LED White 3.0x3.0mm 2.8-3.6V 2.16W - RF-TVR*EE33MCN Technical Datasheet - English

1. Product Overview

This white LED is fabricated using a blue chip combined with phosphor to produce a cool white emission. The device is housed in an EMC (Epoxy Molding Compound) package with dimensions of 3.0 mm × 3.0 mm × 0.55 mm, making it suitable for compact lighting designs. It is designed for all SMT assembly and soldering processes and is available on tape and reel packaging. The moisture sensitivity level is rated as Level 3, and the product is RoHS compliant.

1.1 Features

• EMC package for high reliability and thermal performance
• Extremely wide viewing angle (120° typical)
• Suitable for all SMT assembly and solder processes
• Available on tape and reel (5000 pcs/reel)
• Moisture sensitivity level: Level 3
• RoHS compliant

1.2 Applications

• Backlight for LCD, TV or monitor
• Switch and symbol illumination
• Optical indicator
• Indoor display
• Tubular light application
• General lighting

2. Package Dimensions

The LED package has a square outline of 3.00 mm × 3.00 mm with a height of 0.55 mm. The light emitting area is a circular lens with a diameter of 2.6 mm. The bottom view shows two anode and two cathode pads arranged symmetrically. The polarity is marked on the package. Soldering patterns are recommended as shown in the datasheet. All dimensions are in millimeters with tolerances of ±0.2 mm unless otherwise noted.

3. Product Parameters

3.1 Electrical / Optical Characteristics (at Ts = 25°C)

3.2 Absolute Maximum Ratings (at Ts = 25°C)

Notes: (1) Peak forward current tested at 1/10 duty cycle, 0.1 ms pulse width. (2) Forward voltage measurement tolerance ±0.1 V. (3) Color coordinates measurement tolerance ±0.005. (4) Luminous intensity measurement tolerance ±5%. (5) Care must be taken that power dissipation does not exceed the absolute maximum rating. (6) All measurements made under standardized environment. (7) When LEDs are in operation, maximum current should be decided after measuring package temperature; junction temperature must not exceed the maximum rating. (8) ESD yield is over 90% at 2000 V HBM; ESD protection during handling is needed.

4. Binning System

4.1 Forward Voltage and Luminous Flux Bins (IF = 600 mA)

The LEDs are binned according to forward voltage (VF) and luminous flux (Φ). Voltage bins range from G1 (2.8–2.9 V) to J2 (3.5–3.6 V). Flux bins range from T140 (140–145 lm) to T240 (240–245 lm). The table cross-references voltage and flux bins for device selection.

4.2 Chromaticity Bins (CIE 1931)

The CIE chromaticity diagram shows color bins D00–D23, H00–H23, K00–K23, and T00–T23, each defined by four corner coordinate pairs (x, y). These bins allow precise color targeting for white LED applications. The typical chromaticity shift with temperature is also documented in the optical characteristics curves.

5. Typical Optical Characteristics Curves

The datasheet provides several characteristic curves to aid circuit and thermal design:

• Forward Voltage vs. Forward Current: At 600 mA, VF is approximately 3.0 V; the curve shows a gradual increase with current.
• Relative Intensity vs. Forward Current: Intensity increases linearly up to 600 mA.
• Relative Intensity vs. Solder Temperature: Intensity decreases slightly as temperature rises (about 10% drop from 25°C to 100°C).
• Forward Current vs. Solder Temperature: Derating is required above 25°C to keep junction temperature below 115°C.
• Forward Voltage vs. Solder Temperature: VF decreases with increasing temperature (about 0.1 V drop from 25°C to 100°C).
• Radiation Diagram: Wide viewing angle of 120° with symmetric radiation pattern.
• Chromaticity Coordinate vs. Solder Temperature: Slight shift in x/y coordinates at different temperatures (25°C, 45°C, 65°C, 85°C).
• Spectrum Distribution: Broad emission centered around 450 nm (blue) with phosphor conversion covering 500–700 nm.

6. Packaging Information

6.1 Packaging Specifications

Packaging quantity: 5000 pcs per reel. Carrier tape dimensions: A0 = 3.2±0.1 mm, B0 = 3.3±0.1 mm, K0 = 1.4±0.1 mm, P0 = 4.0±0.1 mm, P1 = 4.0±0.1 mm, P2 = 2.0±0.05 mm, T = 0.25±0.02 mm, E = 1.75±0.1 mm, F = 3.5±0.05 mm, D0 = 1.55±0.1 mm, D1 = 1.1±0.1 mm, W = 8.0±0.1 mm. Reel dimensions: A (inner diameter) = 13.3±0.5 mm, B (width) = 16.9±0.1 mm, C (outer diameter) = 178±1 mm, D (hub diameter) = 59±1 mm.

6.2 Label and Moisture Barrier

Each reel is labeled with part number, spec number, lot number, bin code, luminous flux, chromaticity bin, forward voltage, wavelength, quantity, and date. The reel is placed in a moisture barrier bag with desiccant and a humidity indicator card. The bag is then packed in a cardboard box for shipment.

