LED SMD 3.2x1.0x1.48mm Orange Green Blue Specification - Forward Voltage 1.8-3.5V - Power Dissipation 48-70mW - English Technical Document

1. Product Overview

1.1 General Description

This product is a surface-mount LED (Light Emitting Diode) fabricated using semiconductor chips for emitting orange, green, and blue light. The package is designed in a compact form factor with dimensions of 3.2mm in length, 1.0mm in width, and 1.48mm in height. This SMD (Surface Mount Device) LED is intended for automated assembly processes and offers reliable performance in various electronic applications.

1.2 Features

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• Extremely wide viewing angle, typically 140 degrees, ensuring visibility from multiple directions.
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• Fully compatible with all standard SMT (Surface Mount Technology) assembly and solder reflow processes, facilitating high-volume manufacturing.
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• Moisture sensitivity level rated at Level 3, indicating specific handling and storage requirements to prevent moisture-induced damage.
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• Compliant with RoHS (Restriction of Hazardous Substances) directives, ensuring the product is free from hazardous materials like lead, mercury, and cadmium.
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• Designed with a low-profile package, making it suitable for space-constrained applications.
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1.3 Application

The LED is versatile and can be used in numerous electronic systems. Primary applications include:

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• Optical Indicators: For status indication on consumer electronics, industrial equipment, and automotive dashboards.
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• Switch and Symbol Displays: Illumination for buttons, keypads, and graphical symbols in user interfaces.
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• General Lighting: Low-power lighting solutions for decorative purposes, backlighting in small displays, or accent lighting.
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• Consumer Electronics: Integration into devices such as smartphones, tablets, remote controls, and wearables for notification lights.
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• Automotive Interior Lighting: For interior ambiance lighting or indicator lights, given the operating temperature range.
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2. Technical Parameters Deep Analysis

2.1 Electrical and Optical Characteristics at 25°C

The following parameters are measured under standard test conditions at an ambient temperature of 25°C. These values are critical for circuit design and performance prediction.

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• Spectral Half Bandwidth (Δλ): This parameter indicates the wavelength range over which the LED emits light. For the orange LED, it is typically 15nm, while for green and blue LEDs, it is 30nm. A narrower bandwidth often correlates with more saturated colors.
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• Forward Voltage (VF): The voltage drop across the LED when a forward current of 20mA is applied. For the orange LED, VF ranges from 1.8V to 2.4V. For green and blue LEDs, VF ranges from 2.8V to 3.5V. These values are essential for selecting appropriate current-limiting resistors in series with the LED.
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• Dominant Wavelength (λd): The peak wavelength of light emission, which determines the perceived color. For orange LEDs, it is between 620.0nm and 630.0nm. For green LEDs, it spans from 515.0nm to 525.0nm. For blue LEDs, it ranges from 465.0nm to 475.0nm. Different bins (codes like D10, E20) represent specific wavelength ranges within these intervals.
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• Luminous Intensity (IV): A measure of the brightness of the LED in millicandelas (mcd). For orange LEDs, it varies from 70mcd to 900mcd depending on the bin code. For green and blue LEDs, similar bins define intensity ranges from 90mcd to 900mcd. Higher intensity bins are suitable for applications requiring brighter illumination.
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• Viewing Angle (2θ1/2): Defined as the angle at which the luminous intensity drops to half of its maximum value. This LED has a wide viewing angle of 140 degrees, which is ideal for applications where visibility from off-axis positions is important.
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• Reverse Current (IR): The leakage current when a reverse voltage of 5V is applied. It is specified as a maximum of 10μA, indicating good reverse bias characteristics for protection against accidental polarity reversal.
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• Thermal Resistance (RTHJ-S): The resistance to heat flow from the LED junction to the solder point. It is specified as 450°C/W. Lower thermal resistance is desirable for better heat dissipation, but this value should be considered in thermal management design to prevent overheating.
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2.2 Absolute Maximum Ratings at 25°C

These ratings define the limits beyond which the LED may suffer permanent damage. Designers must ensure operating conditions stay within these limits.

