LED Lamp 313-2SYGC/S530-E2 Datasheet - Brilliant Yellow Green - 20mA - 500mcd - English Technical Document

1. Product Overview

The 313-2SYGC/S530-E2 is a high-brightness LED lamp designed for applications requiring superior luminous output. It utilizes AlGaInP chip technology to produce a brilliant yellow-green color with a water-clear resin encapsulation. This component is characterized by its reliability, robustness, and compliance with environmental standards such as being lead-free and RoHS compliant.

1.1 Core Advantages

• High Brightness: Specifically engineered for applications demanding higher luminous intensity.
• Versatile Viewing Angles: Available in various viewing angles to suit different application needs.
• Robust Packaging: Designed for reliability in diverse operating conditions.
• Environmental Compliance: Pb-free and RoHS compliant.
• Packaging Options: Available on tape and reel for automated assembly processes.

1.2 Target Applications

This LED is suitable for a range of electronic devices and indicators, including but not limited to:

• Television sets
• Computer monitors
• Telephones
• General computer peripherals and indicator lights

2. Technical Parameter Deep-Dive

This section provides a detailed, objective interpretation of the key electrical, optical, and thermal parameters defined in the datasheet.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation at or near these limits is not recommended for extended periods.

• Continuous Forward Current (I_F): 25 mA. The maximum DC current that can be continuously applied.
• Peak Forward Current (I_FP): 60 mA (at 1/10 duty cycle, 1 kHz). For pulsed operation.
• Reverse Voltage (V_R): 5 V. Exceeding this can cause junction breakdown.
• Power Dissipation (P_d): 60 mW. The maximum power the package can dissipate.
• Operating Temperature (T_opr): -40°C to +85°C. The ambient temperature range for reliable operation.
• Storage Temperature (T_stg): -40°C to +100°C.
• ESD (HBM): 2000 V. Electrostatic discharge sensitivity level.
• Soldering Temperature (T_sol): 260°C for 5 seconds. The maximum thermal profile for soldering.

2.2 Electro-Optical Characteristics

These are the typical performance parameters measured under standard test conditions (Ta=25°C, I_F=20mA unless specified).

• Luminous Intensity (I_v): Typical 500 mcd, Minimum 250 mcd. A measure of the perceived brightness.
• Viewing Angle (2θ_1/2): Typical 20 degrees. The angle at which luminous intensity is half the peak value.
• Peak Wavelength (λ_p): 575 nm. The wavelength at which the spectral emission is strongest.
• Dominant Wavelength (λ_d): 573 nm. The single wavelength perceived by the human eye.
• Spectrum Radiation Bandwidth (Δλ): 20 nm. The width of the emitted spectrum.
• Forward Voltage (V_F): Typical 2.0 V, Range 1.7 V to 2.4 V. The voltage drop across the LED at the test current.
• Reverse Current (I_R): Maximum 10 μA at V_R=5V.

Note on Measurement Uncertainty: Forward Voltage (±0.1V), Luminous Intensity (±10%), Dominant Wavelength (±1.0nm).

3. Performance Curve Analysis

The datasheet includes several characteristic curves that illustrate device behavior under varying conditions.

3.1 Relative Intensity vs. Wavelength

This curve shows the spectral power distribution, confirming the narrow-band emission centered around 575 nm (yellow-green) typical of AlGaInP technology.

3.2 Directivity Pattern

Illustrates the spatial distribution of light, correlating with the 20-degree viewing angle specification.

3.3 Forward Current vs. Forward Voltage (I-V Curve)

This fundamental curve shows the exponential relationship between current and voltage. The typical V_F of 2.0V at 20mA is a key design parameter for current-limiting resistor calculation.

3.4 Relative Intensity vs. Forward Current

Shows how light output increases with drive current. It is crucial for understanding efficiency and for designing circuits where brightness modulation via current is required.

3.5 Temperature Dependence Curves

Relative Intensity vs. Ambient Temperature: Shows the decrease in luminous output as junction temperature rises, highlighting the importance of thermal management.
Forward Current vs. Ambient Temperature: May illustrate changes in electrical characteristics with temperature.

4. Mechanical and Package Information

4.1 Package Dimensions

The LED features a standard radial leaded package. Key dimensional notes from the datasheet include:

• All dimensions are in millimeters (mm).
• The height of the flange must be less than 1.5mm (0.059\").
• General tolerance is ±0.25mm unless otherwise specified.

Detailed dimensioned drawing is provided in the original datasheet for precise PCB footprint design.

4.2 Polarity Identification

Polarity is typically indicated by lead length (longer lead is anode) or a flat spot on the package flange. The datasheet drawing specifies the anode and cathode.

5. Soldering and Assembly Guidelines

Proper handling is critical to maintain device reliability and performance.

