Mini Top View LED 65-21 Series - Brilliant Yellow - 2.0x1.25x0.8mm - 2.35V - 120mW - English Technical Datasheet

1. Product Overview

The 65-21 series represents a family of Mini Top View Light Emitting Diodes (LEDs) designed for surface-mount technology (SMT) applications. This specific model, identified by the part number 65-21/Y2SC-AR1S2B/2T, emits a brilliant yellow light. The core design philosophy centers on providing a compact, reliable light source optimized for efficient optical coupling, making it particularly suitable for use with light pipes and waveguides.

The package is constructed with a white resin body, contributing to its high contrast and effectiveness as an optical indicator. A key feature is its wide viewing angle, achieved through the package's integrated reflector design. This design not only broadens the emission pattern but also enhances light extraction and directionality towards the intended application, such as the entrance of a light guide.

The product is fully compliant with Pb-free and RoHS (Restriction of Hazardous Substances) directives, ensuring it meets contemporary environmental and regulatory standards for electronic components. It is supplied on tape and reel for compatibility with automated pick-and-place assembly processes, supporting high-volume manufacturing.

2. Technical Parameter Deep Dive

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

• Reverse Voltage (V_R): 5 V. Exceeding this voltage in reverse bias can cause junction breakdown.
• Continuous Forward Current (I_F): 50 mA.
• Peak Forward Current (I_FP): 100 mA, permissible under pulsed conditions (duty cycle 1/10, frequency 1 kHz).
• Power Dissipation (P_d): 120 mW. This is the maximum allowable power loss as heat at an ambient temperature (T_a) of 25°C. Derating is necessary at higher temperatures.
• Electrostatic Discharge (ESD) Human Body Model (HBM): 2000 V. This rating indicates a moderate level of ESD robustness; proper handling procedures are still recommended.
• Operating Temperature (T_opr): -40°C to +85°C.
• Storage Temperature (T_stg): -40°C to +90°C.
• Soldering Temperature: For reflow soldering, a peak temperature of 260°C for 10 seconds is specified. For hand soldering, 350°C for 3 seconds is the limit.

2.2 Electro-Optical Characteristics

These parameters are measured at a standard test condition of T_a=25°C and I_F=20 mA, unless otherwise noted. Tolerances are specified.

• Luminous Intensity (I_v): Ranges from a minimum of 112 mcd to a maximum of 285 mcd, with a typical value within this range. Tolerance is ±11%.
• Viewing Angle (2θ_1/2): 120 degrees (typical). This is the full angle at which the luminous intensity is half of its peak value, confirming the wide-angle emission.
• Peak Wavelength (λ_p): 591 nm (typical). This is the wavelength at which the spectral power distribution is maximum.
• Dominant Wavelength (λ_d): Ranges from 585.5 nm to 594.5 nm. This is the single wavelength perceived by the human eye to match the color of the LED. Tolerance is ±1 nm.
• Spectral Bandwidth (Δλ): 15 nm (typical). This defines the width of the emitted spectrum.
• Forward Voltage (V_F): Ranges from 1.75 V to 2.35 V at 20 mA. Tolerance is ±0.1 V.
• Reverse Current (I_R): Maximum of 10 μA when a reverse voltage of 5 V is applied.

3. Binning System Explanation

To ensure color and brightness consistency in production, LEDs are sorted into bins based on key parameters.

3.1 Dominant Wavelength Binning (Group A)

Defines the perceived color (hue).
- Bin D3: 585.5 nm to 588.5 nm.
- Bin D4: 588.5 nm to 591.5 nm.
- Bin D5: 591.5 nm to 594.5 nm.

3.2 Luminous Intensity Binning

Defines the brightness level.
- Bin R1: 112 mcd to 140 mcd.
- Bin R2: 140 mcd to 180 mcd.
- Bin S1: 180 mcd to 225 mcd.
- Bin S2: 225 mcd to 285 mcd.

3.3 Forward Voltage Binning (Group B)

Defines the electrical characteristic for circuit design.
- Bin 0: 1.75 V to 1.95 V.
- Bin 1: 1.95 V to 2.15 V.
- Bin 2: 2.15 V to 2.35 V.

The part number suffix (e.g., Y2SC-AR1S2B/2T) encodes these bin selections, allowing precise ordering for application requirements.

4. Performance Curve Analysis

The datasheet references typical electro-optical characteristic curves. While the specific graphs are not detailed in the text, such curves typically illustrate the relationship between forward current and luminous intensity (I-V/L curve), the effect of ambient temperature on luminous intensity and forward voltage, and the spectral power distribution. Analyzing these curves is crucial for understanding performance under non-standard conditions, such as driving the LED at currents other than 20 mA or operating in elevated temperature environments. Designers should consult the graphical data to predict behavior and ensure reliable operation across the intended use case.

5. Mechanical and Packaging Information

5.1 Package Outline and Dimensions

The LED features a compact SMT package. Key dimensions include a body size of approximately 2.0 mm in length, 1.25 mm in width, and 0.8 mm in height (tolerance ±0.1 mm unless specified). A recommended solder pad layout is provided to ensure proper mechanical attachment and thermal dissipation during reflow soldering. The design includes polarity markings to ensure correct orientation on the PCB.

5.2 Tape and Reel Specifications

The component is supplied on embossed carrier tape with a width of 8 mm. The pocket pitch is 4 mm, and each reel contains 2000 pieces. Detailed reel dimensions (hub diameter, flange diameter, etc.) are provided for compatibility with automated assembly equipment. The packaging includes moisture-resistant measures: the reel is sealed inside an aluminum moisture-proof bag along with a desiccant and a humidity indicator card to protect the LEDs from ambient moisture during storage and transport.