6.3 Reliability Test Items

Failure criteria: VF > 1.1 × U.S.L, IR > 2.0 × U.S.L, Φ < 0.7 × L.S.L.

7. SMT Reflow Soldering Instructions

Reflow soldering must not exceed two times. If more than 24 hours have passed after the first soldering, LEDs may be damaged. The recommended reflow profile includes:

• Average temperature rise speed: 3 °C/s max
• Preheating: 150°C to 200°C for 60–120 s
• Time above 217°C (TL): 60 s max
• Peak temperature (TP): 260°C max, with holding time within 5°C of peak: 10 s max
• Cooling speed: 6 °C/s max
• Total time from 25°C to peak: 8 min max

For hand soldering: iron temperature below 300°C for less than 3 seconds, one time only. Repairing should be avoided; if necessary, use a double-head soldering iron. Do not apply stress during heating. The encapsulant is silicone, so avoid strong pressure on the top surface. Do not mount components on warped PCB.

8. Handling Precautions

• The operating environment should limit sulfur element composition to below 100 ppm in mating materials.
• Bromine and chlorine content in external materials should be below 900 ppm each, and total below 1500 ppm.
• Avoid VOCs that can penetrate silicone encapsulants and cause discoloration. Use adhesives that do not outgas organic vapor.
• Handle components by the side surfaces using forceps; do not touch the silicone lens.
• Design circuits with proper current limiting resistors to prevent exceeding absolute maximum ratings. Reverse voltage can cause migration and damage.
• Thermal design is critical; ensure adequate heat sinking to keep junction temperature below 115°C.
• Silicone attracts dust; clean with isopropyl alcohol. Ultrasonic cleaning is not recommended.
• Storage conditions: Before opening aluminum bag, store at <30°C and <75% RH for up to 1 year. After opening, use within 24 hours at <30°C and <60% RH. If exceeding storage time, bake at 65±5°C for 24 hours.
• LEDs are sensitive to ESD and EOS; use proper handling precautions.

9. Design Application Recommendations

This white LED is ideal for backlighting, indicators, indoor displays, and general lighting where high efficacy and wide viewing angle are required. The wide viewing angle of 120° allows uniform light distribution. The EMC package provides good thermal conductivity, enabling the LED to be driven at 600 mA with proper heat sinking. When designing arrays, ensure uniform current distribution and adequate copper area for heat dissipation. The binning system allows selection of tight voltage and color groups for consistent performance in mass production.

10. Technical Comparison Considerations

Compared to conventional PLCC packages, the EMC package offers higher reliability under thermal and mechanical stress, better resistance to sulfur contamination, and improved light extraction efficiency. The 3.0×3.0 mm footprint is compact and suitable for dense layouts. The typical thermal resistance of 12°C/W is competitive for mid-power LEDs, allowing operation at higher currents without exceeding junction temperature limits.

11. Frequently Asked Questions

Q: What is the maximum drive current? A: The absolute maximum forward current is 600 mA DC; peak current up to 900 mA (1/10 duty, 0.1 ms).

Q: Can I use this LED in outdoor applications? A: The operating temperature range is −40°C to +85°C, but the package is not specified for outdoor exposure without additional environmental protection.

Q: How do I interpret the bin codes? A: Voltage bins (G1–J2) indicate forward voltage ranges; flux bins (T140–T240) indicate luminous flux ranges in lumens. Chromaticity bins (D, H, K, T) correspond to specific CIE coordinates.

Q: Is this LED suitable for tunable white systems? A: This is a fixed white LED; for tunable white you would need multiple color bins or different CCTs.

Q: What is the recommended solder pad layout? A: Refer to the soldering patterns diagram (Fig.1-5) with pad dimensions 1.45 mm × 0.46 mm for each pad, spaced 2.26 mm apart. Use copper area adequate for heat dissipation.

12. Application Case Study: LCD Backlight Unit

In a typical 7-inch LCD backlight, 24 of these white LEDs arranged in a 4×6 matrix can provide 3000 cd/m² brightness at 600 mA drive. With a 120° viewing angle, the backlight achieves uniform illumination. Thermal management using aluminum PCB with 2 oz copper keeps junction temperature below 85°C, ensuring 50,000-hour lifetime. The EMC package allows reflow soldering on flexible substrates for edge-lit designs.

13. Principle of White Light Generation

The LED uses a blue InGaN chip emitting at approximately 450 nm. The chip is coated with a yellow-emitting YAG:Ce phosphor. Part of the blue light is absorbed by the phosphor and down-converted to yellow; the remaining blue light mixes with the yellow to produce white light. The exact white point (CCT and Duv) is determined by the phosphor concentration and composition, which is tightly controlled via the binning system.

14. Industry Trends and Standards

The lighting industry is moving toward higher efficacy and smaller packages. EMC packages are increasingly adopted for mid-power LEDs due to their mechanical robustness and compatibility with automated assembly. The trend is also toward tighter binning for color consistency, as reflected in the detailed CIE bin structure of this product. RoHS compliance and environmental restrictions on halogens and sulfur are becoming standard requirements. LEDs with thermal resistance below 15°C/W are preferred for high-lumen applications to simplify heatsinking.