LED Lamp 1224SYGC/S530-E2 Datasheet - Brilliant Yellow Green - 25mA - 60mW - English Technical Document

1. Product Overview

The 1224SYGC/S530-E2 is a high-brightness LED lamp designed for applications requiring superior luminous intensity. It utilizes AlGaInP chip technology to produce a brilliant yellow-green color with a water-clear resin encapsulation. This component is characterized by its reliability, robustness, and compliance with environmental standards such as being Pb-free and RoHS compliant.

1.1 Core Advantages

• High Brightness: Specifically engineered for applications demanding higher luminous output.
• Choice of Viewing Angles: Available in various configurations to suit different application needs.
• Robust Packaging: Designed for reliable performance in various environments.
• Environmental Compliance: Lead-free and RoHS compliant.
• Packaging Flexibility: Available on tape and reel for automated assembly processes.

1.2 Target Market & Applications

This LED is targeted at consumer electronics and display backlighting markets. Its primary applications include:

• Television sets
• Computer monitors
• Telephones
• General computer peripherals and indicators

2. Technical Parameter Deep Dive

This section provides a detailed, objective interpretation of the key technical parameters specified in the datasheet.

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation at or near these limits is not recommended for extended periods.

• Continuous Forward Current (I_F): 25 mA. This is the maximum DC current that can be continuously applied.
• Peak Forward Current (I_FP): 60 mA. This higher current is permissible only under pulsed conditions (duty cycle 1/10 at 1 kHz).
• Reverse Voltage (V_R): 5 V. Exceeding this voltage in reverse bias can cause junction breakdown.
• Power Dissipation (P_d): 60 mW. The maximum power the package can dissipate at an ambient temperature of 25°C.
• Operating & Storage Temperature: Ranges from -40°C to +85°C (operating) and -40°C to +100°C (storage).
• Soldering Temperature (T_sol): Withstands 260°C for 5 seconds, which is compatible with standard lead-free reflow profiles.

2.2 Electro-Optical Characteristics

These parameters are measured under standard test conditions (Ta=25°C, I_F=20mA) and define the device's performance.

• Luminous Intensity (I_v): Typical value is 100.0 mcd, with a minimum of 63.0 mcd. This indicates a bright output suitable for indicator applications.
• Viewing Angle (2θ_1/2): 25 degrees. This is a relatively narrow viewing angle, concentrating light in a forward-directed beam.
• Peak Wavelength (λ_p): 575 nm. The wavelength at which the emitted optical power is maximum.
• Dominant Wavelength (λ_d): 573 nm. The single wavelength perceived by the human eye that matches the color of the LED.
• Forward Voltage (V_F): Typically 2.0V, ranging from 1.7V to 2.4V at 20mA. This is important for driver circuit design and power consumption calculation.
• Reverse Current (I_R): Maximum of 10 µA at V_R=5V, indicating good junction quality.

Measurement Tolerances: The datasheet notes specific uncertainties: ±0.1V for V_F, ±10% for I_v, and ±1.0nm for λ_d. These must be accounted for in critical design applications.

3. Performance Curve Analysis

The typical characteristic curves provide insight into the device's behavior under varying conditions.

3.1 Spectral Distribution & Directivity

The Relative Intensity vs. Wavelength curve shows a narrow spectrum centered around 575 nm, characteristic of AlGaInP technology, resulting in a saturated yellow-green color. The Directivity curve visually confirms the 25-degree viewing angle, showing how light intensity drops off at angles beyond the half-intensity points.

3.2 Electrical & Thermal Relationships

• Forward Current vs. Forward Voltage (I-V Curve): This curve is non-linear, typical of a diode. The voltage increases logarithmically with current. Designers use this to determine the necessary drive voltage for a target current.
• Relative Intensity vs. Forward Current: Luminous output increases with current but may not be perfectly linear, especially at higher currents where efficiency can drop due to heating.
• Relative Intensity vs. Ambient Temperature: LED light output generally decreases as ambient temperature rises. This curve quantifies that derating, which is crucial for thermal management in the application.
• Forward Current vs. Ambient Temperature: This curve likely illustrates the maximum allowable forward current derating as temperature increases to stay within the power dissipation limit, ensuring long-term reliability.

4. Mechanical & Package Information

4.1 Package Dimensions

The LED features a standard radial leaded package (often referred to as a \"lamp\" package). Key dimensional notes from the datasheet include:

• All dimensions are in millimeters.
• The flange height must be less than 1.5mm (0.059\").
• A standard tolerance of ±0.25mm applies unless otherwise specified.

Design Implication: The exact dimensions provided in the drawing are critical for PCB footprint design, ensuring proper fit and alignment during assembly.

4.2 Polarity Identification

For radial LED packages, the cathode is typically identified by a flat spot on the rim of the lens, a shorter lead, or other marking. The specific identification method should be cross-referenced with the package dimension drawing.

5. Soldering & Assembly Guidelines

Proper handling is essential to prevent damage and ensure reliability.

5.1 Lead Forming

• Bend leads at a point at least 3mm from the epoxy bulb base.
• Perform forming before soldering.
• Avoid stressing the package. Misaligned PCB holes causing lead stress can degrade the epoxy and the LED.
• Cut leads at room temperature.

