LED Lamp 1383SYGD/S530-E2 Specification - Brilliant Yellow Green - 20mA - 2.0V Typ - English Technical Document

1. Product Overview

The 1383SYGD/S530-E2 is a high-brightness LED lamp designed for applications requiring superior luminous intensity and reliable performance. This device utilizes AlGaInP chip technology to produce a Brilliant Yellow Green light output, encapsulated in a green diffused resin package. It is engineered for robustness and longevity in various electronic applications.

1.1 Core Features and Advantages

The series offers several key advantages that make it suitable for demanding applications:

• High Brightness: Specifically designed for applications requiring higher luminous intensity.
• Viewing Angle Options: Available with various viewing angles to suit different design requirements.
• Packaging Flexibility: Offered on tape and reel for automated assembly processes.
• Environmental Compliance: The product is Pb-free, compliant with RoHS, EU REACH, and Halogen-Free standards (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm).
• Reliability: Built to be reliable and robust under specified operating conditions.

1.2 Target Market and Applications

This LED is targeted at consumer electronics and display backlighting markets. Its primary applications include:

• Television Sets
• Computer Monitors
• Telephones
• General Computer Peripherals and Indicators

2. Technical Parameter Deep Dive

This section provides a detailed, objective interpretation of the key technical parameters specified in the datasheet.

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation at or beyond these limits is not guaranteed.

• Continuous Forward Current (IF): 25 mA. This is the maximum DC current that can be continuously applied.
• Peak Forward Current (IFP): 60 mA at a duty cycle of 1/10 and 1 kHz. Suitable for pulsed operation.
• Reverse Voltage (VR): 5 V. Exceeding this voltage in reverse bias can cause junction breakdown.
• Power Dissipation (Pd): 60 mW. The maximum power the package can dissipate at Ta=25°C.
• Operating Temperature (Topr): -40°C to +85°C. The ambient temperature range for reliable operation.
• Storage Temperature (Tstg): -40°C to +100°C.
• Soldering Temperature (Tsol): 260°C for 5 seconds. Defines the reflow soldering profile tolerance.

2.2 Electro-Optical Characteristics

These are the typical performance parameters measured at Ta=25°C and IF=20mA, unless otherwise stated.

• Luminous Intensity (Iv): 100 mcd (Min), 200 mcd (Typ). This quantifies the perceived brightness of the LED.
• Viewing Angle (2θ1/2): 25° (Typ). The angle at which the luminous intensity is half the value at 0°.
• Peak Wavelength (λp): 575 nm (Typ). The wavelength at which the spectral emission is maximum.
• Dominant Wavelength (λd): 573 nm (Typ). The single wavelength perceived by the human eye.
• Spectrum Radiation Bandwidth (Δλ): 20 nm (Typ). The spectral width at half maximum intensity.
• Forward Voltage (VF): 1.7 V (Min), 2.0 V (Typ), 2.4 V (Max) at IF=20mA.
• Reverse Current (IR): 10 μA (Max) at VR=5V.

Measurement Tolerances: Forward Voltage: ±0.1V; Luminous Intensity: ±10%; Dominant Wavelength: ±1.0nm.

3. Performance Curve Analysis

The datasheet provides several characteristic curves that are crucial for design engineers.

3.1 Relative Intensity vs. Wavelength

This curve shows the spectral power distribution of the emitted light, centered around 575 nm with a typical bandwidth of 20 nm, confirming the Brilliant Yellow Green color point.

3.2 Directivity Pattern

The directivity curve illustrates the spatial distribution of light, correlating with the 25° typical viewing angle. It shows a Lambertian-like pattern common for diffused LED packages.

3.3 Forward Current vs. Forward Voltage (IV Curve)

This graph is essential for driver design. It shows the exponential relationship between current and voltage. At the typical operating point of 20mA, the forward voltage is approximately 2.0V. Designers must ensure the current-limiting circuit accounts for the Min-Max VF range (1.7V-2.4V).

3.4 Relative Intensity vs. Forward Current

This curve demonstrates the light output's dependence on drive current. While intensity increases with current, it is not perfectly linear, and operation above the absolute maximum rating (25mA continuous) is prohibited to prevent accelerated degradation.

3.5 Thermal Characteristics

Two key curves relate performance to ambient temperature:

• Relative Intensity vs. Ambient Temperature: Shows the decrease in light output as temperature rises. Effective heat sinking is critical to maintain brightness.
• Forward Current vs. Ambient Temperature: May be used to understand de-rating requirements, although a specific de-rating curve is not provided in this datasheet. The general rule is to reduce drive current at higher ambient temperatures to stay within the power dissipation limit.

4. Mechanical and Package Information

4.1 Package Dimensions

The LED is provided in a standard lamp-style package. Key dimensional notes from the datasheet include:

• All dimensions are in millimeters (mm).
• The height of the flange must be less than 1.5mm (0.059\").
• General tolerance for dimensions is ±0.25mm, unless otherwise specified on the drawing.

Design Consideration: The exact dimensional drawing is required for PCB footprint design, ensuring proper lead spacing and standoff height.

4.2 Polarity Identification

Polarity is typically indicated by lead length or a notch/flat on the package. The cathode is usually the shorter lead or the lead adjacent to the flat side. Designers must consult the package drawing for the exact identification method to prevent reverse bias during assembly.

5. Soldering and Assembly Guidelines

Proper handling is critical to ensure reliability and prevent damage.

