LT264WH White LED Specification - 2.6x0.6x0.4mm - 2.8V - 0.06W - White - Technical Data Sheet

1. Product Overview

The LT264WH is a white light-emitting diode (LED) fabricated using a blue chip combined with a phosphor coating. The package dimensions are 2.6mm x 0.6mm x 0.4mm, making it a compact PLCC (Plastic Leaded Chip Carrier) package suitable for surface-mount technology (SMT) assembly processes. This LED offers a wide viewing angle of 120 degrees, ensuring uniform light distribution across the intended illumination area. It is designed for applications such as LCD backlighting and mobile phone displays. The product is RoHS compliant and has a moisture sensitivity level of 3, requiring proper handling to prevent moisture absorption.

1.1 Features

• PLCC package for easy SMT assembly
• Wide viewing angle (120 degrees)
• Suitable for all SMT assembly and solder processes
• Available on tape and reel packaging for automated placement
• Moisture sensitivity level: Level 3
• RoHS compliant

1.2 Applications

• LCD backlighting
• Mobile phone backlighting

2. Technical Parameters

All electrical and optical characteristics are measured at an ambient temperature of 25�C unless otherwise specified. The forward current is set to 20 mA for typical measurements.

2.1 Electrical and Optical Characteristics

2.2 Absolute Maximum Ratings

The absolute maximum ratings must not be exceeded during operation to prevent device damage.

Measurement tolerances: Forward voltage �0.03V, Color coordinates �0.003, Luminous intensity �3% (all at IF=20mA, Ta=25�C). Care must be taken that power dissipation does not exceed the absolute maximum rating. The maximum operating current should be determined after measuring the package temperature to ensure the junction temperature remains below the maximum limit.

3. Binning System

The LT264WH LED is sorted into bins for luminous intensity, forward voltage, and chromaticity coordinates to ensure consistency in application.

3.1 Luminous Intensity Bins (IF=20mA)

Luminous intensity is classified from 2150 mcd to 3750 mcd in several bins, each with a range of 100 mcd. The bins are labeled from 30 to 45, with corresponding luminous flux values in lumens (lm). For example, Bin 30 covers 2150-2250 mcd and 6.00-6.25 lm, while Bin 45 covers 3650-3750 mcd and 9.75-10.0 lm.

3.2 Forward Voltage Bins (IF=20mA)

Forward voltage is binned from 2.7V to 3.3V in steps of 0.1V. The bins are labeled V0 (2.7-2.8V), V1 (2.8-2.9V), V2 (2.9-3.0V), V3 (3.0-3.1V), V4 (3.1-3.2V), and V5 (3.2-3.3V).

3.3 Chromaticity Bins (IF=20mA, Ta=25�C)

The LED is available in multiple chromaticity bins defined by CIE 1931 color coordinates. The bins are grouped into several color series: L0-L10, T0-T10, H1-H10, LA00-LB00-LC-LD-LE-LF-LG-LH-LI-LJ-LA-LB, LR1-LR10, TB0-TB5, LH1-LH8, O1-O7, LB20-LB2-LD2-LF2-K1-K5, and others. Each bin is defined by a quadrilateral area on the chromaticity diagram. The coordinates for each bin are provided in Table 1-6, 1-8, 1-10, and 1-12. The measurement uncertainty of the color coordinates is �0.003. The new white dustbin refers to the application of small backlight standard.

4. Typical Optical Characteristics Curves

The following curves illustrate the typical behavior of the LT264WH LED under various operating conditions. All data is collected at 25�C unless otherwise noted.

4.1 Forward Voltage vs. Forward Current (Fig. 1-13)

This curve shows the relationship between forward voltage and forward current. As the current increases from 0 to 60 mA, the forward voltage rises from approximately 0V to about 3.0V. At the typical test current of 20 mA, the forward voltage is approximately 2.8V.

4.2 Forward Current vs. Relative Intensity (Fig. 1-14)

The relative luminous intensity increases with forward current. At 20 mA the relative intensity is normalized to 1.0; at 40 mA it is approximately 1.8; at 60 mA it reaches about 2.5. This indicates that the output is not perfectly linear but shows a slightly sublinear behavior at higher currents.

4.3 Solder Temperature vs. Forward Current (Fig. 1-15)

This curve shows the maximum allowable forward current as a function of solder pad temperature. To keep the junction temperature below 105�C, the forward current must be derated as the ambient or solder temperature increases. For example, at a solder temperature of 25�C, the maximum current is 30 mA, while at 100�C it is reduced to about 10 mA.

