Orange LED RF-OU1808TS-CB-E0 Specification - 1.8x0.8x0.5mm - Voltage Bins 1.8-2.4V - 72mW Power - English Technical Datasheet

1. Product Overview

The RF-OU1808TS-CB-E0 is a surface-mount orange chip LED manufactured using a high-efficiency orange semiconductor die. The device is housed in a miniature 1.8mm × 0.8mm × 0.50mm package, making it suitable for compact electronic assemblies. With its ultra-wide viewing angle of 140 degrees, this LED provides excellent light distribution for indicator and display applications. It is fully compatible with standard SMT assembly and soldering processes, and meets RoHS environmental requirements. The moisture sensitivity level is rated at Level 3, requiring proper handling to avoid moisture absorption.

1.1 Features

• Extremely wide viewing angle (2θ1/2 = 140° typical)
• Suitable for all SMT assembly and solder processes
• Moisture sensitivity level: Level 3 (per JEDEC)
• RoHS compliant (free of lead, mercury, cadmium, and other restricted substances)
• Compact package dimensions: 1.8mm (L) × 0.8mm (W) × 0.50mm (H)
• Available in multiple brightness and wavelength bins

1.2 Applications

• Optical indicators and status lights
• Switches, symbols, and backlit displays
• General-purpose illumination in electronic devices
• Portable and battery-powered equipment
• Automotive interior lighting (when compatible with voltage and temperature ranges)

2. Package Dimensions and Soldering Patterns

The LED package is defined by precise mechanical drawings. The top view shows a rectangular body with length 1.80mm and width 0.80mm. The side view indicates a total height of 0.50mm (including a lens protrusion of approximately 0.15mm). The bottom view reveals two solder pads: pad 1 (cathode) is 0.37mm × 0.80mm, and pad 2 (anode) is 0.90mm × 0.80mm. Polarity is marked on the bottom view with a "+" sign near the anode pad. The recommended soldering footprint provides PCB land patterns: a cathode pad of 1.3mm × 0.8mm and an anode pad of 2.6mm × 0.8mm, with a spacing of 0.95mm between the inner edges. All dimensions have a tolerance of ±0.2mm unless otherwise noted. The mechanical interface ensures reliable solder joint formation and optical alignment.

3. Technical Parameter Analysis

3.1 Electrical and Optical Characteristics (at Ts=25°C, IF=20mA)

The device is tested under a forward current of 20mA at an ambient solder point temperature of 25°C. Key electrical parameters include:

• Forward Voltage (VF): Binned into ranges: B1 (1.8-1.9V), B2 (1.9-2.0V), C1 (2.0-2.1V), C2 (2.1-2.2V), D1 (2.2-2.3V), D2 (2.3-2.4V). Typical values are midpoints of each bin.
• Dominant Wavelength (λD): Available in bins: D00 (615-620nm), E00 (620-625nm), F00 (625-630nm). The orange emission peaks around 620nm depending on bin.
• Luminous Intensity (IV): Binned as J10 (350-430mcd), J20 (430-530mcd), K10 (530-650mcd), K20 (650-800mcd). The typical intensity for a given bin is within the range.
• Spectral Half Bandwidth: Typically 15nm, indicating a relatively narrow spectral emission.
• Viewing Angle (2θ1/2): 140° typical, very wide for uniform illumination.
• Reverse Current (IR): Maximum 10μA at VR=5V.
• Thermal Resistance (RTHJ-S): Maximum 260°C/W, indicating moderate thermal dissipation capability.

3.2 Absolute Maximum Ratings (at Ts=25°C)

The device must not exceed the following limits:

• Power Dissipation (Pd): 72mW max
• Forward Current (IF): 30mA continuous max
• Peak Forward Current (IFP): 60mA (1/10 duty, 0.1ms pulse width)
• Electrostatic Discharge (ESD) HBM: 2000V max
• Operating Temperature (Topr): -40°C to +85°C
• Storage Temperature (Tstg): -40°C to +85°C
• Junction Temperature (Tj): 95°C max

Care must be taken to ensure junction temperature never exceeds 95°C. The maximum forward current should be determined by the actual thermal environment of the application.

