LED Module Specification - 508x18x1.0mm - 30-45V - 4.5-6.75W - 3000K/4000K/6500K CCT

1. Module Description

This LED module is designed according to the mainstream lamp formats in the market, facilitating easy matching and convenient assembly. The module uses 2835 LED packages, known for high luminous efficiency, low heat generation, and environmental friendliness (no mercury). Its electrical parameters align with mainstream LED power supplies, making integration straightforward. The module features low thermal resistance and good heat dissipation, ensuring stable performance. It offers high Color Rendering Index (CRI) and a wide selection of correlated color temperatures (CCT).

2. Module Specification

2.1 Optical-Electrical Characteristics

The optical-electrical characteristics are measured at absolute maximum ratings with Ts=25°C. Three CCT variants are available: RF-MTD302T06-C1 (2870-3220K), RF-MTD402T06-C1 (3700-4275K), and RF-MTD652T06-C1 (5925-7150K). Under a forward current of 150mA, the forward voltage ranges from 30V to 45V, resulting in a power consumption of 4.5W to 6.75W. The luminous flux varies by CCT: for the 3000K variant, typical flux is 570-660 lumens; for the 4000K and 6500K variants, typical flux is 630-720 lumens. The calculated luminous efficacy is approximately 106 to 127 lm/W. The CRI is typically 80 (min) with typ values of 82-84. The color tolerance is within 5-step MacAdam ellipses, ensuring consistent color appearance. Absolute maximum ratings include: forward current 150mA (peak 155mA), reverse voltage 5V, ESD withstand voltage 2000V (HBM), operating temperature -40°C to +85°C, storage temperature -40°C to +100°C, and junction temperature not exceeding 110°C.

2.2 Schematic and Interface Definition

The module features a 1P6S configuration (one parallel branch of six LEDs in series). The input terminals are clearly marked positive and negative. The module input is negative, which should be noted during connection to avoid reverse polarity.

2.3 Naming Rule

The part numbering system provides detailed product information. Taking 'RF-MTD402T06-C1' as an example: 'RF' indicates the manufacturer abbreviation, 'MT' is the module department code, 'D' denotes panel light module type, '40' represents the CCT bin (3700-4275K), '2' indicates the LED package type (2835), 'T' specifies the CRI range (84 typ, 80 min), '06' indicates the power rating (6W), 'C' represents the top-view emitting configuration, and '1' is the version number. This systematic naming allows easy identification of key parameters.

3. Product Specification

3.1 Outline Dimensions

The module dimensions are: length 508mm ±0.3mm, width 18mm ±0.3mm, and PCB thickness 1.0mm ±0.16mm. These dimensions are compatible with standard panel light housings.

4. Reliability Test

The module has been subjected to rigorous reliability tests at a driving current of 150mA. The tests and results are as follows:

• Room Temperature Life Test: 500 hours at Ta=25°C, Tj≤110°C; 0 failures out of 6 samples.
• High Temperature Life Test: 500 hours at Ta=60°C; 0/6 failures.
• High Temperature and Humidity Life Test: 500 hours at 60°C/90%RH; 0/6 failures.
• Thermal Shock: 100 cycles from -40°C to 85°C with 15-minute dwells and 10-second transitions; 0/6 failures.

Acceptance criteria include: luminous flux decay less than 30%, forward voltage shift less than 110% of initial, chromaticity shift (Δx/Δy) less than 0.015, no catastrophic failures, and no dead LEDs. These results are obtained under good heat dissipation conditions; customers should consider current distribution, voltage drop, and thermal management when designing series/parallel circuits.

5. Materials Performance Test and Method

At Ta=25°C, the following material performance tests are conducted:

• LED Optical-Electrical Characteristics: Verified using an integrating sphere to ensure compliance with specification.
• Connector Push & Pull Force: Minimum 7kgf.
• LED Push & Pull Force: Minimum 3kgf.
• LED Welding Standards: Offset tolerances: X-axis shift ≤±0.15mm, Y-axis shift ≤±0.15mm, angle deviation ≤±3°.

6. Packing Criterion

6.1 Package Diagram

The modules are packed in a carton with appropriate cushioning. The carton carries a shipping label and the manufacturer logo, along with handling instructions.

6.2 Carton Silk Printing

The carton is printed with the manufacturer logo and attention identification for proper handling.

6.3 Label Form Specification

The shipping label contains the following information: customer part number, manufacturer part number, bin code (color bin), luminous flux bin, voltage bin, CCT, CRI, quantity, net weight, and date.

7. Handling Precautions

To ensure reliable operation and prevent damage, the following precautions must be observed:

1. Sulfur Limitation: The operating environment and mating materials must not contain sulfur elements or compounds exceeding 100PPM.
2. Halogen Content: Bromine content must be below 900PPM, chlorine below 900PPM, and total bromine plus chlorine below 1500PPM.
3. VOCs: Avoid volatile organic compounds that can penetrate the silicone encapsulant and cause discoloration under heat and light. Test all materials for compatibility.
4. Handling: Handle the module by its side surfaces; do not directly touch or press the silicone lens to avoid internal circuit damage.
5. Current Limiting: Design the driving circuit with appropriate current limiting resistors to prevent excessive current that could degrade or destroy the LEDs.
6. Thermal Management: Provide adequate heat dissipation to maintain junction temperature below 110°C, as higher temperatures can reduce light output and cause color shift.
7. Cleaning: If cleaning is required, use isopropyl alcohol. Avoid solvents that may damage the package, and do not use ultrasonic cleaning as it may damage the LEDs.
8. ESD Protection: LEDs are sensitive to electrostatic discharge. Use proper ESD control measures during handling and assembly.
9. Mechanical Stress: Do not warp or twist the light bar more than 10°. Avoid holding the LED or connector parts during handling.