application.

5.2 Polarity Identification and Lead Forming

The longer lead is typically the anode (positive). The datasheet emphasizes critical rules for lead forming to prevent damage:
- Bend leads at a point at least 3mm from the base of the epoxy bulb.
- Perform forming before soldering.
- Avoid stressing the package. Misaligned PCB holes causing stress on the leads can degrade the LED.

6. Soldering and Assembly Guidelines

Proper handling is vital for reliability.

6.1 Soldering Process Parameters

Hand Soldering: Iron tip temperature maximum 300°C (for 30W max iron), soldering time maximum 3 seconds per lead.
Wave/DIP Soldering: Preheat temperature maximum 100°C (for 60 sec max), solder bath temperature maximum 260°C for 5 seconds.
Critical Rule: Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb to prevent thermal shock to the LED chip.

6.2 Recommended Soldering Profile

A typical profile includes a preheat ramp, a stable thermal soak, a brief peak at 260°C, and a controlled cooling ramp. Rapid cooling is not recommended. The process should use a laminar wave and proper fluxing.

6.3 Storage Conditions

LEDs should be stored at ≤30°C and ≤70% Relative Humidity. The shelf life after shipping is 3 months. For longer storage (up to one year), use a sealed container with a nitrogen atmosphere and desiccant. Avoid rapid temperature changes in humid environments to prevent condensation.

6.4 Cleaning

If necessary, clean only with isopropyl alcohol at room temperature for ≤1 minute. Do not use ultrasonic cleaning unless its parameters (power, time) have been pre-qualified to ensure no damage occurs, as ultrasonic energy can crack the epoxy or damage the wire bonds.

7. Packaging and Ordering Information

7.1 Packing Specification

The LEDs are packed in anti-electrostatic bags to prevent ESD damage. These are placed in inner cartons, which are then packed into outside cartons for shipment.
Packing Quantity: Minimum 200 to 500 pieces per bag. Five bags are packed into one inner carton. Ten inner cartons are packed into one outside carton.

7.2 Label Explanation

The packaging label includes several codes:
- CPN: Customer's Part Number.
- P/N: Manufacturer's Part Number (e.g., 333-2UYD/S530-A3).
- QTY: Quantity in the package.
- CAT/HUE/REF: Binning codes for Luminous Intensity, Dominant Wavelength, and Forward Voltage, respectively.
- LOT No: Traceable manufacturing lot number.

8. Application Suggestions and Design Considerations

8.1 Typical Application Circuits

This LED must be driven with a current-limiting mechanism. The simplest method is a series resistor. The resistor value (R) can be calculated using Ohm's Law: R = (Vsupply - Vf) / If. For a 5V supply and a typical Vf of 2.0V at 20mA, R = (5 - 2.0) / 0.02 = 150 Ω. A driver IC or transistor circuit is recommended for constant current drive, especially when brightness consistency or dimming is required.

8.2 Heat Management

Although power dissipation is relatively low (60mW max), proper heat management must be considered during PCB design, especially in high ambient temperatures or enclosed spaces. Adequate spacing between components and possible use of thermal vias can help dissipate heat from the LED leads, preventing junction temperature rise and subsequent loss of brightness and lifespan.

9. Technical Comparison and Differentiation

Compared to older technology yellow LEDs (e.g., based on GaAsP), this AlGaInP device offers significantly higher luminous efficiency and a more saturated, pure yellow color. The 30-degree viewing angle provides a good compromise between wide visibility and directional intensity, making it suitable for both indicator and backlight roles where a focused beam is beneficial. Its compliance with modern halogen-free and RoHS standards is a key differentiator for environmentally conscious designs.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED at 30mA for more brightness?
A: No. The Absolute Maximum Rating for continuous forward current is 25 mA. Exceeding this rating risks permanent damage and accelerated degradation. Operate at or below the recommended 20mA for reliable performance.
Q: What is the difference between Peak and Dominant Wavelength?
A: Peak Wavelength is the point of highest spectral power output. Dominant Wavelength is the single wavelength of monochromatic light that would appear to have the same color to the human eye. They are often close, as in this case (591nm vs 589nm).
Q: Why is the 3mm lead bending rule so important?
A: Bending closer than 3mm to the epoxy bulb transmits mechanical stress directly to the internal wire bonds and the semiconductor die, potentially causing immediate breakage or latent failures that manifest later.
Q: How do I interpret the CAT/HUE/REF codes on the label?
A: These are internal binning codes. To ensure color and brightness consistency in your product, you should specify the desired binning ranges when ordering and verify the codes on received material match your specification.

11. Practical Design and Usage Case

Scenario: Designing a status indicator panel for a network router. Multiple brilliant yellow LEDs are used to show different activity states. To ensure uniform appearance, the designer specifies a tight HUE (wavelength) bin and a specific CAT (intensity) bin from the supplier. The LEDs are driven via a microcontroller GPIO pin with a series resistor calculated for 15mA operation (to balance brightness and long-term reliability). The PCB layout ensures the recommended 3mm clearance from the solder pad to the LED body is maintained. During assembly, a wave soldering process with a controlled profile matching the datasheet is used.

12. Technology Principle Introduction

This LED is based on AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor material. When a forward voltage is applied, electrons and holes recombine in the active region of the semiconductor, releasing energy in the form of photons. The specific composition of the AlGaInP alloy determines the bandgap energy, which directly corresponds to the wavelength (color) of the emitted light—in this case, yellow (~589-591 nm). The yellow diffused resin dome serves to protect the chip, shape the light output beam (30-degree viewing angle), and diffuse the light to create a uniform appearance.

13. Technology Development Trends

The general trend in LED technology is toward higher efficiency (more lumens per watt), improved color rendering, and lower cost. For indicator-type LEDs like this one, trends include further miniaturization (e.g., smaller surface-mount packages), increased brightness within the same power envelope, and enhanced reliability under higher temperature operation. There is also a continuous push for broader compliance with environmental regulations and the use of more sustainable materials in packaging. The underlying AlGaInP material system is mature but continues to see refinements in epitaxial growth and chip design to extract more light and improve performance consistency.