5.1 Lead Forming

• Bending must occur at least 3mm from the base of the epoxy bulb.
• Form leads before soldering.
• Avoid stressing the package. Misaligned PCB holes causing lead stress can degrade the epoxy and the LED.
• Cut leads at room temperature.

5.2 Storage Conditions

• Recommended: ≤30°C and ≤70% Relative Humidity (RH).
• Shelf life after shipment: 3 months under recommended conditions.
• For longer storage (up to 1 year): Use a sealed container with nitrogen atmosphere and desiccant.
• Avoid rapid temperature transitions in humid environments to prevent condensation.

5.3 Soldering Parameters

Critical Rule: Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.

Hand Soldering:
Iron Tip Temperature: 300°C Max (30W Max iron).
Soldering Time: 3 seconds Max per lead.

Wave or Dip Soldering:
Preheat Temperature: 100°C Max (60 seconds Max).
Solder Bath Temperature & Time: 260°C Max for 5 seconds Max.

General Soldering Notes:

• Avoid stress on leads during high-temperature operations.
• Do not perform dip/hand soldering more than once.
• Protect the LED from mechanical shock until it cools to room temperature after soldering.
• Avoid rapid cooling from peak temperature.
• Always use the lowest effective soldering temperature.
• Wave soldering parameters must be strictly controlled.

5.4 Cleaning

• If necessary, clean only with isopropyl alcohol at room temperature for ≤1 minute.
• Dry at room temperature before use.
• Do not use ultrasonic cleaning unless pre-qualified under specific conditions, as it can cause damage.

6. Thermal and Electrical Management

6.1 Heat Management

Proper thermal design is essential for performance and lifetime.

• Heat management must be considered during the application design stage.
• The drive current should be de-rated appropriately at higher ambient temperatures. (Refer to the de-rating curve, which should be consulted from the product specification).
• The temperature surrounding the LED in the final application must be controlled.

6.2 ESD (Electrostatic Discharge) Sensitivity

The product is sensitive to electrostatic discharge or surge voltage. ESD can damage the semiconductor junction. Proper ESD handling procedures (use of grounded workstations, wrist straps, conductive foam) must be followed during all handling and assembly processes.

7. Packaging and Ordering Information

7.1 Packing Specification

The LEDs are packed to ensure protection from electrostatic, electromagnetic, and moisture damage.

• Primary Packing: Anti-electrostatic bag with moisture-resistant materials.
• Secondary Packing: Inner carton.
• Tertiary Packing: Outside carton for shipping.

7.2 Packing Quantity

• Minimum 200-500 pieces per anti-static bag.
• 5 bags per inner carton.
• 10 inner cartons per outside carton.

7.3 Label Explanation

Labels on packaging contain key information:

• CPN: Customer's Production Number
• P/N: Production Number
• QTY: Packing Quantity
• CAT: Ranks (e.g., brightness bin)
• HUE: Dominant Wavelength
• REF: Reference
• LOT No: Lot Number for traceability

8. Application Design Considerations

8.1 Driver Circuit Design

Given the forward voltage range (1.7V-2.4V), a constant-current driver is strongly recommended over a constant-voltage source with a simple series resistor. A constant-current driver ensures consistent brightness across units and over temperature variations, regardless of the Vf spread. The driver should be designed to not exceed the 25mA continuous current limit.

8.2 PCB Layout and Heat Dissipation

While this is a low-power device, attention to thermal paths on the PCB improves longevity. Use adequate copper area connected to the LED leads to act as a heat sink. Ensure the PCB material can withstand the recommended soldering profile.

8.3 Optical Integration

The 25° viewing angle and green diffused resin make this LED suitable for direct viewing or as a backlight with light guides. For indicator applications, consider the required luminous intensity (200 mcd typ) against the ambient light conditions. The diffused package provides a wide, uniform light pattern.

9. Frequently Asked Questions (Based on Technical Parameters)

Q1: Can I drive this LED at 30mA for more brightness?
A: No. The Absolute Maximum Rating for continuous forward current is 25mA. Exceeding this rating risks permanent damage and voiding reliability specifications. For higher brightness, select an LED rated for a higher current.

Q2: What is the difference between Peak Wavelength (575nm) and Dominant Wavelength (573nm)?
A: Peak Wavelength is the physical peak of the spectral emission curve. Dominant Wavelength is the perceptual \"color\" point as seen by the human eye, calculated from the spectrum and the CIE color matching functions. They are often close but not identical.

Q3: Is a current-limiting resistor sufficient to drive this LED from a 5V supply?
A: It can be, but it's not optimal. A resistor value would need to be calculated for the worst-case Vf (to prevent over-current). This leads to varying brightness between LEDs and inefficient power use. A simple constant-current circuit or dedicated LED driver IC is preferred for consistent performance.

Q4: How critical is the 3mm minimum distance from the solder joint to the epoxy bulb?
A: Very critical. Soldering closer than 3mm can expose the epoxy resin to excessive heat, potentially causing cracking, discoloration (yellowing), delamination, or internal wire bond failure, leading to immediate or premature device failure.

10. Technology and Operating Principle

This LED is based on AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor material. When a forward voltage is applied across the p-n junction, electrons and holes are injected into the active region where they recombine. In AlGaInP LEDs, this recombination releases energy in the form of photons (light) in the yellow-green region of the visible spectrum (around 573-575 nm). The specific color is determined by the precise composition of the AlGaInP alloy. The green diffused resin encapsulant protects the semiconductor chip, acts as a lens to shape the light output beam (25° viewing angle), and converts the point-source light into a more uniform, diffuse emission suitable for indicators and backlights.