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LED Lamp 1533SURD/S530-A3 Datasheet - Brilliant Red - 20mcd - 2.0V - 60mW - English Technical Document

Complete technical datasheet for the 1533SURD/S530-A3 LED lamp. Features include brilliant red color, 20mcd luminous intensity, 2.0V forward voltage, 170-degree viewing angle, and RoHS compliance. Includes specifications, curves, dimensions, and application guidelines.
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PDF Document Cover - LED Lamp 1533SURD/S530-A3 Datasheet - Brilliant Red - 20mcd - 2.0V - 60mW - English Technical Document

1. Product Overview

This document provides the complete technical specifications for the 1533SURD/S530-A3 LED lamp. This component is a surface-mount device (SMD) LED designed for applications requiring reliable performance and consistent light output. The primary application areas include backlighting for consumer electronics and indicator functions.

1.1 Core Features and Advantages

The LED offers several key features that make it suitable for a wide range of electronic designs. It is available with a choice of various viewing angles, providing design flexibility for different light distribution requirements. The component is supplied on tape and reel, which is ideal for automated assembly processes, enhancing manufacturing efficiency. It is constructed to be reliable and robust, ensuring stable performance over its operational life. The product is lead-free (Pb-free) and is designed to remain compliant with the RoHS (Restriction of Hazardous Substances) directive, adhering to environmental regulations.

1.2 Target Market and Applications

This LED series is specially engineered for applications demanding higher brightness levels. The LEDs are available in different colors and intensities, allowing for customization based on specific design needs. Typical applications include television sets, computer monitors, telephones, and general computer peripherals, where they are commonly used for status indicators, backlighting for buttons, or display illumination.

2. Technical Parameter Deep Dive

This section provides a detailed, objective analysis of the LED's electrical, optical, and thermal characteristics as defined in the datasheet.

2.1 Device Selection and Material Composition

The LED utilizes an AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor chip material. This material system is known for producing high-efficiency light emission in the red to amber spectrum. The emitted color is specified as Brilliant Red, and the resin color of the LED package is Red Diffused, which helps in scattering the light to achieve the specified wide viewing angle.

2.2 Absolute Maximum Ratings

The Absolute Maximum Ratings define the stress limits beyond which permanent damage to the device may occur. These ratings are specified at an ambient temperature (Ta) of 25°C. The continuous forward current (IF) must not exceed 25 mA. For pulsed operation, a peak forward current (IFP) of 60 mA is allowed under a duty cycle of 1/10 at 1 kHz. The maximum reverse voltage (VR) the LED can withstand is 5 V. The total power dissipation (Pd) for the device is limited to 60 mW. The operating temperature range (Topr) is from -40°C to +85°C, and the storage temperature range (Tstg) is from -40°C to +100°C. The soldering temperature (Tsol) is specified as 260°C for a maximum duration of 5 seconds, which is a standard requirement for lead-free soldering processes.

2.3 Electro-Optical Characteristics

The Electro-Optical Characteristics are measured at a standard test condition of Ta=25°C and a forward current (IF) of 20 mA, unless otherwise noted. The luminous intensity (Iv) has a typical value of 20 millicandelas (mcd) with a minimum of 10 mcd. The viewing angle (2θ1/2), defined as the angle where the luminous intensity drops to half of its peak value, is typically 170 degrees, indicating a very wide emission pattern. The peak wavelength (λp) is typically 632 nanometers (nm), and the dominant wavelength (λd) is typically 624 nm, both falling within the red region of the visible spectrum. The spectrum radiation bandwidth (Δλ) is typically 20 nm. The forward voltage (VF) typically measures 2.0 volts, with a range from 1.7 V (min) to 2.4 V (max) at 20 mA. The reverse current (IR) has a maximum value of 10 microamperes (μA) when a reverse voltage of 5 V is applied.

The datasheet includes important notes on measurement uncertainty: ±0.1V for forward voltage, ±10% for luminous intensity, and ±1.0nm for dominant wavelength. These tolerances must be considered during circuit design and quality control.

3. Performance Curve Analysis

Graphical data provides deeper insight into the LED's behavior under varying conditions.

3.1 Relative Intensity vs. Wavelength

The curve shows the spectral power distribution of the emitted light. It typically peaks around 632 nm (red) with a defined bandwidth, confirming the color purity. The directivity pattern plot illustrates the intensity distribution across the 170-degree viewing angle, showing a Lambertian or near-Lambertian emission profile common for diffused LEDs.

3.2 Forward Current vs. Forward Voltage (IV Curve)

This fundamental curve depicts the relationship between the current flowing through the LED and the voltage across it. It is non-linear, characteristic of a diode. The curve shows that at the typical operating current of 20 mA, the forward voltage is approximately 2.0V. Designers use this curve to determine the necessary current-limiting resistor value for a given supply voltage.

3.3 Relative Intensity vs. Forward Current

This graph shows how the light output (relative intensity) increases with increasing forward current. It is generally linear within the recommended operating range but may saturate or cause excessive heating at currents approaching the absolute maximum ratings.

3.4 Temperature Dependence

Two key graphs analyze temperature effects: Relative Intensity vs. Ambient Temperature and Forward Current vs. Ambient Temperature. The first typically shows a decrease in light output as ambient temperature rises, which is a critical factor for thermal management in high-brightness or high-density applications. The second may show the relationship between the diode's forward voltage and temperature, which can be used for temperature sensing in some applications, though not explicitly stated here.