3.3 Typical Optical Characteristics Curves (Description)

Although actual curves are not reproduced here, the datasheet provides several typical characteristic graphs based on measurements at Ta=25°C:

• Forward Voltage vs. Forward Current (Fig 1-6): As current increases from 0 to 30mA, forward voltage rises approximately linearly from about 1.8V to 2.5V, with a slight knee around 10-15mA.
• Forward Current vs. Relative Intensity (Fig 1-7): Relative light output increases with forward current but with a sub-linear relationship; at 30mA, relative intensity is roughly 1.5 times that at 20mA.
• Pin Temperature vs. Relative Intensity (Fig 1-8): As pin temperature rises from -40°C to +100°C, relative intensity decreases by about 20-30%, indicating negative temperature dependence.
• Pin Temperature vs. Forward Voltage (Fig 1-9): Forward voltage decreases with increasing temperature at a rate of approximately -2mV/°C.
• Forward Current vs. Dominant Wavelength (Fig 1-10): Increasing forward current from 5 to 30mA causes a slight red-shift (increase) of dominant wavelength by about 2-3nm.
• Relative Intensity vs. Wavelength (Fig 1-11): Spectral distribution shows a peak around 620nm with a half-width of about 15nm.
• Radiation Pattern (Fig 1-12): The emission is nearly Lambertian with maximum intensity at 0° and dropping to half intensity at about ±70° (140° viewing angle).

4. Binning System Explanation

The RF-OU1808TS-CB-E0 uses a multi-bin system to ensure consistent performance in applications:

• Wavelength Binning: Dominant wavelength is sorted into three main bins: D00 (615-620nm), E00 (620-625nm), F00 (625-630nm). This allows selection for precise color matching.
• Luminous Intensity Binning: Four intensity bins (J10, J20, K10, K20) cover a range from 350 to 800mcd, enabling brightness consistency in arrays.
• Voltage Binning: Six forward voltage bins (B1 to D2) from 1.8V to 2.4V help in designing series circuits and predicting power consumption.
• All bin codes are printed on the reel label as "BIN CODE", "WLD" (wavelength), and "VF" (voltage). Customers should specify required bins when ordering.

5. Packaging and Shipping Information

5.1 Packaging Specifications

The LEDs are packaged in tape and reel format. Each reel contains 4000 pieces. The carrier tape is 8mm wide with pockets spaced at 4mm pitch. The reel has dimensions: A=178±1mm (outer diameter), B=60±1mm (hub), C=13.0±0.5mm (hole). The tape includes polarity orientation markers to ensure correct placement during pick-and-place assembly.

5.2 Moisture Resistant Packing

Each reel is sealed in a moisture barrier bag (MBB) with a desiccant and humidity indicator card. A label on the bag shows part number, specification number, lot number, bin codes, quantity, and date. The storage conditions before opening the bag are ≤30°C and ≤75% RH for up to one year from the date of sealing. After opening, the LEDs must be used within 168 hours if stored at ≤30°C and ≤60% RH. If the exposure time exceeds the limit or the bag is damaged, a baking treatment at 60±5°C for ≥24 hours is required before use.

5.3 Cardboard Box

Multiple reels are packed in a cardboard box for shipment. The box is labeled with product and quantity information.

6. Reliability Test Conditions and Criteria

Failure criteria: Forward voltage shift beyond 1.1 times upper spec limit (U.S.L), reverse current exceeding 2.0 times U.S.L, or luminous flux dropping below 0.7 times lower spec limit (L.S.L). These tests are conducted on single LEDs or strips under good heat dissipation conditions. When designing circuits, users must consider current, voltage distribution, and thermal management.

7. SMT Reflow Soldering Guidelines

The recommended reflow profile is based on lead-free soldering with a peak temperature of 260°C (max 10 seconds). Preheating from 150°C to 200°C over 60-120 seconds, then ramp-up to the peak at ≤3°C/s. The time above 217°C (TL) should be 60-150 seconds. Cooling rate ≤6°C/s. Total time from 25°C to peak should not exceed 8 minutes. Only two reflow cycles are allowed; if more than 24 hours pass between cycles, the LEDs may be damaged by moisture absorption. Do not apply mechanical stress during heating. Hand soldering should be done at ≤300°C within 3 seconds, only once. Repair is not recommended; if unavoidable, use a double-head iron and pre-verify effect on LED characteristics.

8. Handling Precautions and Storage

To ensure long-term reliability, the following precautions must be observed:

• Do not allow sulfur or its compounds in the environment or mating materials to exceed 100 ppm. This is an advisory, not a warranty.
• Halogen content: Bromine and Chlorine each must be <900 ppm, and their sum <1500 ppm in external materials. Again, advisory only.
• Avoid volatile organic compounds (VOCs) that can penetrate the silicone encapsulant and cause discoloration or light loss.
• Handle LEDs with tweezers on the side surfaces; do not touch the silicone lens directly to avoid damage to internal circuitry.
• Always use a current-limiting resistor; a slight voltage shift can cause large current change and burn out the LED.
• Design circuits so that reverse voltage is not applied to the LED; otherwise, migration and damage may occur.
• Thermal design is critical: heat can reduce brightness and shift color. Ensure adequate heat sinking.
• Cleaning: Use isopropyl alcohol only if necessary; do not use ultrasonic cleaning as it may damage the LED.
• ESD sensitivity (2000V HBM) requires proper grounding and handling in ESD-protected areas.
• Storage: Unopened bags can be stored at ≤30°C/≤75%RH for up to one year. Once opened, use within 168 hours or bake at 60±5°C for 24 hours.

9. Application Design Considerations

When incorporating the RF-OU1808TS-CB-E0 into a design, consider the following:

• Use constant-current drive to ensure consistent brightness across bins and to avoid exceeding maximum current. A series resistor is typically sufficient for low-voltage applications.
• For arrays, match VF bins and wavelength bins to maintain uniform appearance. The wide viewing angle allows close spacing without perceivable hot spots.
• The small package (0805) enables high-density placement; ensure adequate PCB copper area for heat dissipation if operating near maximum ratings.
• Consider ambient temperature: at high temperatures, forward voltage drops, and luminous intensity decreases. Derate current accordingly.
• The 15nm spectral half bandwidth yields a relatively pure orange color; not suitable for white mixing but excellent for warning indicators.
• In pulse mode (1/10 duty, 0.1ms), the peak current can reach 60mA, but the average current must remain below 30mA.

10. Technical Comparison with Similar Products

Compared to generic 0805 orange LEDs, the RF-OU1808TS-CB-E0 offers several advantages:

• Binned VF and wavelength allow tighter control in production.
• High luminous intensity range (up to 800mcd) is suitable for outdoor visible indicators.
• Ultra-wide 140° viewing angle outperforms many competitors which typically offer 120°.
• ESD protection up to 2000V reduces failure during assembly.
• Comprehensive reliability testing (1000h life, thermal shock, etc.) ensures robust performance.

11. Frequently Asked Questions (FAQ)

Q: What is the typical forward current for this LED?
A: The recommended operating current is 20mA, but the device can be driven up to 30mA continuous with proper heat sinking.

Q: Can I use this LED in a 5V circuit directly?
A: No. A current-limiting resistor is required. For VF=2.0V at 20mA, use (5-2.0)/0.02 = 150Ω. Connect resistor in series with the LED.

Q: How sensitive is the wavelength to temperature?
A: The dominant wavelength shifts slightly with current, but temperature primarily affects intensity. Typical drift is <2nm over the operating temperature range.

Q: What is the recommended storage after opening the bag?
A: Store at ≤30°C and ≤60%RH for up to 168 hours. If not used within this time, bake at 60°C for 24 hours before soldering.

Q: Are these LEDs compatible with lead-free reflow?
A: Yes. They are rated for lead-free soldering with peak temperature 260°C for up to 10 seconds. Two reflow cycles allowed.

12. Practical Design Example

Example: Orange Status Indicator on a 3.3V Microcontroller

A microcontroller drives the LED through a GPIO pin. To limit current to 20mA, calculate resistor: R = (3.3V - VF) / 0.02. VF min is 1.8V, so max R = (3.3-1.8)/0.02 = 75Ω. Choose standard 68Ω. If VF is 2.4V, current will be (3.3-2.4)/68 = 13.2mA, which is fine. Use a P-channel MOSFET if sink current exceeds GPIO capability. The 140° viewing angle ensures visibility from wide angles. Place LED near the edge of the PCB for best visibility. Use a small cover if needed.

13. Working Principle and Technology

The RF-OU1808TS-CB-E0 is based on a direct bandgap semiconductor material (GaAsP or similar) that emits light when electrons recombine with holes. The orange die is typically an aluminum gallium indium phosphide (AlGaInP) structure grown on a GaAs substrate. When forward biased, electrons and holes are injected into the active region and recombine radiatively, producing photons with energy corresponding to the bandgap (~2.0 eV, giving ~620nm wavelength). The chip is encapsulated in a clear or slightly diffused silicone lens that also shapes the beam profile to the specified 140° viewing angle. The package includes a small heat slug embedded to conduct heat from the junction to the solder pads. The device is manufactured using wafer processing, dicing, die attachment, wire bonding, and encapsulation.

14. Development Trends in Orange SMD LEDs

The trend for orange LEDs like the RF-OU1808TS-CB-E0 includes:

• Increasing efficacy (lm/W) through improved epitaxy and die design.
• Miniaturization: packages are shrinking below 0603 while maintaining high intensity.
• Better thermal management: lower thermal resistance packages allow higher current densities.
• Integration with smart control: future versions may include integrated ICs for I2C or PWM control.
• Expansion into automotive and horticultural lighting (e.g., for specific plant responses).
• Even wider viewing angles (>150°) for seamless backlighting.

This device represents a mature technology optimized for cost-effective, reliable performance in general indicator applications.