Orange SMD LED 1206 Package Datasheet - Dimensions 3.2mm x 1.6mm x 0.7mm - Voltage 1.8-2.3V - Power 72mW - English Technical Document

1. Description

This document provides comprehensive technical specifications and handling instructions for a surface-mount Orange Light Emitting Diode (LED) in a 1206-type package footprint.

1.1 General Description

The device is a monochromatic LED emitting orange light. The light source is based on an orange semiconductor chip encapsulated within a compact surface-mount package. The physical dimensions of the package are 3.2mm in length, 1.6mm in width, and 0.7mm in height, making it suitable for high-density PCB designs.

1.2 Features

• Extremely wide viewing angle.
• Fully compatible with standard Surface Mount Technology (SMT) assembly and solder reflow processes.
• Moisture Sensitivity Level (MSL) rated at Level 3.
• Compliant with Restriction of Hazardous Substances (RoHS) directives.

1.3 Application

• Status and power indicators in electronic devices.
• Backlighting for switches, buttons, and symbols.
• General-purpose indicator applications in consumer electronics, industrial controls, and automotive interiors.

1.4 Package Dimension

The mechanical outline and recommended soldering footprint are critical for PCB layout. The LED package has a rectangular body with two anode/cathode terminals on the bottom. The polarity is indicated by a marking on the top or bottom surface (typically a green dot or a chamfered corner). The recommended solder pad pattern ensures proper solder joint formation and mechanical stability during reflow. All dimensional units are in millimeters, with standard tolerances of ±0.2mm unless otherwise specified. Key dimensions include an overall length of 3.20mm, a width of 1.60mm, and a height of 0.70mm.

1.5 Product Parameters

1.5.1 Electrical and Optical Characteristics (Ts=25°C)

These parameters are tested under standard conditions (Forward Current, IF=20mA; Reverse Voltage, VR=5V). The product is offered in multiple bins for forward voltage (VF) and luminous intensity (IV), allowing for design flexibility and consistency in production.

• Spectral Half Bandwidth (Δλ): Typically 15nm, defining the purity of the orange color.
• Forward Voltage (VF): Ranges from 1.8V to 2.3V, divided into multiple bins (B1, B2, C1, C2, D1).
• Dominant Wavelength (λD): Defines the perceived color. Two bins are available: E00 (620-625nm) and F00 (625-630nm), both in the orange/red-orange spectrum.
• Luminous Intensity (IV): The light output, measured in millicandelas (mcd). Available in multiple bins from 1AQ (100-130 mcd) to 1GW (220-250 mcd) at 20mA.
• Viewing Angle (2θ1/2): A very wide 140 degrees, ensuring visibility from many angles.
• Reverse Current (IR): Maximum of 10μA at 5V reverse bias.
• Thermal Resistance (RΘJ-S): Junction-to-solder point thermal resistance is 450°C/W, a key parameter for thermal management.

1.5.2 Absolute Maximum Ratings (Ts=25°C)

These are stress limits beyond which permanent damage may occur. Operation should be maintained within these limits.

• Power Dissipation (Pd): 72 mW
• Continuous Forward Current (IF): 30 mA
• Peak Forward Current (IFP): 60 mA (pulsed, 1/10 duty cycle, 0.1ms pulse width)
• Electrostatic Discharge (ESD) HBM: 2000V
• Operating Temperature (Topr): -40°C to +85°C
• Storage Temperature (Tstg): -40°C to +85°C
• Maximum Junction Temperature (Tj): 95°C

Design Note: The junction temperature must not exceed its maximum rating. The operating current should be determined after considering the actual package temperature in the application to ensure reliable long-term performance.

1.6 Typical Optical Characteristics Curves

These graphs illustrate the relationship between key parameters, essential for circuit design and performance prediction.

• Forward Voltage vs. Forward Current: Shows the non-linear IV characteristic of the diode. The voltage increases with current, with the curve shape depending on the specific VF bin.
• Relative Intensity vs. Forward Current: Demonstrates how light output increases with drive current, typically in a sub-linear fashion at higher currents due to heating and efficiency droop.
• Relative Intensity vs. Pin Temperature / Ambient Temperature: Illustrates the thermal quenching effect, where luminous output decreases as the LED's temperature rises. This is critical for applications in high-temperature environments.
• Forward Current vs. Dominant Wavelength: Shows the slight shift in the peak emitted wavelength with changing drive current.
• Relative Intensity vs. Wavelength: The emission spectrum plot, showing the intensity distribution across wavelengths, centered around the dominant wavelength (e.g., ~610nm).
• Radiation Pattern Diagram: A polar plot visualizing the 140-degree wide viewing angle, confirming near-Lambertian emission.

2. Packaging

The LEDs are supplied in industry-standard packaging for automated SMT assembly.

