SMD Mid-Power LED 67-21ST Datasheet - PLCC-2 Package - Voltage 9.6V Max - Current 60mA - English Technical Document

1. Product Overview

The 67-21ST is a surface-mount device (SMD) mid-power LED housed in a PLCC-2 (Plastic Leaded Chip Carrier) package. It is a top-view white LED designed to offer a balance of performance, efficiency, and reliability for modern lighting solutions. Its compact form factor and robust construction make it suitable for automated assembly processes.

1.1 Core Advantages and Positioning

This LED series is positioned as a versatile solution for general and decorative lighting. Its key advantages stem from a combination of optical and electrical characteristics. It delivers high luminous efficacy, contributing to energy-efficient designs. The package offers a wide viewing angle of 120 degrees, ensuring uniform light distribution. Furthermore, it is available with high Color Rendering Index (CRI) options, with a minimum CRI of 80 for standard models and options extending up to CRI 90, making it suitable for applications where accurate color perception is important. The product adheres to major environmental and safety standards, being Pb-free, compliant with EU REACH, and meeting halogen-free requirements (Br<900ppm, Cl<900ppm, Br+Cl<1500ppm).

1.2 Target Applications

The combination of features makes this LED ideal for a broad range of applications. Primary uses include general ambient and task lighting. It is also well-suited for decorative lighting, architectural accent lighting, and entertainment or stage lighting due to its consistent color output. Additionally, it can be used in indicator lights, switch illumination, and various other illumination tasks requiring a reliable, compact white light source.

2. In-Depth Technical Parameter Analysis

This section provides a detailed, objective breakdown of the LED's key performance parameters under standard test conditions (soldering point temperature at 25°C).

2.1 Absolute Maximum Ratings

The Absolute Maximum Ratings define the limits beyond which permanent damage to the device may occur. These are not conditions for normal operation.

• Forward Current (I_F): 80 mA (Continuous)
• Peak Forward Current (I_FP): 160 mA (Pulsed, Duty Cycle 1/10, Pulse Width 10ms)
• Power Dissipation (P_d): 800 mW
• Operating Temperature (T_opr): -30°C to +85°C
• Storage Temperature (T_stg): -40°C to +100°C
• Thermal Resistance, Junction to Solder Point (R_{th J-S}): 17 °C/W
• Maximum Junction Temperature (T_j): 115 °C
• Soldering Temperature: Reflow: 260°C for 10 seconds max; Hand Soldering: 350°C for 3 seconds max.

Important Note: The device is sensitive to electrostatic discharge (ESD). Proper ESD handling precautions must be observed during all stages of production and handling.

2.2 Electro-Optical Characteristics

These parameters are specified at the typical operating forward current of 60mA.

• Luminous Flux (Φ): Minimum values range from 70 lm to 76 lm depending on the specific product variant and correlated color temperature (CCT). A typical tolerance of ±11% applies.
• Forward Voltage (V_F): Maximum rating is 9.6V. The typical range during operation is between 8.7V and 9.6V, with a tolerance of ±0.1V.
• Color Rendering Index (C_RI or R_a): Standard variants have a minimum CRI of 80. The R9 value (saturated red) is specified as a minimum of 0 for these standard bins. Tolerance is ±2.
• Viewing Angle (2θ_1/2): 120 degrees (typical). This is the full angle at which luminous intensity is half of the peak value.
• Reverse Current (I_R): Maximum 50 µA at a reverse voltage (V_R) of 15V.

3. Binning System Explanation

The product uses an ANSI-compatible binning system to ensure color and flux consistency. The product number contains codes that define its performance bin.

3.1 Product Number Decoding

The structure 67-21ST/KK6C-HXX XX XX Z6 / 2 T contains key information:

• HXX: Represents the chromaticity and flux bin. The first two digits often relate to CCT (e.g., 27 for 2700K, 30 for 3000K).
• XX: Represents the flux bin code (e.g., 70, 73, 76 lm min).
• 96: Forward Voltage index, indicating V_F max = 9.6V.
• Z6: Forward Current index, indicating I_F = 60mA.

3.2 Chromaticity (Color) Binning

The LED is binned according to its Correlated Color Temperature (CCT) and precise chromaticity coordinates on the CIE 1931 diagram. The datasheet provides detailed coordinate boxes for each CCT (2700K, 3000K, 4000K, 5000K, 5700K, 6500K). Each CCT is further divided into sub-bins (e.g., A, B, C, D, F, G for 2700K) defined by specific x,y coordinate ranges. This tight binning ensures minimal color shift between LEDs in an array. The reference ranges ensure the CCT falls within standard ANSI tolerances (e.g., 2580K-2700K for one 2700K bin).

