Mini Top View LED 65-11 Series Datasheet - Dimensions 3.2x2.8x1.9mm - Voltage 2.75-3.65V - Power 110mW - White Color - English Technical Document

1. Product Overview

The 65-11 series represents a family of Mini Top View Surface-Mount Device (SMD) LEDs. This product is engineered as a compact optical indicator component, utilizing an InGaN (Indium Gallium Nitride) semiconductor chip to produce a pure white light output. The LED is encapsulated in a water-clear resin package, which contributes to its optical performance. A key design feature is the integrated inter-reflector within the package. This reflector optimizes light extraction and coupling efficiency, making this LED particularly well-suited for applications involving light pipes or light guides where efficient directional light transfer is critical.

1.1 Core Advantages and Target Market

The primary advantages of this LED series stem from its package design and material selection. The wide viewing angle of 120 degrees (typical) ensures high visibility from various angles, which is essential for status indicators on consumer electronics, automotive dashboards, and industrial control panels. The SMT (Surface Mount Technology) package allows for high-speed, automated assembly using standard IR (Infrared) reflow soldering processes, significantly reducing manufacturing costs and improving reliability compared to through-hole components. The product is specified as Pb-free and compliant with the RoHS (Restriction of Hazardous Substances) directive, meeting global environmental regulations. The target markets are broad, encompassing backlighting for LCDs and keypads (especially in mobile devices), general indicator functions, and specialized lighting where coupling into acrylic or polycarbonate light guides is required.

2. In-Depth Technical Parameter Analysis

This section provides a detailed, objective interpretation of the key electrical, optical, and thermal parameters specified in the datasheet. Understanding these limits and characteristics is fundamental for reliable circuit design.

2.1 Absolute Maximum Ratings

The Absolute Maximum Ratings define the stress limits beyond which permanent damage to the device may occur. These are not conditions for normal operation.

• Reverse Voltage (V_R): 5V. Exceeding this voltage in the reverse-biased direction can cause junction breakdown.
• Continuous Forward Current (I_F): 30mA. This is the maximum DC current that can be applied continuously.
• Peak Forward Current (I_FP): 100mA. This pulsed current rating (at a 1/10 duty cycle and 1kHz frequency) allows for brief over-current conditions, useful for multiplexing or creating brighter flashes.
• Power Dissipation (P_d): 110mW. This is the maximum power the package can dissipate as heat at an ambient temperature (T_a) of 25°C. Exceeding this limit risks thermal runaway.
• Electrostatic Discharge (ESD): 2000V (Human Body Model). This rating indicates a moderate level of built-in ESD protection, but handling with standard ESD precautions is still recommended.
• Operating & Storage Temperature: -40°C to +85°C / -40°C to +90°C. These ranges define the environmental conditions for use and non-operational storage.
• Soldering Temperature: The device can withstand IR reflow soldering with a peak temperature of 260°C for 10 seconds, or hand soldering at 350°C for 3 seconds.

2.2 Electro-Optical Characteristics

These parameters are measured under standard test conditions (T_a=25°C, I_F=20mA) and define the device's performance.

• Luminous Intensity (I_V): 715 to 1800 mcd (millicandela). This is the primary measure of the LED's brightness. The wide range indicates a binning system is used (see Section 3). A typical forward current of 20mA is used for specification.
• Viewing Angle (2θ_1/2): 120 degrees (typical). This is the full angle at which the luminous intensity drops to half of its peak value. The wide angle is a result of the top-view package and diffused lens/reflector design.
• Forward Voltage (V_F): 2.75V to 3.65V. This is the voltage drop across the LED when driven at 20mA. The variation is due to semiconductor process tolerances and is managed through voltage binning.

3. Binning System Explanation

To ensure consistency in mass production, LEDs are sorted into performance groups or \"bins.\" This datasheet defines bins for luminous intensity and forward voltage.

3.1 Luminous Intensity Binning

LEDs are categorized into four bins (V1, V2, W1, W2) based on their measured luminous intensity at 20mA. For example, a bin V1 LED will have an intensity between 715 and 900 mcd, while a bin W2 LED will be between 1420 and 1800 mcd. Designers must specify the required bin when ordering to guarantee a minimum brightness level for their application.

3.2 Forward Voltage Binning

Forward voltage is binned into three groups (E5, E6, E7) under the \"E\" classification. For instance, bin E5 covers V_F from 2.75V to 3.05V. Selecting LEDs from the same voltage bin is crucial for designs where multiple LEDs are connected in parallel, as it ensures more uniform current sharing and brightness.

