LED 2.7x2.0x0.6mm White 3.4V 714mW Specification RF-A3E27-W60E-B1

1. Product Overview

The RF-A3E27-W60E-B1 is a high-performance white light emitting diode (LED) designed for automotive interior and exterior lighting applications. It utilizes a blue chip combined with a phosphor conversion layer to produce white light. The component is housed in a compact 2.7mm x 2.0mm x 0.6mm EMC (Epoxy Molding Compound) package, which offers excellent thermal management and reliability. With a typical forward current of 150mA and a maximum power dissipation of 714mW, this LED delivers a luminous flux ranging from 55.3 to 83.7 lumens. It is qualified according to AEC-Q102 stress test standards for automotive-grade discrete semiconductors, ensuring robustness for demanding environments.

2. Technical Parameter Deep Dive

2.1 Electrical and Optical Characteristics (Ts=25°C)

• Forward Voltage (VF): 2.8V – 3.4V (typical 3.1V) at IF=150mA.
• Reverse Current (IR): ≤10 µA at VR=5V.
• Luminous Flux (Φ): 55.3 lm – 83.7 lm at IF=150mA.
• Viewing Angle (2θ½): 120° (typical).
• Thermal Resistance (RTHJ-S real): 21°C/W typical, 32°C/W max; (RTHJ-S el): 13°C/W typical, 20°C/W max.

2.2 Absolute Maximum Ratings

• Power Dissipation (PD): 714 mW
• Forward Current (IF): 210 mA (continuous)
• Peak Forward Current (IFP): 300 mA (1/10 duty cycle, 10ms pulse width)
• Reverse Voltage (VR): 5 V
• ESD (HBM): 8000 V (90% yield)
• Operating Temperature (TOPR): -40°C to +125°C
• Storage Temperature (TSTG): -40°C to +125°C
• Junction Temperature (TJ): 150°C max

At 25°C, pulse mode test, photoelectric conversion efficiency ηe = 39%. The forward voltage measurement tolerance is ±0.1V, color coordinates tolerance ±0.005, and luminous flux tolerance ±10%.

3. Binning System

The LED is categorized by forward voltage and luminous flux bins at IF=150mA.

3.1 Forward Voltage Bins

• G0: 2.8 – 3.0V
• H0: 3.0 – 3.2V
• I0: 3.2 – 3.4V

3.2 Luminous Flux Bins

• PA: 55.3 – 61.2 lm
• PB: 61.2 – 67.8 lm
• QA: 67.8 – 75.3 lm
• QB: 75.3 – 83.7 lm

Chromaticity bins (VM1 to VM7) are defined according to the CIE 1931 diagram, with coordinates provided in the datasheet. These bins ensure color consistency for automotive lighting standards (e.g., ECE).

4. Performance Curve Analysis

The typical optical and electrical curves reveal the LED behavior under various conditions:

• Forward Voltage vs. Forward Current (Fig.1-7): The forward voltage increases with current, from ~2.8V at 30mA to ~3.4V at 210mA. This relationship is typical for InGaN-based LEDs.
• Forward Current vs. Relative Luminous Flux (Fig.1-8): Luminous flux increases nearly linearly with current up to 210mA, with a slight saturation at higher currents.
• Junction Temperature vs. Relative Luminous Flux (Fig.1-9): As junction temperature rises from -40°C to 140°C, relative luminous flux decreases by about 20%, highlighting the importance of thermal management.
• Solder Temperature vs. Forward Current (Fig.1-10): The maximum allowable forward current decreases with increasing solder temperature to prevent overheating.
• Voltage Shift vs. Junction Temperature (Fig.1-11): Forward voltage decreases with temperature at a rate of approximately -2 to -4 mV/°C.
• Radiation Diagram (Fig.1-12): The LED exhibits a wide Lambertian emission pattern with a half-intensity angle of ±60°, ideal for uniform illumination.
• Chromaticity Coordinate Shift vs. Temperature and Current (Fig.1-13, 1-14): Color shifts are minimal, within ±0.02 CIE units over the operating range.
• Spectrum Distribution (Fig.1-15): The emission spectrum peaks around 450nm (blue) with a broad phosphor conversion band covering 500-700nm, typical for phosphor-converted white LEDs.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The LED package measures 2.70mm (length) × 2.00mm (width) × 0.60mm (height) with tolerances of ±0.2mm unless otherwise noted. The bottom view shows a 1.20mm × 1.30mm thermal pad and anode/cathode markings. Recommended soldering pattern dimensions are provided to ensure proper heat dissipation and electrical connection.