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• Power Dissipation (Pd): The maximum power the LED can dissipate as heat. For orange LEDs, it is 48mW, and for green and blue LEDs, it is 70mW. Exceeding this can lead to thermal runaway and failure.
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• Forward Current (IF): The maximum continuous forward current is 20mA. This is the standard drive current for testing and normal operation.
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• Peak Forward Current (IFP): Under pulsed conditions (1/10 duty cycle, 0.1ms pulse width), the LED can handle up to 60mA. This is useful for applications requiring brief high-intensity flashes.
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• Electrostatic Discharge (ESD): The LED can withstand ESD up to 1000V using the Human Body Model (HBM). Proper ESD precautions during handling are still recommended.
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• Operating Temperature (Topr): The ambient temperature range for reliable operation is from -40°C to +85°C, making it suitable for harsh environments.
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• Storage Temperature (Tstg): The temperature range for storage when not in operation is also -40°C to +85°C.
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• Junction Temperature (Tj): The maximum allowable temperature at the semiconductor junction is 95°C. This is a critical parameter for thermal design to ensure longevity.
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3. Binning System Explanation

The product uses a binning system to categorize LEDs based on key optical and electrical parameters. This ensures consistency in performance for volume production.

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• Forward Voltage Binning: For orange LEDs, code \"1L\" represents a VF range of 1.8V to 2.4V. For green and blue LEDs, code \"1N\" indicates a VF range of 2.8V to 3.5V. These bins help in matching LEDs for uniform brightness in arrays.
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• Dominant Wavelength Binning: Codes like \"E00\", \"F00\" for orange; \"D10\", \"E20\" for green and blue define specific wavelength ranges within 5nm steps. For example, \"D10\" for green corresponds to 515.0-517.5nm, while \"E20\" for blue corresponds to 472.5-475.0nm. This allows selection of precise color points.
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• Luminous Intensity Binning: Multiple bins exist, such as \"1DW\" (70-90mcd) to \"1CM\" (700-900mcd) for orange, and similar ranges for green and blue. Higher bin codes indicate higher brightness, enabling designers to choose based on application requirements.
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4. Performance Curves Analysis

4.1 Forward Voltage vs Forward Current (Fig.1-6)

The curve shows a non-linear relationship where forward voltage increases with forward current. For typical currents up to 30mA, the voltage remains within the specified ranges. This curve is essential for designing drive circuits to ensure proper current regulation.

4.2 Forward Current vs Relative Intensity (Fig.1-7)

This curve demonstrates that relative light output increases with forward current, but not linearly. Beyond a certain point, efficiency may drop. For this LED, the intensity rises steadily up to 20mA, which is the recommended operating point.

4.3 Pin Temperature vs Relative Intensity (Fig.1-8)

As the pin temperature increases from 0°C to 100°C, the relative intensity decreases. This thermal quenching effect is common in LEDs; at higher temperatures, luminous output can drop by up to 20-30%. Designers must account for this in applications with elevated ambient temperatures.

4.4 Pin Temperature vs Forward Current (Fig.1-9)

This curve indicates that for a given forward current, the pin temperature rises with ambient temperature. It underscores the importance of thermal management, especially when operating at high currents or in warm environments.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED package has a rectangular shape with detailed dimensions provided in drawings. Key measurements include:

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• Overall size: 3.20mm (length) × 1.00mm (width) × 1.48mm (height). Tolerances are typically ±0.2mm unless specified.
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• Lead configuration: The device has four pads (pins) on the bottom for soldering. Pin 1 is marked for polarity identification.
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• Polarity mark: A small dot or notch on the top or bottom indicates the cathode (negative) side. Correct orientation is crucial for proper operation.
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5.2 Soldering Pad Design

The recommended soldering pattern (Fig.1-5) includes pad dimensions of 2.00mm × 1.30mm with a gap of 0.30mm between pads. This design ensures reliable solder joints during reflow processes and aids in heat dissipation.

6. Soldering and Assembly Guidelines

6.1 SMT Reflow Soldering Instructions

The LED is designed for surface-mount assembly using reflow soldering. Key guidelines include:

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• Use a standard reflow profile with peak temperatures not exceeding 260°C to prevent damage to the plastic package.
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• Preheat gradually to avoid thermal shock, typically ramping at 1-3°C per second.
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• Ensure the solder paste is properly applied to the pads, and avoid excessive paste that could cause bridging.
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• After soldering, allow the board to cool naturally; forced cooling may induce stress.
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6.2 Handling Precautions

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• Handle LEDs with ESD-safe equipment to prevent electrostatic discharge damage.
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• Store in moisture-resistant packaging until use, and bake if exposed to humidity beyond the shelf life.
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• Avoid mechanical stress on the lens or leads during placement and handling.
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7. Packaging and Ordering Information

7.1 Packaging Specification

The LEDs are supplied in carrier tapes and reels for automated pickup and placement.

