Orange SMD LED RF-OUL150TS-CA-E1 - 3.2x1.6x1.88mm - Voltage 1.8-2.3V - Power 69mW - Technical Datasheet

1. Product Overview

1.1 General Description

The RF-OUL150TS-CA-E1 is a surface-mount orange light emitting diode fabricated using an orange chip. Its compact package dimensions are 3.2 mm × 1.6 mm × 1.88 mm, making it ideal for space-constrained applications. This LED is designed for all SMT assembly and soldering processes, offering excellent reliability and consistent performance.

1.2 Key Features

• Narrow Viewing Angle: The device exhibits a 50% Iv viewing angle of only 30°, providing focused light output.
• SMT Compatible: Suitable for all standard SMT assembly and reflow soldering processes.
• Moisture Sensitivity: Rated as moisture sensitivity level 3 (MSL 3), requiring careful handling and storage.
• RoHS Compliant: Fully compliant with RoHS environmental directives.

1.3 Applications

• Optical indicators and signal lights
• Switches, symbols, and display backlighting
• General purpose visual indication in consumer electronics and industrial equipment

2. Technical Specifications

2.1 Package Dimensions

The LED is housed in a 3.2 mm × 1.6 mm × 1.88 mm (length × width × height) surface-mount package. The bottom view shows two terminals (Pad 1 and Pad 2) with a polarity mark for correct orientation. Recommended soldering patterns are provided in the datasheet to ensure optimal thermal and electrical performance. All dimensions are in millimeters with a general tolerance of ±0.2 mm unless otherwise specified.

2.2 Electrical and Optical Characteristics (Ts = 25°C)

The following table summarizes the key electrical and optical parameters at an ambient temperature of 25°C and a forward current of 20 mA.

2.3 Absolute Maximum Ratings (Ts = 25°C)

Care must be taken not to exceed the absolute maximum ratings. The junction temperature should be kept below 95°C under any operating condition. The actual maximum forward current should be determined by measuring the package temperature to ensure the junction temperature limit is not exceeded.

3. Binning System and Selection

3.1 Wavelength / Chromaticity Bins

The dominant wavelength is binned into two groups: E00 (620–625 nm) and F00 (625–630 nm). This allows designers to select the exact shade of orange required for their application.

3.2 Luminous Intensity Bins

Three intensity bins are available: M00 (1200–1800 mcd), N00 (1800–2800 mcd), and O00 (2800–4300 mcd). The choice depends on the desired brightness and the optical efficiency of the system.

3.3 Forward Voltage Bins

Forward voltage is sorted into five bins (B1, B2, C1, C2, D1) spanning 1.8 V to 2.3 V. This binning ensures consistent current sharing when LEDs are used in parallel strings.

4. Performance Curves and Analysis

4.1 Forward Voltage vs. Forward Current

The Vf-I curve shows the typical exponential relationship. At 20 mA, the forward voltage falls within the specified bin ranges. The curve helps in designing current-limiting resistors or constant-current drivers.

4.2 Relative Intensity vs. Forward Current

Relative luminous intensity increases approximately linearly with current up to 30 mA. At higher currents, saturation effects reduce efficiency. The typical curve indicates a 100% relative intensity at 20 mA.

4.3 Temperature Effects

The solder temperature vs. relative intensity curve shows a slight decrease in intensity as the temperature rises. Similarly, the forward current must be derated at elevated temperatures to avoid exceeding the maximum junction temperature. The thermal resistance of 450 °C/W highlights the need for good thermal management, especially when driving at high currents.

4.4 Spectral Distribution

The relative intensity vs. wavelength curve confirms a narrow spectral half bandwidth of typically 15 nm. The peak wavelength is approximately at the centroid of the 620–630 nm range, providing a pure orange emission.

4.5 Radiation Pattern

The diagram characteristics of radiation show a narrow beam pattern with a 30° viewing angle (50% Iv). This makes the LED suitable for applications requiring directional light, such as spot indicators or backlighting of small symbols.

5. Mechanical and Packaging Information

5.1 Carrier Tape and Reel Dimensions

The LEDs are packaged in 8 mm wide carrier tape with a 178 mm diameter reel. Each reel contains 2000 pcs. The tape pocket pitch is designed for standard SMT pick-and-place equipment. The reel includes a label with part number, lot number, bin codes, quantity, and date code.

5.2 Moisture Barrier Bag and Storage

To protect against moisture absorption, the reels are sealed in a moisture barrier bag with a desiccant and a humidity indicator card. The bag must remain sealed until use. Storage conditions: before opening the bag – temperature ≤ 30°C, humidity ≤ 75% for up to one year; after opening – temperature ≤ 30°C, humidity ≤ 60% for 168 hours (7 days). If the storage time exceeds these limits, a baking process at 60±5°C for at least 24 hours is required before soldering.

5.3 Cardboard Box

Multiple reels are packed in a standard cardboard box for shipping. The box is labeled with product information and handling precautions.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The LED is compatible with lead-free reflow soldering. The recommended profile is based on JEDEC standards:

• Average ramp-up rate (Tsmax to Tp): Max 3°C/s
• Preheat: 150°C to 200°C for 60–120 s
• Time above 217°C (TL): 60–150 s
• Peak temperature (Tp): 260°C, max 10 s
• Hold time within 5°C of Tp: max 30 s
• Cooling rate: Max 6°C/s
• Total time from 25°C to peak: max 8 minutes

Reflow soldering should not be performed more than twice. If the interval between two soldering passes exceeds 24 hours, the LEDs may absorb moisture and be damaged.

