1. Product Overview
This document details the specifications for a high-brightness LED lamp designed for applications requiring superior luminous output. The device utilizes AlGaInP chip technology to produce a distinctive Super Sunset Orange color. It is characterized by its reliability, robust construction, and compliance with major environmental and safety standards including RoHS, EU REACH, and Halogen-Free requirements (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm). The LED is available in various viewing angles and packaging options, including tape and reel, to suit different assembly processes.
1.1 Target Applications
The primary applications for this LED lamp include backlighting and indicator functions in consumer electronics and computing devices. Typical use cases are television sets, computer monitors, telephones, and general computer peripherals where consistent, bright orange illumination is required.
2. Technical Specifications Deep Dive
2.1 Absolute Maximum Ratings
The device is designed to operate within strict electrical and thermal limits to ensure long-term reliability. The continuous forward current (IF) is rated at 25 mA, with a peak forward current (IFP) of 160 mA permissible under pulsed conditions (duty cycle 1/10 @ 1 kHz). The maximum reverse voltage (VR) is 5 V. The power dissipation (Pd) is limited to 60 mW. The operational temperature range (Topr) spans from -40°C to +85°C, while storage conditions (Tstg) allow for -40°C to +100°C. The soldering temperature (Tsol) must not exceed 260°C for a duration of 5 seconds during assembly.
2.2 Electro-Optical Characteristics
Key performance parameters are measured at a standard test condition of Ta=25°C and a forward current (IF) of 20 mA. The typical luminous intensity (Iv) is 295 mcd, with a minimum specified value of 188 mcd. The viewing angle (2θ1/2) is typically 25 degrees, providing a focused beam. The optical spectrum is defined by a peak wavelength (λp) of 621 nm and a dominant wavelength (λd) of 615 nm, with a spectral bandwidth (Δλ) of 18 nm. Electrically, the forward voltage (VF) typically measures 2.0 V, ranging from a minimum of 1.7 V to a maximum of 2.4 V. The reverse current (IR) is limited to a maximum of 10 μA at the full reverse voltage of 5 V. Measurement uncertainties are noted for forward voltage (±0.1V), luminous intensity (±10%), and dominant wavelength (±1.0nm).
3. Binning System Explanation
The product utilizes a binning system to categorize units based on key performance parameters, ensuring consistency for the end-user. This is reflected in the packing labels. The CAT code refers to the ranks of Luminous Intensity, the HUE code refers to the ranks of Dominant Wavelength, and the REF code refers to the ranks of Forward Voltage. This allows designers to select LEDs with tightly controlled characteristics for their specific application needs.
4. Performance Curve Analysis
The datasheet provides several characteristic curves that illustrate device behavior under varying conditions. The Relative Intensity vs. Wavelength curve shows the spectral power distribution centered around 621 nm. The Directivity pattern illustrates the spatial radiation profile. The Forward Current vs. Forward Voltage (I-V) curve demonstrates the diode's exponential relationship, crucial for driver design. The Relative Intensity vs. Forward Current curve shows how light output increases with current. Finally, curves depicting Relative Intensity vs. Ambient Temperature and Forward Current vs. Ambient Temperature are essential for understanding thermal derating and performance stability across the operating range.
5. Mechanical and Package Information
The LED features a standard lamp-style package. The package dimension drawing provides critical measurements for PCB footprint design and mechanical integration. Key notes specify that all dimensions are in millimeters, the flange height must be less than 1.5mm, and the general tolerance is ±0.25mm unless otherwise stated. The resin color is water clear, allowing the intrinsic Super Sunset Orange chip color to be visible.
6. Soldering and Assembly Guidelines
Proper handling is critical for reliability. For lead forming, bends must be made at least 3mm from the epoxy bulb base and performed before soldering to avoid stress. PCB holes must align perfectly with LED leads. Storage should be at ≤30°C and ≤70% RH for up to 3 months; longer storage requires a nitrogen atmosphere. Soldering must maintain a minimum 3mm distance from the joint to the epoxy bulb. Recommended conditions are: for hand soldering, an iron tip at ≤300°C for ≤3 seconds; for dip soldering, a preheat of ≤100°C and a bath at ≤260°C for ≤5 seconds. A soldering profile diagram is recommended to follow. Soldering should not be repeated more than once. After soldering, avoid mechanical shock until the LED cools. Cleaning, if necessary, should use room-temperature isopropyl alcohol for ≤1 minute; ultrasonic cleaning is not recommended and requires pre-qualification.
7. Packaging and Ordering Information
The LEDs are packaged to prevent electrostatic discharge and moisture ingress. They are placed in anti-electrostatic bags, which are then packed into inner cartons, and finally into outside cartons. The standard packing quantity is a minimum of 200 to 1000 pieces per bag, with 4 bags per inner carton, and 10 inner cartons per master outside carton. Labels on the packaging include fields for CPN (Customer's Part Number), P/N (Part Number), QTY (Quantity), and the binning codes CAT, HUE, and REF, along with the LOT Number for traceability.
8. Application Recommendations
8.1 Typical Application Scenarios
This LED is ideal for status indicators, backlighting for buttons or small panels, and aesthetic lighting in devices where a warm, sunset-orange hue is desired. Its reliability makes it suitable for consumer electronics expected to have a long service life.
8.2 Design Considerations
Designers must consider current limiting, typically achieved with a series resistor, to operate the LED at or below the 20mA test current for predictable brightness and longevity. Thermal management on the PCB is important, especially if multiple LEDs are used or if the ambient temperature is high, as excessive heat can reduce light output and lifespan. The narrow viewing angle makes it suitable for directed illumination rather than wide-area lighting.
9. Technical Comparison and Differentiation
Compared to standard orange LEDs, this device's use of AlGaInP technology typically offers higher efficiency and brighter output for a given current. The specific Super Sunset Orange color point provides a distinctive aesthetic. Its compliance with modern environmental standards (RoHS, REACH, Halogen-Free) is a key differentiator for markets with strict regulatory requirements. The availability on tape and reel supports high-volume, automated assembly lines.
10. Frequently Asked Questions (FAQ)
Q: What is the difference between peak wavelength and dominant wavelength?
A: Peak wavelength (λp) is the wavelength at which the emitted optical power is maximum. Dominant wavelength (λd) is the single wavelength of monochromatic light that matches the perceived color of the LED. For this orange LED, they are close (621nm vs 615nm).
Q: Can I drive this LED with a constant voltage source?
A: It is not recommended. LEDs are current-driven devices. A constant voltage source without a current-limiting mechanism (like a resistor or constant-current driver) can cause the forward current to exceed maximum ratings, potentially damaging the LED.
Q: Why is the storage time limited to 3 months?
A> This is related to moisture sensitivity. The epoxy package can absorb ambient moisture, which may turn to steam and cause damage (\"popcorning\") during the high-temperature soldering process if the device is not properly baked beforehand.
11. Practical Use Case Example
Consider designing a power indicator for a network router. Using this LED, a designer would calculate a series resistor value based on the supply voltage (e.g., 5V) and the desired operating current (e.g., 15mA for reduced power and longer life). Using the typical VF of 2.0V, the resistor value R = (5V - 2.0V) / 0.015A = 200 Ω. A 200 Ω resistor would be placed in series with the LED on the PCB. The narrow 25-degree viewing angle ensures the indicator light is clearly visible from the front of the device without excessive spill.
12. Technology Principle Introduction
This LED is based on AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor material. When a forward voltage is applied, electrons and holes recombine in the active region of the chip, releasing energy in the form of photons. The specific composition of the AlGaInP layers determines the bandgap energy, which directly corresponds to the wavelength (color) of the emitted light. In this case, the material is engineered to emit photons in the orange-red part of the visible spectrum, around 615-621 nm. The water-clear epoxy lens encapsulates the chip, providing mechanical protection and shaping the light output beam.
13. Technology Development Trends
The general trend in LED technology is toward higher efficiency (more lumens per watt), improved color rendering, and lower cost. For indicator and signaling LEDs like this one, trends include further miniaturization of packages while maintaining or increasing light output, broader adoption of environmentally friendly materials, and enhanced reliability under harsh conditions. Integration of driver circuitry or smart features directly into the LED package is also an area of development, though not yet common for basic lamp-style devices. The underlying AlGaInP material technology is mature but continues to see incremental improvements in epitaxial growth techniques for better internal quantum efficiency and thermal performance.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |