1. Product Overview
This document provides the complete technical specifications for the 333-2SURD/S530-A3 LED lamp. This component is a through-hole mount, 5mm diameter LED designed to deliver reliable and robust performance in a variety of indicator and backlighting applications. The device utilizes an AlGaInP (Aluminum Gallium Indium Phosphide) chip material to produce a brilliant red diffused light output, encapsulated in a red diffused resin package. Its primary design focus is on providing higher brightness suitable for consumer electronics where clear visual signaling is required.
The LED is available on tape and reel for automated assembly processes and is compliant with RoHS (Restriction of Hazardous Substances) directives, being manufactured as a lead-free (Pb-free) component. This makes it suitable for use in products marketed globally under modern environmental regulations.
2. Technical Parameters and Specifications
2.1 Absolute Maximum Ratings
The absolute maximum ratings define the limits beyond which permanent damage to the device may occur. These ratings are specified at an ambient temperature (Ta) of 25°C and must not be exceeded under any operating conditions.
- Continuous Forward Current (IF): 25 mA. This is the maximum DC current that can be continuously applied to the LED.
- Peak Forward Current (IFP): 60 mA. This is the maximum pulsed forward current, permissible under a duty cycle of 1/10 at a frequency of 1 kHz.
- Reverse Voltage (VR): 5 V. Applying a reverse voltage exceeding this value can damage the LED's semiconductor junction.
- Power Dissipation (Pd): 60 mW. This is the maximum power the device can dissipate.
- Operating Temperature Range (Topr): -40°C to +85°C. The ambient temperature range within which the LED is designed to function.
- Storage Temperature Range (Tstg): -40°C to +100°C.
- Soldering Temperature (Tsol): 260°C for 5 seconds. The maximum temperature and time the leads can be subjected to during wave or hand soldering.
2.2 Electro-Optical Characteristics
The electro-optical characteristics are measured at a standard test condition of Ta=25°C and a forward current (IF) of 20 mA, unless otherwise specified. These parameters define the typical performance of the LED.
- Luminous Intensity (Iv): 100 mcd (Min), 200 mcd (Typ). This specifies the amount of visible light the LED emits. The typical value of 200 millicandelas indicates a medium-brightness output for a standard 5mm LED.
- Viewing Angle (2θ1/2): 30° (Typ). This is the full angle at which the luminous intensity is half of the intensity at 0° (on-axis). A 30° angle indicates a relatively narrow beam, suitable for directed indicator lights.
- Peak Wavelength (λp): 632 nm (Typ). The wavelength at which the spectral power distribution of the emitted light is maximum.
- Dominant Wavelength (λd): 624 nm (Typ). The single wavelength that describes the perceived color of the light. This value places the LED in the brilliant red color region.
- Spectrum Radiation Bandwidth (Δλ): 20 nm (Typ). The spectral width of the emitted light, measured at half the maximum intensity (FWHM).
- Forward Voltage (VF): 2.0 V (Min), 2.4 V (Typ). The voltage drop across the LED when driven at the specified 20 mA current. Designers must ensure the driving circuit can provide this voltage.
- Reverse Current (IR): 10 μA (Max) at VR=5V. The small leakage current that flows when the LED is reverse-biased.
Measurement Tolerances: The datasheet notes specific uncertainties: ±0.1V for Forward Voltage, ±10% for Luminous Intensity, and ±1.0nm for Dominant Wavelength. These must be accounted for in critical design applications.
3. Performance Curve Analysis
The datasheet includes several characteristic graphs that illustrate the LED's behavior under varying conditions. Understanding these curves is crucial for optimal circuit design and thermal management.
3.1 Relative Intensity vs. Wavelength
This graph shows the spectral distribution of the emitted light. It will typically peak around the specified 632 nm (Typ) with a bandwidth (FWHM) of approximately 20 nm, confirming the monochromatic red output characteristic of AlGaInP technology.
3.2 Directivity Pattern
This polar plot visualizes the 30° viewing angle, showing how the light intensity decreases as the observation angle moves away from the central axis. This pattern is crucial for applications requiring specific beam shapes.
3.3 Forward Current vs. Forward Voltage (IV Curve)
This curve demonstrates the exponential relationship between current and voltage in a diode. For this LED, at the typical operating point of 20 mA, the forward voltage is approximately 2.4V. The curve helps in selecting appropriate current-limiting resistors or designing constant-current drivers.