5.2 Polarity

The cathode is indicated by a small notch on the package. Correct polarity must be observed during assembly.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The recommended reflow profile is based on JEDEC standards:

• Average ramp-up rate: ≤3°C/s
• Preheat: 150°C to 200°C for 60-120 seconds
• Time above 217°C: 60s max
• Peak temperature: 260°C for 10s max
• Cooling rate: ≤6°C/s

Reflow soldering should not exceed two cycles. If more than 24 hours elapse between cycles, LEDs may absorb moisture and be damaged.

6.2 Handling Precautions

• Do not apply mechanical stress during heating or cooling.
• Avoid warping the PCB after soldering.
• Use a double-head soldering iron for any necessary repairs.
• Pick-and-place nozzles should apply only minimum pressure on the silicone surface.

6.3 Storage and Moisture Sensitivity

Moisture sensitivity level is Level 2 (MSL 2). Storage conditions:

• Before opening: ≤30°C, ≤75% RH, within 1 year from date of manufacture.
• After opening: ≤30°C, ≤60% RH, recommended use within 24 hours. If exceeded, bake at 60±5°C for >24 hours.
• If the moisture barrier bag is damaged, notify sales.

7. Packaging and Ordering Information

The LEDs are supplied on tape and reel (carrier tape width 8mm, reel diameter 180mm) with 4,000 pieces per reel. The carrier tape dimensions are: A0=2.10±0.1mm, B0=3.05±0.1mm, K0=0.75±0.1mm. Each reel is sealed in a moisture barrier bag with a label containing part number, lot number, bin codes for flux (Φ), chromaticity (XY), forward voltage (VF), wavelength (WLD), quantity, and date.

8. Application Recommendations

The RF-A3E27-W60E-B1 is specifically designed for automotive lighting, both interior (e.g., dome lights, map lights) and exterior (e.g., side markers, turn signals). Its wide viewing angle (120°) and high reliability under temperature extremes make it suitable for harsh environments. The AEC-Q102 qualification ensures compliance with automotive industry requirements. For optimal performance, designers should:

• Provide adequate heat sinking using the exposed thermal pad; the thermal resistance should be considered in system design to keep junction temperature below 150°C.
• Include current-limiting resistors to prevent overcurrent.
• Avoid using materials containing sulfur, bromine, or chlorine above specified limits (S<100ppm, Br<900ppm, Cl<900ppm, total Br+Cl<1500ppm) to prevent LED degradation.
• Use cleaning agents like isopropyl alcohol if residue is present; ultrasonic cleaning is not recommended.

9. Technical Comparison and Differentiation

Compared to standard mid-power LEDs, the EMC package offers better mechanical strength and thermal performance. The AEC-Q102 qualification distinguishes this product from commercial-grade LEDs, making it suitable for safety-critical applications. The tight binning of color and flux ensures uniformity in multi-LED arrays.

10. Frequently Asked Questions

Q: What is the maximum junction temperature?
A: The absolute maximum junction temperature is 150°C. For long-term reliability, it is recommended to keep TJ below 125°C.

Q: Can I drive this LED at 300mA continuously?
A: No, 300mA is the peak forward current allowed only with 1/10 duty cycle and 10ms pulse width. Continuous current must not exceed 210mA.

Q: How should I handle ESD sensitivity?
A: Although 90% of units pass 8kV HBM, proper ESD precautions (grounded workstations, anti-static wrist straps) should be taken during handling.

Q: What is the expected lifetime?
A: Based on AEC-Q102 testing, the LED is designed for long operational life under automotive stress levels. Actual lifetime depends on driving conditions and thermal management.

11. Application Case Study

In a typical automotive interior ambient lighting module, six RF-A3E27-W60E-B1 LEDs are placed in a linear array with 10mm spacing. Using a constant current driver set to 150mA, the modules achieve a uniform illumination of 500 lux at 30cm distance. Thermal simulation shows a junction temperature of 85°C with a properly designed aluminum PCB (thermal pad soldered). The system passes thermal shock and vibration tests per automotive standards.

12. Working Principle

The white LED operates by combining a blue-emitting InGaN chip with a yellow-emitting phosphor (YAG:Ce or similar). Part of the blue light is absorbed by the phosphor and re-emitted as yellow light; the remaining blue light mixes with the yellow to produce white light. The color temperature and color rendering index are determined by the phosphor composition and thickness.

13. Development Trends

Automotive lighting is moving towards full LED adoption due to energy efficiency, design flexibility, and long lifetime. The trend includes higher luminous efficacy (over 150 lm/W), miniaturized packages (like 2.7x2.0mm), and enhanced reliability standards (AEC-Q102). Future developments may include phosphor-free white LEDs using direct emission of multiple wavelengths, but for now, phosphor-converted LEDs dominate the market.