3.3 Luminous Flux Binning

Flux is categorized into bins defined by a code and a minimum/maximum luminous output at 60mA.

• R5: 70 – 76 lm
• R5B: 73 – 76 lm
• R6: 76 – 83 lm
• R7: 83 – 90 lm

The standard tolerance for luminous flux is ±11%.

3.4 Forward Voltage Binning

Forward voltage is grouped to aid in driver design and current matching.

• Group 8796:
  • 87C: 8.7V – 9.0V
  • 90C: 9.0V – 9.3V
  • 93C: 9.3V – 9.6V

The tolerance for forward voltage is ±0.1V.

4. Thermal and Reliability Considerations

4.1 Thermal Management

The thermal resistance from the junction to the solder point is 17 °C/W. This parameter is crucial for calculating the junction temperature (T_j) during operation. Exceeding the maximum T_j of 115°C will significantly reduce lifetime and can cause failure. Proper PCB thermal design, including adequate copper area and possibly thermal vias, is essential to maintain a low solder point temperature, especially when operating at or near the maximum forward current.

4.2 Soldering Guidelines

The LED is compatible with standard reflow soldering processes. The maximum profile is 260°C peak temperature for a maximum of 10 seconds. For hand soldering, the iron tip temperature should not exceed 350°C, and contact time should be limited to 3 seconds per pad. It is recommended to follow the reflow profile suggested for similar PLCC packages to avoid thermal shock or package damage.

5. Application Design Notes

5.1 Driver Selection

Given the forward voltage range (up to 9.6V max at 60mA), a constant current driver is mandatory for stable operation and to prevent thermal runaway. The driver should be specified for an output current of 60mA (± appropriate tolerance). For designs using multiple LEDs in series, the cumulative forward voltage must be considered. Parallel connection of LEDs is generally not recommended without individual current balancing.

5.2 Optical Design

The wide 120-degree viewing angle is beneficial for applications requiring broad, even illumination without secondary optics. For applications needing a focused beam, primary optics (lenses) will be required. The water-clear resin of the package ensures high light extraction efficiency.

5.3 PCB Layout Recommendations

The PCB pad design should match the recommended footprint for the PLCC-2 package to ensure proper soldering and mechanical stability. To aid thermal performance, connect the thermal pad (if present in the footprint) to a large copper plane. Using thermal vias under the package to connect to internal or bottom-side copper layers can significantly improve heat dissipation.

6. Mass Production List & Typical Specifications

The datasheet lists several standard product configurations that are available in mass production. An example is the 67-21ST/KK6C-H307396Z6/2T:

• CCT: 3000K
• CRI (Min.): 80
• R9 (Min.): 0
• Luminous Flux (Min.): 73 lm
• Forward Voltage (Max.): 9.6V
• Forward Current: 60mA

Similar variants exist for 2700K (70 lm min), 4000K (76 lm min), 5000K (76 lm min), 5700K (76 lm min), and 6500K (76 lm min), all with CRI 80 min.

7. Technical Comparison and Positioning

Compared to traditional low-power LEDs, the 67-21ST offers significantly higher luminous output per package, reducing the number of components needed for a given light output. Compared to high-power LEDs, it typically offers better efficacy at lower operating currents and simplifies thermal management due to lower power dissipation per device. Its PLCC-2 package is a industry-standard, cost-effective format with proven reliability, offering a strong balance between performance, ease of use, and cost for mid-power general lighting applications.

8. Frequently Asked Questions (Based on Technical Parameters)

8.1 What is the typical operating voltage?

While the maximum is 9.6V, the typical forward voltage at 60mA will be lower, often in the range of 8.7V to 9.3V depending on the specific voltage bin. Always design the driver to accommodate the maximum voltage.

8.2 Can I drive this LED at 80mA?

The Absolute Maximum Rating for continuous forward current is 80mA. Operating at this current is possible but will generate more heat, reduce efficacy, and potentially shorten lifespan. It is crucial to ensure the junction temperature remains below 115°C by implementing excellent thermal management. The recommended operating condition is 60mA.

8.3 How is color consistency ensured?

Color consistency is achieved through tight binning on the CIE chromaticity diagram. By selecting LEDs from the same CCT and chromaticity sub-bin (e.g., 30K-F), very close color matching can be achieved within a single production batch or across batches.

8.4 Is a heatsink required?

For a single LED operating at 60mA (~0.55W electrical power), a dedicated heatsink is usually not required if it is mounted on a standard PCB with some copper pour for heat spreading. However, for arrays of LEDs or operation in high ambient temperatures, careful thermal design of the PCB (using thermal vias, thicker copper) is necessary, and an external heatsink may be required to maintain reliable operation.