3020 Mid-Power EMC Package LED Datasheet - 3.0x2.0mm - Voltage 3.4V - Power 0.5W/0.8W - Cool/Neutral/Warm White - Technical Documentation

1. Product Overview

This document details the technical specifications and performance characteristics of the 3020 series mid-power LEDs, which utilize advanced EMC (Epoxy Molding Compound) packaging. This series is specifically designed for general lighting applications, achieving an optimal balance between luminous efficacy, cost-effectiveness, and reliability.

1.1 Product Positioning and Core Advantages

The 3020 LED is positioned in the mid-power market, primarily targeting application scenarios with stringent requirements for high performance and high cost-effectiveness. Its core advantages stem from its packaging technology and electrical design.

• Enhanced Thermal Performance EMC Package: Compared to traditional PPA or PCT plastics, EMC materials offer superior thermal conductivity and high-temperature resistance, resulting in better lumen maintenance and a longer service life.
• High Luminous Efficacy and Cost-Effectiveness (Lumens per Dollar): This product is designed to deliver the best lumens per watt and lumens per dollar metrics in its class, making it ideal for cost-sensitive, high-volume lighting projects.
• Power Flexibility: Although rated for the 0.5W series, its robust package allows operation at up to 0.8W, providing design flexibility for varying drive current requirements.
• High Color Quality: A minimum Color Rendering Index (CRI) of 80 ensures good color reproduction, suitable for general indoor lighting requiring color accuracy.
• Strong Driving Capability: Supports a maximum forward current (IF) of 240mA and a pulse current (IFP) of 300mA, adaptable to various driving schemes.

1.2 Target Market and Key Applications

The versatility of the 3020 LED makes it suitable for a wide range of lighting applications.

• Replacement Luminaires and Lamps: Directly replace traditional incandescent lamps, energy-saving lamps, or outdated LED modules within bulbs, tubes, and downlights.
• General Lighting: Primary light source for residential, commercial, and industrial luminaires (such as panel lights, grid lights, high bay lights).
• Backlighting: Used for indoor and outdoor signage, light boxes, and decorative panel lighting.
• Architectural and Decorative Lighting: Applications such as accent lighting, cove lighting, and others requiring stable light output and color consistency.

2. In-depth Technical Parameter Analysis

All parameters are measured under standard test conditions: forward current (IF) = 150mA, ambient temperature (Ta) = 25°C, relative humidity (RH) = 60%.

2.1 Photoelectric Characteristics

The primary performance metrics defining LED light output and color.

• Luminous Flux: At 150mA, the typical value ranges from 58 lm to 68 lm, depending on the Correlated Color Temperature (CCT) bin. Each bin also specifies a minimum guaranteed value. The measurement tolerance is ±7%.
• Forward Voltage (VF): At 150mA, the typical voltage drop across the LED is 3.4V, ranging from 3.1V (minimum) to 3.4V (typical). The tolerance is ±0.1V. This parameter is crucial for driver design and thermal management.
• Viewing Angle (2θ1/2): The typical 110-degree wide viewing angle provides a broad and uniform light distribution, making it ideal for general lighting.
• Color Rendering Index (CRI/Ra): The minimum Ra is 80, with a measurement tolerance of ±2. This indicates good color fidelity.
• Reverse Current (IR): At a reverse voltage (VR) of 5V, the maximum is 10 μA, indicating good junction integrity.

2.2 Electrical and Absolute Maximum Ratings

These ratings define the operational limits that may cause permanent damage.

• Maximum Forward Current (IF_max): 240 mA (DC).
• Maximum peak forward current (IFP_max): is 300 mA under specific conditions (pulse width ≤ 100µs, duty cycle ≤ 1/10).
• Maximum Power Dissipation (PD_max): 816 mW. This is the maximum allowable thermal dissipation power at the junction.
• Maximum Reverse Voltage (VR_max): 5 V.
• Junction Temperature (Tj_max): 115 °C. Absolute maximum junction temperature of the semiconductor.
• Operating and Storage Temperature: -40 °C to +85 °C.
• Soldering Temperature: Capable of withstanding 230°C or 260°C for 10 seconds, compatible with standard lead-free reflow soldering profiles.

2.3 Thermal Characteristics

Effective thermal management is crucial for performance and lifespan.

• Thermal resistance (Rθ_J-SP): 21 °C/W (typical). This is the thermal resistance from the LED junction to the solder point. A lower value indicates better heat transfer from the chip to the circuit board. This parameter is key for calculating the junction temperature rise relative to the solder point temperature: ΔTj = PD * Rθ_J-SP。
• Electrostatic Discharge (ESD) Immunity: Capable of withstanding 1000V (Human Body Model), ensuring excellent operational robustness.

3. Grading System Description

To ensure color and brightness consistency in production, LEDs are sorted into different bins. This series employs a multi-parameter binning system.

3.1 Color Temperature and Chromaticity Grading

This product offers six primary CCT bins, ranging from warm white to cool white, adhering to the ENERGY STAR bin definitions for 2600K-7000K.

• Model and CCT Range:
  • T3427811C-**AA: Warm White (Typical 2725K, Range 2580K-2870K)
  • T3430811C-**AA: Warm White (Typical 3045K, Range 2870K-3220K)
  • T3440811C-**AA: Neutral White (Typical 3985K, Range 3710K-4260K)
  • T3450811C-**AA: Neutral White (Typical 5028K, Range 4745K-5311K)
  • T3457811C-**AA: Cool White (Typical 5665K, Range 5310K-6020K)
  • T3465811C-**AA: Cool White (Typical 6530K, Range 6020K-7040K)
• Chromaticity Binning Structure (Table 5): Each CCT bin (e.g., 27M5, 30M5) is defined by an ellipse on the CIE 1931 chromaticity diagram. This table specifies the ellipse's center coordinates (x, y), semi-major axis (a), semi-minor axis (b), and its rotation angle (Φ). The measurement uncertainty for chromaticity coordinates is ±0.007.

3.2 Luminous Flux Binning

Within each chromaticity bin, LEDs are further sorted based on their light output at 150mA.

• Luminous Flux Code: Codes such as E7, E8, E9, F1, and F2 represent specific lumen ranges. For example, in the 27M5 chromaticity binning:
  • Code E7: 54 lm (minimum) to 58 lm (maximum)
  • Code E8: 58 lm to 62 lm
  • Code E9: 62 lm to 66 lm
• The available luminous flux codes vary by chromaticity bin; typically, higher CCT bins offer higher luminous flux codes (e.g., up to F2: 70-72 lm).

3.3 Forward Voltage Binning

LEDs are also grouped according to their forward voltage drop to simplify driver design and ensure consistent string behavior when connected in series.

• Voltage Code:
  • Code 1: VF = 2.8V to 3.0V
  • Code 2: VF = 3.0V to 3.2V
  • Code 3: VF = 3.2V to 3.4V
• The measurement tolerance for VF is ±0.1V.

4. Performance Curve Analysis

The provided chart offers key insights into the behavior of LEDs under different operating conditions.

4.1 IV Characteristics and Relative Luminous Flux

Figure 3 (IF vs. Relative Luminous Flux): It shows the relationship between drive current and light output. Luminous flux increases sublinearly with current. While driving at higher currents (e.g., 240mA) produces more total light, luminous efficacy (lumens per watt) typically decreases due to increased thermal and electrical losses. Designers must balance output requirements with efficacy and thermal load.

Figure 4 (IF vs. VF): It illustrates the diode's IV curve. Forward voltage increases with current. This curve is crucial for calculating power dissipation (PD = IF * VF) at any operating point, which directly impacts thermal design.

4.2 Temperature Dependence

Figure 6 (Ta vs. Relative Luminous Flux): It demonstrates the negative impact of increasing ambient/solder joint temperature on light output. When the temperature rises from 25°C to 85°C, the luminous flux may decrease by approximately 20-30%. This highlights the necessity for effective PCB thermal design and heat sinks.