3.4 Relative Intensity vs. Forward Current
This graph shows that light output (intensity) increases with forward current, but not necessarily in a perfectly linear fashion, especially at higher currents. It emphasizes the importance of driving the LED with a stable current, not a voltage, for consistent brightness.
3.5 Temperature Dependence Curves
Two key graphs illustrate temperature effects: Relative Intensity vs. Ambient Temperature: Shows that luminous output generally decreases as the ambient temperature increases. This de-rating must be considered for applications operating in elevated temperature environments. Forward Current vs. Ambient Temperature: May illustrate how the forward voltage characteristic shifts with temperature, which is important for the stability of voltage-driven circuits.
4. Mechanical and Package Information
4.1 Package Dimension Drawing
The LED features a standard 5mm round radial-leaded package. Key dimensions from the drawing include:
- Overall diameter: 5.0mm (nominal).
- Lead spacing: Approximately 2.54mm (0.1 inches), a standard through-hole footprint.
- Minimum bending point: The leads must be bent at a point at least 3mm from the base of the epoxy bulb to avoid stress on the package.
- Flange height: Must be less than 1.5mm.
General dimensional tolerance is ±0.25mm unless otherwise specified on the drawing. Engineers must refer to the exact dimensioned drawing in the original datasheet for precise PCB layout.
4.2 Polarity Identification
The cathode (negative lead) is typically identified by two features: a flat spot on the rim of the LED's plastic flange and a shorter lead length. The anode (positive lead) is longer. Correct polarity must be observed during assembly.
5. Soldering and Assembly Guidelines
Proper handling is critical to ensure reliability and prevent damage to the LED.
5.1 Lead Forming
- Bending must occur at least 3mm from the epoxy bulb base.
- Form leads before soldering.
- Avoid applying stress to the package; misaligned PCB holes can induce stress and degrade the epoxy resin.
- Cut leads at room temperature.
5.2 Storage Conditions
LEDs should be stored at ≤30°C and ≤70% Relative Humidity. The recommended storage life after shipment is 3 months. For longer storage (up to one year), use a sealed container with a nitrogen atmosphere and desiccant.
5.3 Soldering Process
Critical Rule: Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.
Hand Soldering:
- Iron Tip Temperature: 300°C Max (for a 30W Max iron).
- Soldering Time: 3 seconds Max per lead.
Wave (DIP) Soldering:
- Preheat Temperature: 100°C Max (for 60 seconds Max).
- Soldering Bath Temperature & Time: 260°C Max for 5 seconds Max.
A recommended soldering temperature profile is provided, emphasizing a controlled ramp-up, a peak temperature plateau, and a controlled cool-down phase. Avoid rapid cooling. Dip or hand soldering should not be performed more than once. Allow the LED to cool to room temperature naturally after soldering before subjecting it to mechanical shock or vibration.
5.4 Cleaning
If cleaning is necessary, use isopropyl alcohol at room temperature for no more than one minute. Do not use ultrasonic cleaning unless absolutely necessary and only after thorough pre-qualification testing, as ultrasonic energy can damage the internal die or wire bonds.
5.5 Heat Management
Although power dissipation is low (60mW), proper thermal design is still important for longevity. The operating current should be de-rated appropriately if the LED is used in high ambient temperatures. Designers should ensure adequate ventilation and avoid placing the LED near other heat-generating components.
5.6 Electrostatic Discharge (ESD) Protection
The LED is sensitive to ESD. Handling precautions are strongly recommended:
- Use grounded wrist straps and ESD footwear.
- Work on ESD-safe floors and use ESD-safe containers and packaging.
- Employ ionizers to neutralize charges in the work environment.
6. Packaging and Ordering Information
6.1 Packing Specification
The LEDs are packaged to prevent damage during shipping and handling:
- Primary Packing: Anti-electrostatic bags.
- Secondary Packing: Inner cartons, each containing 5 bags.
- Tertiary Packing: Outside cartons, each containing 10 inner cartons.
Packing Quantity: Minimum 200 to 500 pieces per bag. Therefore, one outside carton contains between 10,000 and 25,000 pieces (10 inner cartons * 5 bags * 200-500 pcs).
6.2 Label Explanation
Labels on the packaging contain key information:
- CPN: Customer's Production Number.
- P/N: Production Number (the part number, e.g., 333-2SURD/S530-A3).
- QTY: Packing Quantity.
- CAT / Ranks: May indicate performance bins (e.g., luminous intensity grade).