3.3 Chromaticity Coordinate Binning

The color of white light is defined by its coordinates (x, y) on the CIE 1931 chromaticity diagram. The datasheet shows four primary bins (B3, B4, B5, B6) that define specific regions on this diagram. Each bin has a defined quadrilateral area. For example, bin B3 covers a region with x-coordinates from ~0.283 to 0.304 and y-coordinates from ~0.295 to 0.330. This binning ensures the white color point (correlated color temperature - CCT) falls within an acceptable range, preventing noticeable color differences between LEDs in an array. The tolerance for these coordinates is ±0.01.

4. Performance Curve Analysis

The typical characteristic curves provide insight into how the LED behaves under non-standard conditions.

4.1 Relative Luminous Intensity vs. Forward Current

This curve shows that light output is not linearly proportional to current. While output increases with current, the efficiency (lumens per watt) typically decreases at higher currents due to increased heat generation within the chip. Driving the LED above the recommended 20mA for extended periods will reduce lifetime and may shift color.

4.2 Forward Current Derating Curve

This is a critical graph for thermal management. It shows the maximum allowable continuous forward current as a function of the ambient temperature (T_a). As T_a increases, the LED's ability to dissipate heat decreases. Therefore, the maximum safe operating current must be reduced. For example, at an ambient temperature of 85°C, the maximum continuous current is significantly lower than the 30mA absolute maximum rating specified at 25°C. Ignoring this derating can lead to rapid degradation.

3.3 Relative Luminous Intensity vs. Ambient Temperature

This curve illustrates the temperature dependence of light output. Typically, the luminous intensity of InGaN-based white LEDs decreases as the junction temperature rises. This is an important consideration for applications operating in high-temperature environments or where the LED is driven hard, as the actual brightness will be lower than the room-temperature specification.

4.4 Forward Voltage vs. Forward Current & Spectrum Distribution

The V_F vs. I_F curve shows the diode's exponential I-V characteristic. The spectrum distribution plot shows the relative power emitted across different wavelengths. For a white LED using a blue chip with a phosphor coating, the spectrum will have a peak in the blue region (from the chip) and a broader peak in the yellow/green/red region (from the phosphor). The combined output is perceived as white light.

4.5 Radiation Diagram

This polar plot visually represents the viewing angle and spatial distribution of light. The 120-degree viewing angle is confirmed here, showing how intensity diminishes at angles away from the central axis (0 degrees).

5. Mechanical and Packaging Information

5.1 Package Dimensions

The LED has a compact SMD footprint. Key dimensions include a body size of approximately 3.2mm (length) x 2.8mm (width) x 1.9mm (height). The datasheet provides a detailed drawing with tolerances, typically ±0.1mm unless otherwise noted. This includes the placement of the anode and cathode pads, which are crucial for correct PCB (Printed Circuit Board) layout and orientation during automated pick-and-place assembly.

5.2 Polarity Identification

The package includes a polarity marker. Typically, a notch, a dot, or a chamfered corner on the package indicates the cathode side. The PCB footprint solder pad design should mirror this asymmetry to prevent incorrect placement.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Parameters

The device is compatible with standard infrared (IR) reflow soldering processes. The maximum recommended profile has a peak temperature of 260°C, which should not be exceeded for more than 10 seconds. It is essential to follow a controlled temperature ramp-up and cool-down profile to prevent thermal shock, which can crack the resin package or damage the internal wire bonds.

6.2 Hand Soldering

If manual soldering is necessary, it should be performed quickly. The recommendation is to use a soldering iron tip at 350°C for a maximum duration of 3 seconds per lead. Applying heat for too long can transfer excessive heat to the LED chip.

6.3 Storage Conditions

LEDs should be stored in their original moisture-barrier bags with desiccant in a controlled environment, typically below 30°C and 60% relative humidity. If the bags are opened, the components may absorb moisture, which can cause \"popcorning\" (package cracking) during reflow soldering due to rapid vapor expansion. For extended storage after opening, a baking procedure may be required as per the IPC/JEDEC standard.

7. Packaging and Ordering Information

7.1 Reel Dimensions

The LEDs are supplied on tape and reel for automated assembly. The datasheet provides the dimensions of the carrier tape, the reel hub, and the overall reel. This information is necessary for programming the feeder mechanisms on SMT placement machines.

7.2 Label Explanation and Model Numbering

The product label on the reel or box contains codes that specify the device's performance bins. The key codes are:
CAT: Luminous Intensity Rank (e.g., W1, V2).
HUE: Chromaticity Coordinates (e.g., B4, B6).
REF: Forward Voltage Rank (e.g., E5, E7).
The full part number (e.g., 65-11/T2C-FV1W2E/2T) encodes the series, package type, and likely the performance bins, allowing for precise identification and ordering.

8. Application Recommendations

8.1 Typical Application Scenarios

• Optical Indicators: Power status, mode selection, and alert indicators in consumer electronics, appliances, and automotive interiors.
• Coupling into Light Guides: The wide viewing angle and optimized reflector make this LED ideal for edge-lighting acrylic or polycarbonate light pipes, commonly used for illuminating symbols, buttons, or creating uniform backlit panels.
• Backlighting: Suitable for small LCD displays, keypad illumination in mobile phones, and backlighting membrane switches or decorative panels.
• General Lighting: Can be used in arrays for low-level ambient or accent lighting.

8.2 Design Considerations

• Current Limiting: Always use a series current-limiting resistor or a constant-current driver. The forward voltage varies, so driving with a constant voltage source is not recommended as it can lead to thermal runaway.
• Thermal Management: For designs requiring high brightness or operating in warm environments, ensure adequate PCB copper area (thermal pads) to conduct heat away from the LED solder joints.
• Optical Design: When used with light pipes, the distance and alignment between the LED and the pipe entrance are critical for efficiency. Optical simulation or prototyping is advised.
• ESD Protection: Although the device has some ESD protection, incorporating transient voltage suppression on sensitive lines or using ESD-safe handling procedures during assembly is good practice.

9. Technical Comparison and Differentiation

The 65-11 series differentiates itself through its specific combination of a wide viewing angle and a package optimized for light guide coupling. Compared to standard side-view LEDs, the top-view emission pattern is more suitable for applications where the LED is mounted perpendicular to the viewing surface. Compared to other top-view LEDs, the integrated inter-reflector is a designed feature aimed at improving optical efficiency in guided light applications, potentially offering better performance in light pipe systems than a generic top-view LED without such a feature.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED at 30mA continuously?
A: The Absolute Maximum Rating is 30mA at 25°C ambient. For reliable long-term operation, it is advisable to operate below this maximum. The typical operating condition specified is 20mA. Furthermore, the current must be derated if the ambient temperature is above 25°C, as shown in the derating curve.

Q: Why is there such a large range in luminous intensity (715-1800 mcd)?
A: This range represents the total spread across all production bins. Individual LEDs are sorted into tighter bins (V1, V2, W1, W2). By specifying a required bin code when ordering, you can ensure you receive LEDs with a consistent and known minimum brightness.

Q: How do I choose the right current-limiting resistor?
A: Use Ohm's Law: R = (V_supply - V_F) / I_F. Use the maximum V_F from the datasheet (or your specified voltage bin) to ensure enough voltage is dropped across the resistor to limit current properly under all conditions. For a 5V supply and a max V_F of 3.65V at 20mA: R = (5 - 3.65) / 0.02 = 67.5Ω. A standard 68Ω resistor would be appropriate. Always calculate the resistor's power rating as well: P = I² * R.

11. Practical Design and Usage Case

Case: Illuminated Tactile Switch Panel
A designer is creating a control panel with multiple tactile switches that need to be backlit. Each switch has a translucent cap and a light pipe underneath. The 65-11 LED is chosen because its top-view emission and wide angle efficiently couple light into the base of the light pipe. The designer selects bin W1 for consistent, medium-high brightness. LEDs are placed on the PCB directly beneath each light pipe. A constant current of 18mA is used (slightly below the 20mA spec to enhance longevity and reduce heat). The forward voltage bin E6 is specified to ensure uniform brightness when all LEDs are powered in parallel from a single voltage rail with individual series resistors. The PCB layout includes small thermal relief pads connected to a ground plane to help dissipate heat.

12. Operating Principle Introduction

This white LED operates on the principle of photoluminescence. The core is a semiconductor chip made of InGaN, which emits blue light when electrons recombine with holes across its bandgap upon the application of a forward bias (current). This blue light is not emitted directly. Instead, it strikes a layer of phosphor coating (typically YAG:Ce - Yttrium Aluminum Garnet doped with Cerium) that is deposited on or around the chip. The phosphor absorbs a portion of the blue photons and re-emits light across a broader spectrum in the yellow and red regions. The human eye perceives the mixture of the remaining blue light and the converted yellow/red light as white light. The exact shade or correlated color temperature (CCT) of the white light is determined by the composition and thickness of the phosphor layer.

13. Technology Trends

The general trend in SMD LEDs like the 65-11 series is towards higher efficiency (more lumens per watt), which reduces power consumption and heat generation for the same light output. There is also a drive for improved color rendering index (CRI), especially for lighting applications, which involves using more complex multi-phosphor systems. Miniaturization continues, with even smaller package sizes becoming available. Furthermore, the integration of control electronics, such as constant-current drivers or PWM (Pulse Width Modulation) controllers, directly into the LED package (\"smart LEDs\") is a growing trend, simplifying circuit design for the end user. The underlying InGaN technology for blue chips is mature, with ongoing research focused on reducing efficiency droop at high currents and improving longevity at higher operating temperatures.