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• Carrier Tape Dimension: The tape width, pocket size, and pitch are designed to hold the LED securely. Typical dimensions include a pocket size matching the 3.2mm × 1.0mm footprint.
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• Reel Dimension: Reels are standard sizes (e.g., 7-inch or 13-inch diameter) to fit most SMT equipment. The reel capacity depends on the tape length.
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• Label Form Specification: Labels on the reel include part number, quantity, date code, and bin information for traceability.
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7.2 Moisture Resistant Packing

The packaging includes desiccant and humidity indicator cards to maintain moisture sensitivity level 3. Once opened, LEDs should be used within a specified time or rebaked according to guidelines.

7.3 Reliability Test Items

Standard reliability tests may include temperature cycling, humidity testing, solder heat resistance, and mechanical shock. These tests ensure the LED meets industry standards for durability.

8. Application Recommendations

Based on the parameters, this LED is suitable for:

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• Low-Power Indicators: In battery-operated devices due to its moderate forward voltage and power dissipation.
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• Wide-Angle Displays: For signage or panels where visibility from various angles is needed, thanks to the 140-degree viewing angle.
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• Color-Coded Systems: Using multiple colors (orange, green, blue) for status indication in user interfaces.
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• Industrial Controls: Where operating temperature range from -40°C to +85°C is required.
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9. Technical Comparison

Compared to similar SMD LEDs in the market, this product offers:

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• Size Advantage: The 3.2mm × 1.0mm footprint is smaller than many standard 3.5mm or 5mm LEDs, saving board space.
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• Brightness Options: With luminous intensity bins up to 900mcd, it provides flexibility for both low-light and high-brightness applications.
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• Thermal Performance: The thermal resistance of 450°C/W is typical for this package size; however, designers should compare with alternatives for high-current applications.
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• Color Consistency: The binning system for wavelength and intensity ensures better color matching in production runs compared to non-binned LEDs.
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10. Frequently Asked Questions

10.1 What is the typical forward current for this LED?

The recommended continuous forward current is 20mA, as per the electrical characteristics. Operating at this current ensures optimal brightness and longevity.

10.2 How do I identify the polarity of the LED?

Polarity is marked on the package with a small dot or notch near pin 1. The cathode is typically connected to pin 1, and the anode to other pins. Refer to the dimension drawings for exact marking details.

10.3 Can I drive this LED with a higher current for more brightness?

While the peak forward current is 60mA under pulsed conditions, exceeding the continuous 20mA rating may reduce lifespan and cause overheating. Always stay within absolute maximum ratings.

10.4 What is the moisture sensitivity level, and why is it important?

Moisture sensitivity level is 3, meaning the LED can be exposed to ambient conditions for up to 168 hours before soldering. Beyond that, baking is required to prevent popcorning during reflow.

11. Practical Use Cases

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• Case Study 1: Consumer Electronics Indicator: In a smartwatch, this LED is used as a notification light. The small size fits the compact design, and the wide viewing angle ensures visibility when worn.
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• Case Study 2: Industrial Panel Display: Multiple LEDs are arranged in an array to backlight symbols on a control panel. The consistent binning ensures uniform color and brightness across the display.
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• Case Study 3: Automotive Interior Lighting: Integrated into door handles or cup holders for ambient lighting. The operating temperature range allows reliable performance in vehicle environments.
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12. Working Principle Introduction

LEDs operate on the principle of electroluminescence. When a forward voltage is applied across the semiconductor junction, electrons and holes recombine, releasing energy in the form of photons (light). The color of the light is determined by the bandgap energy of the semiconductor material. For this LED, different chip materials (e.g., gallium arsenide phosphide for orange, gallium nitride for green and blue) are used to emit specific wavelengths. The package includes a lens to direct the light and enhance the viewing angle.

13. Development Trends

In the LED industry, ongoing trends include:

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• Increased Efficiency: Development of materials and structures to achieve higher luminous efficacy (more light output per watt), reducing power consumption.
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• Miniaturization: Packages are becoming smaller, such as 2.0mm × 1.0mm or even chip-scale packages, enabling denser PCB layouts.
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• Improved Color Rendering: Advances in phosphor technology for white LEDs and precise color control for RGB applications.
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• Enhanced Reliability: Better thermal management and packaging materials to extend lifespan and performance in extreme conditions.
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• Smart Integration: Integration of drivers or sensors within LED packages for IoT and smart lighting systems.
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This LED aligns with these trends by offering a compact form factor, multiple color options, and reliable performance for modern electronic designs.