SMD Mid-Power LED 50-217S Datasheet - PLCC-2 Package - Voltage 3.2V - Current 60mA - White LED - English Technical Document

1. Product Overview

The 50-217S is a surface-mount mid-power LED designed for general lighting applications. It utilizes a PLCC-2 (Plastic Leaded Chip Carrier) package with a white-emitting LED chip. The device is characterized by its high luminous efficacy, excellent color rendering capabilities, and a wide viewing angle, making it suitable for a broad range of illumination purposes. Its compact form factor and low power consumption contribute to its versatility in modern lighting designs.

1.1 Core Advantages

• High Luminous Intensity Output: Delivers bright and efficient light output.
• Wide Viewing Angle (115-125 degrees): Provides uniform illumination over a broad area.
• High Color Rendering Index (CRI): Available with minimum CRI ratings from 60 to 90, ensuring accurate color reproduction.
• Environmental Compliance: The product is Pb-free, compliant with EU REACH regulations, and meets halogen-free standards (Br<900ppm, Cl<900ppm, Br+Cl<1500ppm).
• ANSI Binning: Ensures consistent color and flux output across production batches.

1.2 Target Market and Applications

This LED is ideal for various lighting applications where reliability, efficiency, and good color quality are required. Primary application areas include:

• General Indoor and Ambient Lighting
• Decorative and Architectural Lighting
• Entertainment and Stage Lighting
• Indicator Lights and Panel Illumination
• Switch Backlighting

2. Technical Parameter Deep-Dive

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

• Forward Current (I_F): 75 mA (Continuous)
• Peak Forward Current (I_FP): 150 mA (Pulsed, Duty Cycle 1/10, Pulse Width 10ms)
• Power Dissipation (P_d): 250 mW
• Operating Temperature (T_opr): -40°C to +85°C
• Storage Temperature (T_stg): -40°C to +100°C
• Thermal Resistance (R_{th J-S}): 32 °C/W (Junction to Soldering Point)
• Junction Temperature (T_j): 115 °C (Maximum)
• Soldering Temperature: Reflow: 260°C for 5 seconds max. Hand Soldering: 350°C for 3 seconds max.

Note: This device is sensitive to electrostatic discharge (ESD). Proper ESD handling precautions must be observed during assembly and handling.

2.2 Electro-Optical Characteristics

These parameters are measured at a solder point temperature (T_soldering) of 25°C and a forward current (I_F) of 60 mA, which is the typical operating condition.

• Luminous Flux (Φ): 24 lm (Min), 30 lm (Typ), 38 lm (Max). Tolerance: ±11%.
• Forward Voltage (V_F): 2.7V (Min), 2.9V (Typ), 3.2V (Max). Tolerance: ±0.1V.
• Color Rendering Index (CRI/Ra): 80 (Min), 82 (Typ), 87 (Max). Tolerance: ±2. The R9 (saturated red) value is typically 2, ranging from 0 to 7.
• Viewing Angle (2θ_1/2): 115° (Min), 120° (Typ), 125° (Max).
• Reverse Current (I_R): 50 μA (Max) at a Reverse Voltage (V_R) of 5V.

3. Binning System Explanation

The product uses a comprehensive binning system to ensure color and performance consistency. The part number structure 50-217S/KKE-BXXXX32Z6/SZM/2T encodes key parameters.

3.1 Color Correlated Temperature (CCT) and Flux Binning

The \"BXXXX\" section in the part number indicates the CCT and minimum luminous flux. For example, \"B4028\" signifies a 4000K CCT with a minimum flux of 28 lumens. The datasheet lists mass production series for different flux levels (26lm, 28lm, 30lm, 32lm at 4000K reference) across CCTs from 3000K (Warm White) to 6500K (Cool White), all with a minimum CRI of 80.

3.2 Luminous Flux Bin Codes

Separate bin codes define the luminous flux range at I_F=60mA. Codes like \"2426\" cover 24-26 lm, \"2628\" cover 26-28 lm, up to \"3638\" covering 36-38 lm. This allows for precise selection based on brightness requirements.

3.3 Forward Voltage Bin Codes

The forward voltage is also binned. For most series, groups 35-38 define voltage ranges from 2.8-2.9V up to 3.1-3.2V. The 32Lm series uses group 34-38, starting from 2.7-2.8V. The code \"32\" in the part number indicates the maximum forward voltage is 3.2V.

3.4 Color Rendering Index (CRI) Index

A single letter denotes the minimum CRI value: M(60), N(65), L(70), Q(75), K(80), P(85), H(90). The example part numbers use \"K\" for CRI 80 (Min).

3.5 Forward Current Index

The code \"Z6\" specifies the forward current rating of 60 mA.

4. Chromaticity and Color Consistency

The LED's chromaticity coordinates are controlled within specific bins on the CIE 1931 chromaticity diagram to ensure color uniformity. The datasheet provides example coordinate sets for a 3000K bin (e.g., B30U, B303, B30S) and mentions a mixing scheme (e.g., B30S:B30U = 1:1) to achieve the target chromaticity, which is a common practice to optimize yield while maintaining color consistency.

5. Mechanical and Packaging Information

5.1 Package Type

The device uses a standard PLCC-2 surface-mount package. This package style typically has two leads for electrical connection and a molded plastic body that acts as a primary lens.

5.2 Polarity Identification

Like most PLCC-2 LEDs, one lead is the anode (+) and the other is the cathode (-). The package usually has a visual marker, such as a notch, cut corner, or a dot near the cathode lead. The PCB footprint design must respect this polarity.

5.3 Packing Quantity

The part number suffix \"/2T\" likely indicates the packaging type. These components are typically supplied on tape and reel for automated assembly. The exact quantity per reel is a standard parameter that would be specified in separate packaging specifications.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The maximum allowable soldering temperature is 260°C for up to 5 seconds. This aligns with standard lead-free (Pb-free) reflow profiles. Designers should ensure the thermal profile used in production does not exceed this limit to prevent damage to the LED's internal structure and phosphor.

6.2 Hand Soldering

If hand soldering is necessary, the iron tip temperature must not exceed 350°C, and the contact time with the lead should be limited to 3 seconds or less per pad. Use a low-power iron and avoid applying excessive mechanical stress.

6.3 Storage Conditions

Components should be stored in their original moisture-barrier bags at temperatures between -40°C and +100°C, with low humidity. Once the bag is opened, components should be used within a specified time frame (typically 168 hours at <30°C/60%RH) or baked according to the Moisture Sensitivity Level (MSL) specification to prevent \"popcorning\" during reflow.

7. Application Design Considerations

7.1 Thermal Management

With a thermal resistance of 32 °C/W from junction to solder point, effective heat sinking is crucial. The maximum junction temperature is 115°C. For reliable long-term operation, the junction temperature should be kept significantly lower. Design the PCB with adequate thermal relief, using thermal vias and copper pours connected to the LED's thermal pad (if applicable in the footprint) to dissipate heat.

7.2 Current Driving

The recommended operating current is 60 mA. While the absolute maximum is 75 mA, driving at lower currents can significantly improve efficacy and longevity. Use a constant current driver rather than a constant voltage source with a series resistor for better stability and efficiency. Ensure the driver is compatible with the forward voltage range of the selected bin (e.g., ~2.9V typical).

7.3 Optical Design

The wide 120-degree viewing angle is suitable for applications requiring broad, diffuse illumination. For more focused beams, secondary optics (lenses or reflectors) will be necessary. The water-clear resin allows for good light extraction.

8. Performance Analysis and Trends

8.1 Efficacy and Performance

With a typical flux of 30 lm at 60 mA (forward power ~0.174W), the typical luminous efficacy is approximately 172 lm/W. This places it in the competitive range for mid-power LEDs, offering a good balance between cost, performance, and reliability for general lighting.

8.2 Color Quality Focus

The availability of high CRI options (up to 90 min) and the specification of the R9 value reflect the growing market demand for LEDs that provide excellent color rendering, particularly for retail, museum, and residential lighting where accurate color perception is critical.

8.3 Environmental and Regulatory Compliance

The emphasis on RoHS, REACH, and halogen-free compliance is standard for modern electronic components, driven by global environmental regulations and customer requirements for safer, more sustainable products.

9. Frequently Asked Questions (FAQ)

9.1 What is the difference between the various flux series (26Lm, 28Lm, etc.)?

The series (e.g., \"For 4000K 26Lm\") groups products with a similar minimum luminous flux output at the reference CCT of 4000K. A \"28Lm\" series part will generally be brighter than a \"26Lm\" series part of the same CCT and CRI when operated under the same conditions (60mA). Designers should select the series based on their lumen output requirements.

9.2 How do I interpret the part number 50-217S/KKE-B402832Z6/SZM/2T?

• 50-217S: Base product family and package.
• K: CRI Min = 80.
• KE: Likely internal codes.
• B4028: CCT = 4000K, Min Flux = 28 lm.
• 32: Max Forward Voltage = 3.2V.
• Z6: Forward Current = 60 mA.
• SZM/2T: Likely internal codes related to binning and packaging (tape & reel).

9.3 Can I drive this LED at its maximum current of 75mA?

While possible, it is not recommended for optimal lifetime and reliability. Operating at 60mA provides a good safety margin. Driving at 75mA will increase junction temperature, potentially reduce efficacy, and accelerate lumen depreciation over time. Always conduct thermal analysis if considering operation near maximum ratings.

9.4 Is a heatsink required?

For a single LED operated at 60mA, the power dissipation is low (~0.174W). However, in arrays or modules where multiple LEDs are placed close together, or if the ambient temperature is high, collective heat buildup can be significant. Proper PCB thermal design, as mentioned in section 7.1, is essential. A dedicated metal-core PCB (MCPCB) or aluminum substrate is often used for high-density LED arrays.