- HUE: Dominant Wavelength.
- LOT No: Lot Number for traceability.
7. Application Notes and Design Considerations
7.1 Typical Applications
As listed in the datasheet, this LED is suitable for:
- TV sets (status indicators, backlighting).
- Monitors (power/activity lights).
- Telephones (line status, message waiting indicators).
- Computers (power, HDD activity lights).
- General purpose panel indicators, electronic equipment, and consumer appliances requiring a bright, reliable red indicator.
7.2 Circuit Design Considerations
Current Limiting: An LED must always be driven with a current-limiting device, typically a resistor in series with a voltage source. The resistor value (R) can be calculated using Ohm's Law: R = (V_source - V_F) / I_F. For example, with a 5V source, a V_F of 2.4V, and a desired I_F of 20mA: R = (5V - 2.4V) / 0.02A = 130 Ohms. A standard 130Ω or 150Ω resistor would be appropriate, also considering the resistor's power rating (P = I²R).
Viewing Angle: The 30° viewing angle makes this LED ideal for applications where the light needs to be visible primarily from the front, not from wide side angles.
Thermal Management in PCB Layout: While not a high-power device, providing some copper area around the leads on the PCB can help dissipate heat, especially if operating near maximum ratings or in a warm enclosure.
8. Technical Comparison and Differentiation
The 333-2SURD/S530-A3 LED offers specific advantages:
- Chip Technology (AlGaInP): Provides higher efficiency and brighter red/orange/yellow light compared to older technologies like GaAsP, resulting in the specified 200 mcd typical intensity.
- Diffused Lens: The red diffused resin creates a soft, wide viewing spot without a sharp central hotspot, which is aesthetically pleasing for status indicators.
- Robust Construction: The datasheet emphasizes reliable and robust performance, suggesting a design focused on longevity and consistent output.
- Environmental Compliance: Being Pb-free and RoHS compliant is a standard but essential feature for modern electronics manufacturing.
9. Frequently Asked Questions (FAQ)
9.1 What is the difference between Peak Wavelength (λp) and Dominant Wavelength (λd)?
Peak Wavelength is the physical wavelength where the emission spectrum is strongest. Dominant Wavelength is the perceptual color equivalent, calculated from the spectrum and the human eye's sensitivity (CIE color matching functions). For a monochromatic red LED like this one, they are often close, as seen here (632nm vs 624nm).
9.2 Can I drive this LED with a 3.3V supply without a resistor?
No, this is dangerous and will destroy the LED. An LED behaves like a diode; its forward voltage is relatively constant (~2.4V). Connecting it directly to a 3.3V source would cause a very large, uncontrolled current to flow (limited only by the source's internal resistance and the LED's dynamic resistance), quickly exceeding the 25mA continuous current rating and causing catastrophic failure. Always use a series current-limiting resistor or a constant-current driver.
9.3 Why is the storage humidity specified (≤70% RH)?
Moisture can be absorbed by the epoxy package. During the high-temperature soldering process, this trapped moisture can rapidly expand, causing internal cracks or delamination (\"popcorning\"), which can damage the die or wire bonds and lead to immediate or latent failure.
9.4 What does \"Available on tape and reel\" mean?
It means the LEDs are supplied mounted on a continuous carrier tape and wound onto a reel. This format is designed for use with automated pick-and-place machines in high-volume surface-mount assembly lines. Although this is a through-hole component, it can be delivered in this form for automated insertion machines.
10. Operational Principles and Technology Trends
10.1 Basic Operating Principle
An LED is a semiconductor diode. When a forward voltage exceeding its bandgap energy is applied, electrons and holes recombine in the active region (the AlGaInP chip in this case). This recombination releases energy in the form of photons (light). The specific color (wavelength) of the light is determined by the bandgap energy of the semiconductor material. AlGaInP has a bandgap suitable for producing red, orange, and yellow light.
10.2 Industry Context and Trends
While this is a standard through-hole LED, the industry has largely moved towards surface-mount device (SMD) packages like 0603, 0805, and 3528 for most new designs due to their smaller size, suitability for reflow soldering, and lower profile. However, through-hole LEDs like the 5mm round type remain popular for prototyping, hobbyist projects, educational kits, and applications requiring high reliability with manual soldering or where the component itself acts as a panel-mounted indicator extending through an enclosure hole. The technology inside, AlGaInP, continues to be the standard for high-efficiency red, orange, and amber LEDs.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |