LED RGBW Specification RF-W2SA50TS-RXXW - 5.4x5.0x1.55mm - Voltage 2.0-3.25V - Current 20mA - English Technical Document

1. Product Overview

The RF-W2SA50TS-RXXW is a high-performance multi-chip RGBW LED package designed for color mixing and white lighting applications. It integrates four independent LED chips (Red, Green, Blue, and White) in a single compact PLCC-8 package measuring 5.4 mm x 5.0 mm x 1.55 mm. This component is suitable for automated SMT assembly and meets RoHS requirements. The device offers wide viewing angles, low thermal resistance, and moisture sensitivity level 5a, making it ideal for demanding lighting environments including landscape lighting, architectural accents, and signage.

2. Technical Parameter Deep Interpretation

2.1 Electrical Characteristics

All measurements are taken at a test current of 20 mA and a solder temperature of 25°C. The forward voltage ranges for each color are as follows:

• Red (R): 2.0 V to 2.3 V
• Green (G): 2.95 V to 3.25 V
• Blue (B): 2.85 V to 3.25 V
• White (W): 2.75 V to 3.05 V

The reverse current is less than 10 µA at VR=5V. The absolute maximum forward current is 25 mA per channel, with a peak forward current of 80 mA (1/10 duty cycle, 0.1ms pulse width). Power dissipation is limited to 293.75 mW total. ESD withstand voltage (HBM) is 2000V.

2.2 Optical Characteristics

Luminous intensity and flux ranges at IF=20mA:

• Red: 700 ~ 1000 mcd
• Green: 1800 ~ 2400 mcd
• Blue: 350 ~ 650 mcd
• White (various CCT): 6.5 ~ 9.5 lm (for 2700K, 3000K, 4000K, 4100K, 6000K versions)

Dominant wavelength ranges:

• Red: 618 ~ 623 nm
• Green: 521 ~ 526 nm
• Blue: 467 ~ 472 nm

Viewing angles (half-power beam angle) are exceptionally wide: Red: 121°, Green: 123°, Blue: 120°, White: 117°. Color rendering index (Ra) for white LEDs is a minimum of 80.

2.3 Thermal Characteristics

Thermal resistance from junction to solder point (RthJ-S) for each color: Red: 120°C/W, Green: 105°C/W, Blue: 85°C/W, White: 75°C/W. Junction temperature must not exceed 94°C for R/G/B and 93°C for White. Proper heat sinking is critical to maintain performance and lifetime.

3. Binning System

3.1 Forward Voltage and Luminous Intensity Bins

Devices are sorted into bins for forward voltage and luminous intensity. For example, red VF bins range from 2.0-2.3V (code Rv), green VF from 2.95-3.25V (Gv), blue VF from 2.85-3.25V (Bv), and white VF from 2.75-3.05V (Cv). Luminous intensity bins are defined for each color: red (RI) 700-1000 mcd, green (GI) 1800-2400 mcd, blue (BI) 350-650 mcd, and white (CI) 6.5-9.5 lm.

3.2 Wavelength and Chromaticity Bins

Dominant wavelength bins are specified: Red: 618-623nm (code RL), Green: 521-526nm (GL1), Blue: 467-472nm (BL). White LEDs are binned by chromaticity coordinates (x,y) according to CIE 1931 diagram. The datasheet provides specific bin codes for 2700K, 3000K, 4000K, 4100K, and 6000K (e.g., K1/K2 for 3000K, M1/M2 for 4000K, etc.).

4. Performance Curve Analysis

4.1 Forward Voltage vs. Forward Current (I-V Curves)

The typical I-V curves show exponential behavior. At 20mA, forward voltages are as listed. Blue and white chips have higher turn-on voltages than green and red. The curves indicate stable operation across the current range.

4.2 Temperature Dependence

Relative luminous intensity decreases with increasing solder temperature. At 85°C, intensity drops to approximately 80% (blue), 70% (green/red), and 90% (white) of the 25°C value. Forward voltage also decreases linearly with temperature at a rate of about -2 mV/°C. Maximum forward current is derated at high temperatures to keep junction temperatures within limits.

4.3 Spectral Distribution

The red peak is at around 620 nm, green at 523 nm, blue at 470 nm, and white shows a broad spectrum with a blue pump peak near 450 nm and a phosphor conversion band covering 500-700 nm.

4.4 Radiation Pattern

The radiation diagram shows a Lambertian-like distribution with half-power beam angles exceeding 120°, ensuring uniform illumination over a wide area.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The LED dimensions are 5.40 mm x 5.00 mm (body) with an overall height of 1.55 mm. The package has a central lens area and 8 leads (PLCC-8) arranged as R+/R-, G+/G-, B+/B-, W+/W-. Polarity is marked on the bottom view. Recommended soldering pads are provided with dimensions for optimal thermal and electrical connection.

5.2 Carrier Tape and Reel

Parts are supplied on tape and reel (1000 pieces per reel). Tape dimensions: width 12.00 mm, pitch 4.00 mm, sprocket hole pitch 2.00 mm. Reel outer diameter 178 mm, hub diameter 58.5 mm, width 12.4 mm.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

Recommendation: Preheat from 150°C to 200°C for 60-120 seconds. Ramp-up rate ≤3°C/s. Time above 217°C: ≤60 seconds. Peak temperature 260°C, maximum 10 seconds. Cooling rate ≤6°C/s. Total time from 25°C to peak ≤8 minutes. Maximum two reflow cycles. If more than 24 hours between cycles, baking is required.

6.2 Hand Soldering

Iron temperature ≤300°C, time ≤3 seconds, one time only.

6.3 Handling Precautions

Do not apply pressure on the silicone lens surface. Use side gripping tools. Avoid mechanical stress during cooling. The silicone encapsulant is soft and can attract dust; clean with isopropyl alcohol if necessary. Ultrasonic cleaning is not recommended.

7. Packaging and Ordering Information

Standard packaging: 1000 pieces per reel in moisture barrier bag with desiccant and humidity indicator. Storage conditions: Before opening bag, temperature ≤30°C, humidity ≤75%, shelf life 4 months. After opening, use within 24 hours at ≤30°C/≤60%RH. If exceeded, bake at 60±5°C for >24 hours.

8. Application Recommendations

Typical applications include color-changing lamp strips, landscape lighting, architectural lighting, signage, and general indoor/outdoor illumination. In circuit design, always use current-limiting resistors to prevent overcurrent. Thermal management is critical: ensure adequate heat sinking to keep junction temperature below 94°C. Avoid exposing the LED to environments with sulfur compounds (>100ppm), bromine (>900ppm), or chlorine (>900ppm). The total halogen content should be less than 1500ppm.

9. Technical Comparison with Alternatives

Compared to similar RGBW LEDs in the market, the RF-W2SA50TS-RXXW offers superior viewing angles (≥120°) and high luminous efficiency. The integrated white LED with CRI≥80 provides good color rendering. The low thermal resistance (75-120°C/W) enables better heat dissipation than many competitors. The ESD withstand of 2000V HBM is industry standard. The use of AlGaInP for red and InGaN for green/blue ensures stable color over temperature.

10. Frequently Asked Questions

Q1: Can I drive the RGBW channels simultaneously at 20mA each?
A: Yes, within the total power dissipation limit of 293.75mW. However, ensure adequate heat sinking to keep junction temperature below the maximum rating.

Q2: What is the typical lifetime under rated conditions?
A: The datasheet provides reliability test results: after 1000 hours at 25°C/20mA, luminous intensity maintenance is ≥70% for R/G/B and ≥88% for white. Actual lifetime depends on thermal management.

Q3: Can I use these LEDs for outdoor lighting?
A: Yes, the operating temperature range is -40°C to +85°C. However, the package is not sealed against moisture; use conformal coating if exposed to water.

Q4: How is the chromaticity bin code interpreted?
A: Each white CCT has multiple bins (e.g., K1/K2 for 3000K). The exact xy coordinates can be found in the CIE diagram. The bin code is part of the full part number.

11. Practical Design Cases

Case 1: Color-changing LED strip. Using PWM control (e.g., 1kHz, 8-bit) on each channel, the wide viewing angle ensures uniform mixing over a 120° coverage. Use series resistors (e.g., 33Ω for 5V supply) to limit current to 20mA per channel.

Case 2: White light fixture (3000K). Combine multiple white LEDs (e.g., 10 in series) driven by a constant current source (20mA). Heat sink with aluminum PCB. The high CRI (≥80) is suitable for retail lighting.

12. Working Principle

The red LED uses AlGaInP semiconductor material grown on a substrate. When forward biased, electrons and holes recombine in the active region emitting at 620nm. The green and blue LEDs use InGaN material. The white LED combines a blue InGaN chip with a yellow phosphor that converts part of the blue light to yellow, resulting in white light. The PLCC-8 package provides electrical isolation and thermal conduction.

13. Development Trends

The trend in RGBW LEDs is toward higher efficacy (lm/W), smaller packages, and integrated control ICs. This device already offers good thermal performance and wide viewing angles. Future developments may include higher CRI (90+), tunable white, and improved ESD robustness. The use of silicone encapsulant is becoming standard due to its high temperature stability and transmission.