6.2 Hand Soldering

If hand soldering is necessary, use a soldering iron at a temperature below 300°C for less than 3 seconds per pad. Only one hand soldering operation is allowed per LED.

6.3 Precautions

• Do not mount LEDs on warped or non-coplanar PCBs.
• Avoid mechanical stress or excessive vibration during cooling after soldering.
• Do not rapidly cool the device after reflow.
• If repair is required, use a double-head soldering iron and verify that the LED characteristics are not damaged.

7. Reliability Testing and Criteria

7.1 Test Conditions

The LED has been qualified through the following reliability tests (22 pcs per test, acceptance criteria 0/1):

• Reflow (JESD22-B106): 260°C max, 10 s, 2 times
• Temperature Cycle (JESD22-A104): -40°C to 100°C, 100 cycles
• Thermal Shock (JESD22-A106): -40°C to 100°C, 300 cycles
• High Temperature Storage (JESD22-A103): 100°C for 1000 h
• Low Temperature Storage (JESD22-A119): -40°C for 1000 h
• Life Test (JESD22-A108): 25°C, IF=20 mA for 1000 h

7.2 Failure Criteria

Failure is defined as any parameter exceeding the following limits:

• Forward voltage: > 1.1 × Upper Standard Limit (U.S.L)
• Reverse current: > 2.0 × U.S.L (max 10 μA)
• Luminous flux: < 0.7 × Lower Standard Limit (L.S.L)

These tests confirm the LED's robustness under typical application conditions.

8. Design Considerations and Application Notes

8.1 Thermal Management

Given the thermal resistance of 450°C/W, proper heat sinking is essential when operating near maximum current. The junction temperature must remain below 95°C. Designers should provide adequate copper areas on the PCB and consider active cooling if necessary.

8.2 Sulfur and Halogen Sensitivity

The LED encapsulant can be degraded by sulfur compounds. Sulfur content in the surrounding environment and mating materials should be kept below 100 PPM. Similarly, bromine and chlorine compounds should each be below 900 PPM, with a total below 1500 PPM, to prevent chemical attack on the internal structure.

8.3 Electrostatic Discharge (ESD) Protection

Like all semiconductor devices, this LED is sensitive to ESD. The HBM rating is 2000 V. Standard ESD precautions (grounded workstations, antistatic wrist straps, conductive packaging) should be used during handling and assembly.

8.4 Circuit Design

A current-limiting resistor is mandatory for each LED or string to prevent current runaway due to forward voltage variation. The driving circuit should ensure that reverse voltage is never applied across the LED, as this can cause migration and failure.

9. Comparison with Alternative Technologies

9.1 vs. Standard Wide-Angle Orange LEDs

The narrow 30° viewing angle of the RF-OUL150TS-CA-E1 makes it superior for applications requiring concentrated light output with high on-axis intensity. Wide-angle LEDs (e.g., 120°) would require additional optics to achieve the same directionality, adding cost and complexity.

9.2 vs. Red LEDs in Similar Packages

Orange LEDs (620–630 nm) offer better visibility in ambient light compared to deep red (660 nm) for human eye detection. They also provide a distinct color for status indication, differentiating them from standard red or green indicators.

10. Frequently Asked Questions

10.1 What is the maximum forward current for continuous operation?

The absolute maximum rating is 30 mA, but the actual limit depends on thermal conditions. At 25°C ambient and with good heat sinking, 30 mA is acceptable. At higher temperatures, derating is required.

10.2 How do I select the correct bin for my application?

Choose wavelength bin (E00 or F00) based on desired color hue. Select intensity bin (M00, N00, O00) based on required brightness. For voltage, pick the bin that matches your driver output voltage range to minimize power dissipation in the current-limiting resistor.

10.3 Can this LED be used in outdoor applications?

The operating temperature range (-40°C to +85°C) is suitable for many outdoor environments. However, the LED is not specifically rated for moisture ingress or UV exposure. Additional conformal coating or encapsulation may be required for harsh outdoor conditions.

11. Case Study: Designing a Directional Status Indicator

In a control panel requiring bright, focused orange indicators visible from 3 meters, engineers selected the RF-OUL150TS-CA-E1 with bin O00 (2800–4300 mcd) and F00 (625–630 nm). A constant-current driver set to 20 mA powers each LED. The PCB pad design followed the recommended soldering pattern with adequate copper for heat dissipation. The narrow viewing angle eliminated the need for secondary optics. The resulting assembly passed all reliability tests and achieved a uniform light output with minimal cross-talk between adjacent indicators.

12. Underlying Principles and Future Trends

12.1 Light Emission Principle

This LED uses an orange chip based on the AlInGaP (aluminum indium gallium phosphide) material system, which emits light when electrons recombine with holes in the direct-bandgap semiconductor. The narrow spectral width indicates high color purity.

12.2 Industry Trends

Ongoing developments in chip technology are pushing for higher luminous efficacy and smaller package sizes. The trend towards miniaturization and higher brightness continues, enabling more compact and energy-efficient designs. Additionally, the adoption of automated optical inspection and tighter binning improves consistency for display and signage applications.