5.1 Lead Forming

• Bend leads at a point at least 3mm from the epoxy bulb base.
• Perform forming before soldering.
• Avoid stressing the package. Misalignment during PCB mounting can cause resin deterioration.
• Cut leads at room temperature.

5.2 Storage Conditions

• Recommended: ≤30°C, ≤70% Relative Humidity.
• Storage life after shipping: 3 months under above conditions.
• For longer storage (up to 1 year): Use a sealed container with nitrogen atmosphere and desiccant.
• Avoid rapid temperature transitions in humid environments to prevent condensation.

5.3 Soldering Process

Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.

Hand Soldering:
- Iron tip temperature: Max 300°C (for 30W iron max).
- Soldering time: Max 3 seconds.

Dip (Wave) Soldering:
- Preheat temperature: Max 100°C (for max 60 seconds).
- Solder bath temperature & time: Max 260°C for 5 seconds.

Critical Soldering Notes:

• Avoid stress on leads at high temperatures.
• Do not solder (dip or hand) more than once.
• Protect the LED from mechanical shock until it cools to room temperature after soldering.
• Avoid rapid cooling from peak temperature.
• Always use the lowest possible soldering temperature.
• Follow the recommended soldering profile for wave soldering.

5.4 Cleaning

• Use isopropyl alcohol at room temperature for no more than one minute if necessary.
• Dry at room temperature.
• Avoid ultrasonic cleaning. If absolutely necessary, pre-qualify the process to ensure no damage occurs.

5.5 Heat Management

Thermal management is essential for longevity and stable performance. The operating current should be de-rated appropriately based on the ambient temperature, referring to the de-rating curve. Design must consider the temperature surrounding the LED in the application.

6. Packaging and Ordering Information

6.1 Packing Specification

The product is packaged to prevent electrostatic discharge and moisture ingress.

• Primary Packing: Anti-electrostatic bag.
• Secondary Packing: Inner carton.
• Tertiary Packing: Outside carton.

Packing Quantity:
1. Minimum 200 to 500 pieces per bag. 5 bags per inner carton.
2. 10 inner cartons per outside carton.

6.2 Label Explanation

Labels on packaging include fields such as: CPN (Customer's Part Number), P/N (Production Part Number), QTY (Quantity), CAT (Ranks/Bin), HUE (Dominant Wavelength), REF (Reference), and LOT No (Lot Number).

7. Application Suggestions and Design Considerations

7.1 Typical Application Circuits

For basic indicator use, a simple series current-limiting resistor is required. The resistor value (R) can be calculated using: R = (V_supply - V_F) / I_F. Using the typical V_F of 2.0V and a desired I_F of 20mA with a 5V supply: R = (5V - 2.0V) / 0.020A = 150 Ω. A standard 150Ω resistor with sufficient power rating (P = I²R = 0.06W) should be used.

7.2 Design Considerations

• Current Driving: Always drive LEDs with a constant current or a voltage source with a series resistor. Never connect directly to a voltage source.
• Thermal Design: Ensure adequate PCB copper area or other heatsinking if operating near maximum ratings or in high ambient temperatures to prevent premature lumen depreciation.
• ESD Protection: Implement ESD protection measures during handling and assembly, as the device is rated for 2000V HBM.
• Optical Design: The 20-degree viewing angle makes it suitable for directed illumination or indicator purposes where a narrower beam is desired.

8. Frequently Asked Questions (Based on Technical Parameters)

Q1: What is the difference between Peak Wavelength (575nm) and Dominant Wavelength (573nm)?
A1: Peak Wavelength is the physical peak of the spectral emission curve. Dominant Wavelength is the single wavelength that would produce the same perceived color. The small difference is normal for LEDs.

Q2: Can I drive this LED at 25mA continuously?
A2: Yes, 25mA is the Absolute Maximum Continuous Forward Current. For optimal lifetime and reliability, operating at or below the typical test condition of 20mA is recommended.

Q3: Why is the storage condition so specific (≤30°C/70%RH for 3 months)?
A3: This prevents moisture absorption into the plastic package. Excessive moisture can lead to \"popcorning\" or internal delamination during the high-temperature soldering process.

Q4: How do I interpret the \"Typical\" value in the Electro-Optical Characteristics table?
A4: The \"Typical\" value is the expected average under test conditions. Actual values for individual units will fall within the Min/Max range. Design should consider the Min value for intensity if a brightness threshold is critical.

9. Technology Introduction and Operating Principle

The 313-2SYGC/S530-E2 LED is based on AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor material. This material system is highly efficient for producing light in the yellow, orange, red, and green regions of the spectrum. When a forward voltage is applied across the p-n junction, electrons and holes recombine, releasing energy in the form of photons. The specific composition of the AlGaInP layers determines the bandgap energy and thus the wavelength (color) of the emitted light—in this case, brilliant yellow-green at 573/575 nm. The water-clear epoxy resin acts as a protective encapsulant and a primary optical element, helping to shape the light output and enhance extraction efficiency.