2.1 Packaging Specification

2.1.1 Carrier Tape Dimension

The components are housed in embossed carrier tape. The tape dimensions (pocket size, pitch, width) are specified to be compatible with standard automated pick-and-place equipment feeders.

2.1.2 Reel Dimension

The carrier tape is wound onto a reel. Reel dimensions (diameter, hub size, flange width) determine how many units are supplied per reel and compatibility with placement machine feeders.

2.1.3 Label Form Specification

Each reel contains a label with critical information: part number, quantity, lot number, date code, and moisture sensitivity level (MSL 3).

2.2 Moisture Resistant Packing

Due to its MSL 3 rating, the LEDs are packaged with a desiccant and humidity indicator card inside a moisture barrier bag. The bag is sealed to protect the components from ambient moisture during storage and transportation. Once the bag is opened, components must be used within the specified floor life (typically 168 hours for MSL 3 at factory conditions <30°C/60%RH) or be re-baked according to guidelines.

2.3 Cardboard Box

Sealed moisture barrier bags are packed in cardboard boxes for shipment and storage, providing physical protection.

2.4 Reliability Test Items And Conditions

The product undergoes a series of reliability tests to ensure performance under various environmental stresses. Typical tests may include (inferred from industry standards):

• High Temperature Storage Life: Exposed to maximum storage temperature for an extended period.
• Temperature Cycling: Subjected to repeated cycles between high and low temperature extremes.
• Moisture Resistance: Tested under high humidity and temperature conditions.
• Solder Heat Resistance: Subjected to multiple reflow soldering cycles to simulate rework conditions.
• ESD Sensitivity: Tested per Human Body Model (HBM) to verify the 2000V rating.

2.5 Criteria For Judging Damage

This section defines the visual and functional inspection criteria post-reliability testing. Failure criteria typically include catastrophic failure (no light), significant parameter shift (e.g., luminous intensity drop > 50%, VF change > ±0.2V), or visible physical damage like cracks, discoloration, or delamination.

3. SMT Reflow Soldering Instructions

Proper soldering is critical for reliability. This component is designed for lead-free (Pb-free) reflow soldering processes.

3.1 SMT Reflow Soldering Profile

The recommended reflow temperature profile must be followed to prevent thermal damage. Key parameters include:

• Preheat / Soak Zone: A gradual ramp to activate flux and homogenize board temperature, typically between 150°C and 200°C.
• Reflow Zone: The peak temperature experienced by the LED body must not exceed the maximum allowable limit (often 260°C for a short time, e.g., 10 seconds). The time above liquidus (TAL) is also controlled.
• Cooling Zone: A controlled cool-down rate to solidify solder joints and minimize thermal stress.

It is recommended to use the lowest possible peak temperature and shortest time above liquidus that still yields reliable solder joints. Excessive heat can cause epoxy discoloration, internal wire bond failure, or chip degradation.

4. Handling Precautions

4.1 Handling and Storage Guidelines

• ESD Protection: Although rated for 2000V HBM, handle with standard ESD precautions (grounded workstations, wrist straps) to prevent latent damage.
• Moisture Sensitivity: Adhere strictly to the MSL 3 handling requirements. After opening the moisture barrier bag, use components within the specified floor life. If exceeded, bake according to recommended procedures (e.g., 125°C for 24 hours) before reflow.
• Mechanical Stress: Avoid applying direct mechanical force or vibration to the LED lens, as it may damage the internal structure.
• Cleaning: If post-solder cleaning is required, use compatible solvents that do not attack the epoxy lens or package marking. Avoid ultrasonic cleaning, which can cause micro-cracks.
• Storage: Store unopened bags in a cool, dry environment. Avoid exposure to direct sunlight or corrosive gases.

5. Application and Design Considerations

5.1 Current Limiting

An LED is a current-driven device. Always use a series current-limiting resistor or a constant-current driver. The resistor value can be calculated using Ohm's Law: R = (Vsupply - VF_LED) / IF. Choose a resistor power rating appropriately. For extended lifespan and reliability, consider driving the LED below its absolute maximum current, e.g., at 20mA instead of 30mA.

5.2 Thermal Management

While small, this LED dissipates heat. The 450°C/W thermal resistance means the junction temperature will rise significantly above the PCB temperature at higher currents. Ensure adequate copper area on the PCB under and around the LED solder pads to act as a heatsink. This is especially important in high-ambient-temperature applications or when driving at currents >20mA.

5.3 Optical Design

The 140-degree viewing angle provides wide, diffuse illumination. For applications requiring a more directed beam, external lenses or light pipes can be used. The orange color is effective for warning or status indicators and is highly visible.

5.4 Polarity and Placement

Incorrect polarity will prevent the LED from lighting. Always verify the polarity marking (e.g., green dot on cathode side) against the PCB silkscreen during assembly and inspection. Ensure the solder pad design matches the recommended footprint to prevent tombstoning or poor solder joints.