6. Soldering and Assembly Guidelines

Reflow Soldering: The component is rated for lead-free reflow soldering profiles with a peak temperature of 260°C ±5°C for a minimum of 5 seconds (time above liquidus). The recommended pad design should be followed to prevent tombstoning and ensure a reliable solder joint.
Hand Soldering: If necessary, hand soldering can be performed with an iron tip temperature not exceeding 350°C for a maximum of 3 seconds per lead.
Current Limiting: It is imperative to use an external current-limiting resistor in series with the LED. The forward voltage has a tolerance, and a slight increase in supply voltage can cause a large, potentially destructive increase in forward current due to the diode's exponential I-V characteristic.

7. Storage and Handling Precautions

1. Moisture Sensitivity: The package is moisture-sensitive (MSL). The unopened moisture-proof bag must be stored at ≤30°C and ≤90% RH.
2. Floor Life: After opening the bag, the components have a floor life of 1 year when stored at ≤30°C and ≤60% RH. Unused parts should be resealed in a dry-bag with desiccant.
3. Baking: If the humidity indicator shows excessive moisture exposure or the floor life is exceeded, a baking treatment of 60°C ±5°C for 24 hours is required before reflow to prevent popcorning (package cracking due to vapor pressure).
4. ESD Protection: Standard ESD precautions should be observed during handling.

8. Application Suggestions

8.1 Typical Application Scenarios

• Optical Indicators: Status lights on consumer electronics, industrial control panels, and automotive dashboards.
• Light Guide / Light Pipe Coupling: The wide viewing angle and package design make it ideal for efficiently injecting light into acrylic or polycarbonate light pipes for backlighting symbols, buttons, or creating uniform panel illumination.
• Backlighting: For small LCD displays, keypads, membrane switches, and decorative lighting.
• General Signaling: Where a bright, yellow indication is required.

8.2 Design Considerations

When designing with this LED:
- Drive Circuit: Always implement a constant-current circuit or, at minimum, a voltage source with a series resistor calculated based on the maximum forward voltage (V_F) to limit current to the desired level (e.g., 20 mA).
- Thermal Management: While power dissipation is low, ensure the PCB layout provides adequate thermal relief, especially if operating near maximum ratings or in high ambient temperatures.
- Optical Design: For light pipe applications, model the coupling efficiency considering the LED's emission pattern (120° viewing angle) and the light pipe's entrance geometry to maximize light transfer.

9. Reliability and Quality Assurance

The product undergoes a comprehensive suite of reliability tests conducted with a 90% confidence level and a Lot Tolerance Percent Defective (LTPD) of 10%. Test items include:
- Reflow Soldering Resistance.
- Temperature Cycling (-40°C to +100°C).
- Thermal Shock (-10°C to +100°C).
- High-Temperature Storage (100°C).
- Low-Temperature Storage (-40°C).
- DC Operating Life (1000 hours at 20 mA).
- High Temperature/High Humidity Operating Life (85°C/85% RH).
These tests validate the LED's robustness under various environmental and operational stresses, ensuring long-term performance in field applications.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: What resistor value should I use with a 5V supply?
A: Using Ohm's Law (R = (V_supply - V_F) / I_F) and the maximum V_F of 2.35V for safety: R = (5 - 2.35) / 0.020 = 132.5 Ω. A standard 130 Ω or 150 Ω resistor would be appropriate, checking the power rating (P = I²R).

Q: Can I drive this LED at 30 mA for more brightness?
A: The absolute maximum continuous current is 50 mA, so 30 mA is within spec. However, luminous intensity is not linear with current, and operating at higher current increases power dissipation (heat). Consult the typical performance curves to estimate the brightness gain and ensure thermal limits are not exceeded.

Q: How do I interpret the part number for ordering?
A: The part number 65-21/Y2SC-AR1S2B/2T encodes the series, color (Y for yellow), and specific bins for dominant wavelength (likely D4/D5), luminous intensity (S2), and forward voltage (B2). Refer to the bin range tables and label explanation in the datasheet for precise matching.

11. Practical Design Case Study

Scenario: Designing a backlit automotive dashboard button.
Implementation: A single 65-21/Y2SC-AR1S2B/2T LED is placed on the main PCB. A custom-molded acrylic light pipe is positioned directly over the LED, capturing its 120° emission. The light pipe channels the light to the underside of a translucent button icon. The drive circuit uses the vehicle's 12V system, stepped down and regulated to 5V, with a 150 Ω series resistor to set the current to ~18 mA, providing a clear, bright yellow indication while operating well within the LED's ratings for long-term reliability in the automotive temperature range.

12. Technology Introduction and Trends

Principle: This LED uses an AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor chip to generate light. When a forward voltage is applied, electrons and holes recombine in the active region, releasing energy in the form of photons. The specific composition of the AlGaInP alloy determines the peak wavelength, in this case, in the yellow spectrum (~591 nm). The water-clear resin package minimizes light absorption and, combined with the internal reflector, shapes the output beam.

Trends: The miniaturization of SMT LEDs continues, driven by demand for smaller electronic devices. Trends also include higher efficiency (more lumens per watt), improved color consistency through tighter binning, and enhanced reliability for harsh environments like automotive applications. The integration of on-chip electrostatic discharge protection is also becoming more common. The 65-21 series, with its focus on efficient optical coupling, aligns with the trend of using LEDs with secondary optics (like light pipes) for sophisticated, low-profile lighting solutions.