4.4 Spectrum Distribution (Fig. 1-16)

The spectrum shows the relative intensity vs. wavelength. The white LED has a broad spectrum covering the visible range, with a peak in the blue region (around 450 nm) from the chip and a broader yellow emission from the phosphor, resulting in white light with a typical correlated color temperature (CCT) in the range of 5000K-7000K depending on the bin.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The package has dimensions of 2.6 mm length, 0.6 mm width, and 0.4 mm height. All dimensions are in millimeters and tolerances are �0.1 mm unless otherwise noted.

5.2 Carrier Tape Dimensions

The carrier tape for the LED has a width of 8.00 mm and a pitch of 4.00 mm. Key dimensions include: A0=0.85 mm, B0=2.80 mm, K0=0.55 mm, D0=1.60 mm, D1=0.60 mm, E=1.75 mm, F=3.50 mm, P0=4.00 mm, P1=4.00 mm, P2=2.00 mm, T=0.20 mm. Tolerances are �0.10 mm unless noted.

5.3 Reel and Label

The LED is packaged on a reel containing 5000 pieces per reel. The label includes: Part Number, Bin Code, Luminous Intensity (IV), Forward Voltage (VF), Wavelength code (WL), Quantity (QTY), Date, and Lot Number.

5.4 Moisture Resistant Packing

The LEDs are sealed in a moisture barrier bag with a desiccant and a humidity indicator card. Once the bag is opened, the LEDs must be used within 24 hours if stored at �30�C and �60% RH; otherwise, baking is required at 60�C for at least 24 hours.

6. Reliability and Testing

6.1 Reliability Test Items

The LED has passed the following reliability tests: Reflow (260�C max, 10 sec), Thermal Shock (-40�C to 100�C, 100 cycles), High Temperature Storage (100�C, 1000 hrs), Low Temperature Storage (-40�C, 1000 hrs), Life Test (25�C, IF=20mA, 1000 hrs), High Temperature and Humidity Storage (60�C/90%RH, 1000 hrs), and Temperature Humidity Operation Life (60�C/90%RH, IF=15mA, 500 hrs). All tests were conducted with a sample size of 20 pcs and acceptance criteria of 0/1.

6.2 Failure Criteria

A device is considered failed if: Forward voltage increases by more than 1.1 times the upper standard level (U.S.L.), reverse current exceeds 2.0 times U.S.L., or luminous flux drops below 0.7 times the lower standard level (L.S.L.).

7. SMT Reflow Soldering Instructions

The recommended reflow soldering profile is as follows: Preheat from 160�C to 260�C for 60-120 seconds; ramp rate of max 5�C/s; time above 217�C (tL) should be 60-120 seconds; peak temperature (TP) of 260�C with a maximum duration of 10 seconds within 5�C of TP; cooling rate max 6�C/s; total time from 25�C to TP should not exceed 8 minutes. Reflow soldering should not be performed more than twice. If more than 24 hours elapse between two soldering processes, the LEDs may be damaged due to moisture absorption. Do not apply stress on the silicone lens during heating.

7.1 Soldering Iron

Manual soldering should be performed at a temperature below 300�C for less than 3 seconds, and only once.

7.2 Repairing

Repairing after soldering is discouraged. If necessary, use a double-head soldering iron and verify beforehand that the LED characteristics will not be damaged.

8. Handling Precautions

• The LED operating environment and mating materials must have sulfur content below 100 ppm (informational only, not a warranty).
• To prevent contamination, the single content of bromine and chlorine in external materials must be less than 900 ppm each, and total bromine and chlorine must be less than 1500 ppm.
• Volatile organic compounds (VOCs) from fixture materials can penetrate the silicone encapsulant and cause discoloration under heat and light. It is recommended to test all materials for compatibility. Avoid adhesives that outgas organic vapor.
• Handle components with forceps from the side; do not touch the silicone lens surface directly.
• Design circuits to keep forward current below the absolute maximum rating and include a protection resistor to prevent current surge from voltage variations. Never apply reverse voltage.
• Thermal design is critical. Temperature rise reduces efficiency and shifts color. Ensure adequate heat dissipation.
• Cleaning: Use isopropyl alcohol for cleaning if needed. Other solvents must not damage the package. Ultrasonic cleaning is not recommended.
• Storage: Before opening the sealed bag, store at �30�C and �75% RH for up to one year. After opening, use within 24 hours at �30�C and �60% RH. If storage conditions are exceeded, bake at 60�C for over 24 hours after unpacking.
• LEDs are sensitive to electrostatic discharge (ESD) and electrical overstress (EOS). Proper ESD protection measures must be implemented during handling and assembly.

This technical data sheet is based on the LT264WH specification. All information is provided for reference and does not constitute a warranty or guarantee of performance in any specific application. Customers should verify suitability for their intended use.