5.2 Storage Conditions

• Store at ≤30°C and ≤70% Relative Humidity after receipt.
• Shelf life is 3 months under these conditions. For longer storage (up to 1 year), use a sealed container with nitrogen and desiccant.
• Avoid rapid temperature changes in humid environments to prevent condensation.

5.3 Soldering Parameters

Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.

• Hand Soldering: Iron tip temperature max 300°C (for a 30W iron), soldering time max 3 seconds.
• Wave/Dip Soldering: Preheat max 100°C for 60 sec. Solder bath max 260°C for 5 seconds.
• Avoid stress on leads during high-temperature processes.
• Do not solder (dip/hand) more than once.
• Allow LEDs to cool to room temperature gradually after soldering, protecting them from shock/vibration during cooling.

5.4 Cleaning

If necessary, clean only with isopropyl alcohol at room temperature for ≤1 minute. Do not use ultrasonic cleaning unless pre-qualified, as it can cause damage.

5.5 Heat Management

Thermal management is critical. The operating current should be appropriately derated based on the ambient temperature, referring to the derating curve in the specification. Inadequate heat sinking can lead to reduced light output, color shift, and shortened lifespan.

6. Packaging & Ordering Information

6.1 Packing Specification

The LEDs are packaged to prevent electrostatic discharge (ESD) and moisture damage:

• Packed in anti-electrostatic bags.
• Placed in inner cartons.
• Shipped in outside cartons.

6.2 Packing Quantity

• Minimum 200 to 1000 pieces per bag.
• 5 bags per inner carton.
• 10 inner cartons per outside carton.

6.3 Label Explanation

Labels on packaging include codes for tracking and specification:

• CPN: Customer's Part Number.
• P/N: Manufacturer's Part Number (e.g., 1224SYGC/S530-E2).
• QTY: Quantity contained.
• CAT: Ranks or performance bins.
• HUE: Dominant Wavelength code.
• LOT No: Traceable manufacturing lot number.

7. Application Suggestions

7.1 Typical Application Scenarios

Beyond the listed applications (TV, Monitor, Phone), this LED is suitable for:

• Status indicators on industrial equipment.
• Backlighting for small LCD displays.
• Panel-mounted indicator lights.
• Automotive interior indicators (contingent on further qualification for automotive standards).

7.2 Design Considerations

• Current Limiting: Always use a series resistor or constant current driver to limit current to ≤25mA continuous.
• PCB Layout: Ensure holes match lead spacing precisely to avoid mechanical stress.
• Thermal Design: In high-ambient-temperature or high-current applications, consider the PCB's ability to act as a heat sink or provide additional cooling.
• ESD Protection: While the bag is anti-static, handling during assembly should follow ESD protocols.

8. Frequently Asked Questions (Based on Technical Parameters)

Q1: Can I drive this LED at 30mA for higher brightness?
A1: No. The Absolute Maximum Rating for continuous forward current is 25mA. Exceeding this rating risks permanent damage and voids reliability specifications. For higher brightness, select an LED rated for a higher current.

Q2: The typical V_F is 2.0V, but my circuit uses a 5V supply. What resistor value should I use?
A2> For a target current of 20mA: R = (V_supply - V_F) / I_F = (5V - 2.0V) / 0.020A = 150 Ω. Use a standard 150Ω resistor. Always calculate using the maximum possible V_F (2.4V) to ensure current does not exceed limits if you get a high-V_F part: R_min = (5V - 2.4V) / 0.025A = 104 Ω.

Q3: What does \"water clear\" resin mean?
A3> It means the epoxy lens is completely transparent, not diffused or tinted. This results in the most intense, saturated color from the chip but may cause the light source (the small chip) to be more visible as a \"hot spot\" compared to a diffused lens.

Q4: How critical is the 3mm minimum distance for lead bending and soldering?
A4> Very critical. Bending or soldering closer to the epoxy bulb transfers heat and mechanical stress directly to the semiconductor die and the wire bonds inside, which are fragile. This can cause immediate failure or latent reliability issues.

9. Technology Introduction & Trends

9.1 Principle of Operation

This LED is based on AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor material. When a forward voltage is applied, electrons and holes recombine in the active region of the semiconductor, releasing energy in the form of photons (light). The specific composition of the AlGaInP alloy determines the bandgap energy, which directly defines the peak wavelength of the emitted light, in this case, in the yellow-green spectrum (~573-575 nm). The water-clear epoxy package acts as a lens, shaping the light output and providing environmental protection.

9.2 Development Trends

While this is a mature through-hole package, industry trends are moving towards:

• Surface-Mount Device (SMD) Packages: For automated assembly and smaller form factors.
• Higher Efficiency: Ongoing material and epitaxial growth improvements yield more lumens per watt (efficacy).
• Improved Color Consistency: Tighter binning of wavelength and luminous intensity.
• Integration: Combining multiple LED chips or adding control electronics into single packages.

The 1224SYGC/S530-E2 represents a reliable, well-characterized solution in a classic package format, suitable for applications where its specific optical characteristics and through-hole mounting are advantageous.