4. Mechanical and Package Information

4.1 Package Dimensions

The datasheet includes a detailed mechanical drawing of the LED package. All dimensions are provided in millimeters. Key notes specify that the height of the flange must be less than 1.5mm (0.059 inches) and that, unless otherwise declared, the general tolerance on dimensions is ±0.25mm. The drawing defines the lead spacing, body size, and overall footprint, which are essential for PCB (Printed Circuit Board) layout design.

4.2 Polarity Identification

While not explicitly detailed in the provided text, standard LED packages have anode and cathode markings, often indicated by a longer lead (anode), a flat edge on the package, or a dot near the cathode. The PCB layout must respect this polarity.

5. Soldering and Assembly Guidelines

Proper handling is crucial for reliability. This section consolidates the critical notes from the datasheet.

5.1 Lead Forming

If leads need to be bent, it must be done at a point at least 3mm from the base of the epoxy bulb. Forming should always occur before soldering. Stress on the LED package during forming must be avoided to prevent internal damage or breakage. Leads should be cut at room temperature. PCB holes must align perfectly with the LED leads to avoid mounting stress.

5.2 Storage Conditions

LEDs should be stored at 30°C or less and 70% relative humidity (RH) or less. The recommended storage life after shipping is 3 months. For longer storage (up to one year), they should be kept in a sealed container with a nitrogen atmosphere and moisture-absorbent material. Rapid temperature changes in humid environments should be avoided to prevent condensation.

5.3 Soldering Process

The solder joint must be at least 3mm away from the epoxy bulb. Recommended conditions are:
Hand Soldering: Iron tip temperature maximum 300°C (for a 30W max iron), soldering time maximum 3 seconds.
Wave/DIP Soldering: Preheat temperature maximum 100°C (for 60 seconds max), solder bath temperature maximum 260°C for 5 seconds maximum.
A soldering profile graph is recommended for process control. Stress should not be applied to the leads while the LED is hot. Dip and hand soldering should not be performed more than once. After soldering, the LED must be protected from mechanical shock until it cools to room temperature. A rapid cooling process is not recommended.

5.4 Cleaning

If cleaning is necessary, use isopropyl alcohol at room temperature for no more than one minute, then air dry. Ultrasonic cleaning is generally not recommended. If it must be used, the process parameters (power, time) must be pre-qualified to ensure no damage occurs.

5.5 Heat Management

Thermal management is a critical design consideration. The operating current should be appropriately de-rated based on the ambient temperature, referring to de-rating curves if provided. The temperature surrounding the LED in the application must be controlled to ensure long-term reliability and maintain light output.

6. Packaging and Ordering Information

6.1 Packing Specification

The LEDs are packaged to prevent electrostatic discharge (ESD) and moisture damage. They are placed in anti-electrostatic bags. These bags are then packed into inner cartons, which are subsequently placed into outside cartons for shipping.

6.2 Packing Quantity

The standard packing quantity is a minimum of 200 to 500 pieces per anti-static bag. Four bags are packed into one inner carton. Ten inner cartons are packed into one outside carton.

6.3 Label Explanation

Labels on the packaging contain several codes: CPN (Customer's Production Number), P/N (Production Number), QTY (Packing Quantity), CAT (Ranks - likely a performance binning code), HUE (Dominant Wavelength), REF (Reference), and LOT No (Lot Number for traceability).

7. Application Suggestions and Design Considerations

7.1 Typical Application Circuits

The most common application is as an indicator light driven by a DC voltage source through a current-limiting resistor. The resistor value (R) is calculated using Ohm's Law: R = (V_supply - V_F) / I_F, where V_F is the forward voltage of the LED (use 2.0V typical or 2.4V max for robust design) and I_F is the desired forward current (e.g., 20 mA). For example, with a 5V supply: R = (5V - 2.0V) / 0.020A = 150 Ohms. A slightly higher value resistor (e.g., 180 Ohms) provides a safety margin.

7.2 Design Considerations

8. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the difference between peak wavelength and dominant wavelength?
A: Peak wavelength (λp) is the wavelength at which the emitted optical power is maximum. Dominant wavelength (λd) is the single wavelength of monochromatic light that matches the perceived color of the LED's light. For LEDs, the dominant wavelength is often more relevant to human color perception.

Q: Can I operate this LED at its absolute maximum continuous current of 25mA?
A: While possible, it is not recommended for reliable long-term operation. Operating at the typical 20mA provides a safety margin against variations in forward voltage, supply voltage, and temperature, which could otherwise push the device beyond its limits.

Q: Why is the soldering joint required to be 3mm from the epoxy bulb?
A> This distance prevents excessive heat from the soldering iron or solder wave from transferring to the sensitive epoxy lens and the internal semiconductor die, which could cause cracking, discoloration (yellowing), or degradation of the optical and electrical properties.

Q: The luminous intensity has a ±10% measurement uncertainty. How does this affect my design?
A: This tolerance means the actual light output between different units of the same model can vary. If consistent brightness is critical for your application (e.g., in an array of indicators), you may need to implement a calibration step, use LEDs from the same production lot, or select parts binned for intensity (if available).

9. Technical Comparison and Positioning

While a direct comparison with other specific models is not provided in this datasheet, the key differentiators of this LED can be inferred. Its primary advantages include a very wide 170-degree viewing angle, which is excellent for omnidirectional indicators. The use of AlGaInP technology typically offers higher efficiency and better color saturation in the red spectrum compared to older technologies. The combination of a typical 20mcd intensity at 20mA with a low 2.0V forward voltage makes it energy-efficient. The comprehensive soldering and handling guidelines indicate it is designed for standard industrial assembly processes. The RoHS and lead-free compliance ensures it meets modern environmental standards for electronics manufacturing.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.