Figure 7 (Ta vs. Forward Voltage): It shows that the forward voltage decreases linearly with increasing temperature (approximately -2mV/°C for a typical InGaN LED). This characteristic can sometimes be used for junction temperature estimation.

Figure 8 (Maximum IF vs. Ambient Temperature): A crucial derating curve. The maximum allowable continuous forward current must be reduced as the ambient temperature increases to prevent exceeding the maximum junction temperature (115°C). For example, at an ambient temperature of 85°C, the maximum allowable current is significantly lower than 240mA.

4.3 Spectral and Chromaticity Behavior

Figure 1 (Spectral Distribution): Typical spectrum of a white LED, composed of a blue chip combined with phosphor. This diagram shows the blue peak from the chip and the broader yellow emission from the phosphor. The exact shape determines the CCT and CRI.

Figure 5 (Ta vs. CIE x, y shift): This plot shows how the chromaticity coordinates change with temperature under constant current. The coordinates move along a specific trajectory. Understanding this shift is crucial for applications requiring strict color stability over a temperature range.

Figure 2 (Viewing angle distribution): Confirmed a near-Lambertian emission pattern associated with the 110-degree viewing angle, showing the variation of intensity with the central angle.

5. Application Guidelines and Design Considerations

5.1 Thermal Management

This is the most critical factor in ensuring performance and lifespan.

• PCB Design: Use a Metal Core Printed Circuit Board (MCPCB) or a standard FR4 board with sufficient thermal vias beneath the LED thermal pad to conduct heat away from the solder joint.
• Junction Temperature Calculation: Continuously monitor and control Tj. It can be estimated: Tj ≈ Tsp + (PD * Rθ_J-SP), where Tsp is the temperature measured at the solder point. Always keep Tj below 115°C, and for longer lifespan, it is best to keep it well below this value.
• Follow the derating curve: Strictly adhere to the maximum current versus ambient temperature curve (Figure 8).

5.2 Electrical Drive

• Constant Current Drive: Always use a constant current LED driver. Due to the negative temperature coefficient of VF, using constant voltage drive will lead to thermal runaway and failure.
• Current Selection: Although the LED can handle currents up to 240mA, operating at a test current of 150mA or below typically offers the best balance of luminous efficacy, lifespan, and thermal load. Use the curve in Figure 3 to select the appropriate current for the desired light output.
• Series/Parallel Configuration: When connecting multiple LEDs in series, ensure the driver's compliance voltage is sufficient to cover the sum of the VF of the LED string. For parallel strings, use individual current limiting or carefully match VF bins to prevent current imbalance.

5.3 Optical Design

• The 110-degree wide viewing angle is suitable for applications requiring broad illumination without secondary optics. For focused beams, appropriate lenses or reflectors will be required.
• When mixing LEDs from different production batches, consider chromaticity binning to maintain color uniformity within the luminaire.

5.4 Welding and Operation

• Reflow Soldering: Compatible with standard lead-free reflow profiles with peak temperatures of 230°C or 260°C for a duration not exceeding 10 seconds. Follow the recommended ramp-up, soak, and cooling rates to avoid package stress.
• ESD Precautions: Although rated for 1000V HBM, standard ESD precautions (grounded workstation, wrist strap) should still be observed during handling and assembly.
• Storage: Store in a dry, controlled environment within the specified temperature range (-40°C to +85°C).

6. Technical Comparison and Differentiation

Although the datasheet does not provide a direct side-by-side comparison with specific competitor components, the key differentiating advantages of this 3020 EMC package can be inferred:

• Comparison between EMC and Plastic Packaging (PPA/PCT): Compared to standard plastics, EMC packaging offers superior thermal performance and resistance to yellowing/browning under high temperatures and UV exposure. This translates to better lumen maintenance (L70/L90 lifetime) and color stability over time.
• Power Density: Capable of operating reliably up to 0.8W within a 3020 package size, it offers higher power density than many conventional mid-power LEDs, potentially reducing the number of LEDs required for a given lumen output.
• Comprehensive Binning: Multi-parameter binning (chromaticity, luminous flux, voltage) provides manufacturers with the tools to achieve high color and brightness consistency in their final products, a key requirement for high-quality luminaires.

7. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I continuously drive this LED at its maximum current of 240mA?
A: Yes, but only if you can ensure the junction temperature (Tj) remains below 115°C. This requires excellent thermal management (very low thermal resistance from junction to ambient). For most practical designs, it is recommended to operate at a lower current (e.g., 150mA) for optimal luminous efficacy and reliability.

Q: What is the actual power consumption at the typical operating point?
Answer: At IF=150mA and VF=3.4V (typical), the electrical power input is P = 0.15A * 3.4V = 0.51W (510mW). The difference between this value and the maximum power dissipation rating (816mW) is the thermal design margin.

Question: How to interpret the bin code "T3450811C-**AA, 50M5, F1, 2"?
Answer: This specifies an LED with neutral white color (typical 5028K, bin 50M5), luminous flux in the F1 range (66-70 lm at 150mA), and forward voltage code 2 (3.0V-3.2V). The "**" in the model number likely represents specific luminous flux/voltage codes.

Question: Why does light output decrease with increasing temperature?
Answer: Two main reasons: 1) The internal quantum efficiency of the semiconductor chip decreases at higher temperatures. 2) The conversion efficiency of the phosphor layer decreases, along with possible thermal quenching. Effective cooling can mitigate this decline.

Question: Is a heat sink necessary?
答：对于任何运行在低电流以上（例如>60mA）或在密闭/封闭式灯具中的应用，散热器或具有优异热扩散性能的PCB对于管理结温是绝对必要的。

8. Introduction to Working Principles

The 3020 LED is a solid-state light source based on semiconductor physics. Its core component is a chip made of indium gallium nitride (InGaN) material. When a forward voltage exceeding the diode's threshold is applied, electrons and holes recombine within the chip's active region, releasing energy in the form of photons. In this white LED, the chip primarily emits blue light. A layer of phosphor (typically cerium-doped yttrium aluminum garnet, YAG) is deposited on the chip. A portion of the blue light is absorbed by the phosphor and re-emitted as yellow light. The remaining blue light combines with the converted yellow light, creating the visual perception of white light. The precise ratio of blue to yellow light and the specific phosphor composition determine the correlated color temperature (CCT) and color rendering properties (CRI) of the emitted white light. The EMC package serves to protect the delicate semiconductor chip and phosphor, provide mechanical stability, form the primary optical lens, and most importantly, offer an effective path for heat conduction from the high-temperature junction.

9. Technical Trends

The medium-power LED sector, represented by packages such as 3020, continues to develop. Key industry trends related to this product include:

• Continuously improving luminous efficacy: Ongoing advancements in chip epitaxy, phosphor technology, and packaging design continuously drive increases in lumens per watt, thereby reducing energy consumption for the same light output.
• Enhanced Color Quality and Consistency: 对于高端照明应用，对更高CRI（Ra > 90，R9 > 50）和更严格的色度分档（例如，麦克亚当椭圆步长2或3）的需求正在增长。荧光粉和分档技术正在进步以满足这一需求。
• Enhanced Reliability and Lifespan: Focus on enhancing materials (such as EMC) and manufacturing processes to improve resistance to thermal stress, moisture, and lumen depreciation, thereby extending the L90 lifespan.
• Miniaturization and Higher Power Density: The trend is towards integrating more luminous output into smaller packages (e.g., from 3528 to 3030 to 2835, or handling higher wattage within the same footprint), driven by the demand for smaller, sleeker luminaires.
• Smart & Dimmable Lighting: While this is a standard white LED, the broader market is moving towards LEDs capable of dynamic CCT adjustment (tunable white) or integrating control electronics, although these features are typically implemented at the module or system level, not at the single-chip package level.

The 3020 EMC LED series is positioned as a mature, cost-effective, and reliable "workhorse" within this evolving landscape, addressing the core needs of general lighting with its solid technical foundation.