Orange SMD LED Datasheet - 2.0x1.25x1.1mm - 2.5V - 75mW - AlInGaP Technology - English Technical Document

1. Product Overview

This document provides the complete technical specifications for a high-brightness Orange Surface-Mount Device (SMD) LED. The device is designed for modern electronic assembly processes, featuring a compact EIA standard package suitable for automated placement equipment. It utilizes AlInGaP (Aluminum Indium Gallium Phosphide) semiconductor technology to produce a vibrant orange light source with high luminous efficiency. The product is compliant with green manufacturing standards and is lead-free in accordance with RoHS directives.

1.1 Core Advantages

• Automation Compatible: Supplied in 8mm tape on 7-inch reels, optimized for high-speed pick-and-place machines.
• Reflow Soldering Ready: Compatible with both infrared (IR) and vapor phase reflow soldering processes, ensuring reliable solder joints in mass production.
• High Brightness: Delivers typical luminous intensity up to 900 mcd at a standard drive current of 20mA.
• Wide Viewing Angle: Features a 110-degree viewing angle (2θ1/2), providing good light dispersion.
• Robust Construction: Designed to withstand standard SMD assembly and cleaning processes.

2. In-Depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

The following ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

• Power Dissipation (Pd): 75 mW at Ta=25°C. This is the maximum power the LED package can safely dissipate as heat.
• DC Forward Current (IF): 30 mA continuous. The maximum steady-state current that can be applied.
• Peak Forward Current: 80 mA, permissible only under pulsed conditions (1/10 duty cycle, 0.1ms pulse width).
• Reverse Voltage (VR): 5 V. Exceeding this voltage in reverse bias can cause junction breakdown.
• Operating Temperature Range: -40°C to +85°C. The ambient temperature range for reliable operation.
• Storage Temperature Range: -40°C to +100°C.
• Derating: The DC forward current must be linearly derated by 0.46 mA for every degree Celsius above 35°C ambient temperature to prevent overheating.

2.2 Electro-Optical Characteristics

Measured at Ta=25°C under specified test conditions, these parameters define the typical performance.

• Luminous Intensity (Iv): Ranges from 450 mcd (min) to 1120 mcd (max), with a typical value of 900 mcd at IF=20mA. Measured using a sensor filtered to the CIE photopic eye-response curve.
• Forward Voltage (VF): Typically 2.5V, with a range from 1.7V to 2.5V at IF=20mA. A tolerance of ±0.1V applies within specific voltage bins.
• Peak Wavelength (λP): 611 nm. The wavelength at which the spectral emission is strongest.
• Dominant Wavelength (λd): 605 nm. The single wavelength perceived by the human eye, derived from the CIE chromaticity diagram.
• Spectral Half-Width (Δλ): 15 nm. The width of the emission spectrum at half the peak intensity, indicating color purity.
• Reverse Current (IR): Maximum 100 μA at VR=5V.
• Capacitance (C): Typical 40 pF measured at VF=0V, f=1 MHz.

3. Binning System Explanation

To ensure consistency in applications, LEDs are sorted into performance bins. Two key parameters are binned: Luminous Intensity and Forward Voltage.

3.1 Luminous Intensity Binning

Units: mcd @ IF=20mA. Each bin has a tolerance of ±15%.

• U1: 450.0 – 560.0 mcd
• U2: 560.0 – 710.0 mcd
• V1: 710.0 – 900.0 mcd
• V2: 900.0 – 1120.0 mcd

3.2 Forward Voltage Binning

Units: V @ IF=20mA. Each bin has a tolerance of ±0.10V.

• 0: 1.7 – 1.8 V
• 1: 1.8 – 1.9 V
• 2: 1.9 – 2.0 V
• 3: 2.0 – 2.1 V
• 4: 2.1 – 2.2 V
• 5: 2.2 – 2.3 V
• 6: 2.3 – 2.4 V
• 7: 2.4 – 2.5 V

Designers should select the appropriate bin codes to match the brightness and voltage consistency requirements of their application, especially when multiple LEDs are used in parallel.

4. Performance Curve Analysis

While specific graphical curves are referenced in the datasheet (Fig.1, Fig.6), their implications are critical for design.

4.1 Luminous Intensity vs. Forward Current

The light output (Iv) is approximately proportional to the forward current (IF) within the recommended operating range. Driving the LED above 20mA will increase brightness but also generate more heat, requiring careful thermal management and adherence to absolute maximum ratings.

4.2 Forward Voltage vs. Forward Current

The V-I characteristic is non-linear. The forward voltage has a positive temperature coefficient, meaning it decreases slightly as the junction temperature increases for a given current.

4.3 Spectral Distribution

The emission spectrum is centered around 611 nm (peak) with a relatively narrow 15 nm half-width, characteristic of AlInGaP technology, providing a saturated orange color.

4.4 Thermal Considerations

The derating factor of 0.46 mA/°C above 35°C is crucial for reliability. In high ambient temperature environments or poorly designed PCBs, the maximum permissible continuous current must be reduced to prevent exceeding the junction temperature limit and accelerated lumen depreciation.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED conforms to an industry-standard SMD package outline. Key dimensions (in millimeters) define its footprint: approximately 2.0mm in length, 1.25mm in width, and 1.1mm in height. Detailed drawings specify pad spacing, component height, and lens geometry.

5.2 Polarity Identification

The cathode is clearly marked. Correct orientation during assembly is essential. The recommended PCB attachment pad layout is provided to ensure proper soldering and mechanical stability during reflow.

5.3 Tape and Reel Packaging

• Tape: Components are housed in 8mm wide embossed carrier tape.
• Reel: Tape is wound on a standard 7-inch (178mm) diameter reel.
• Quantity: 4000 pieces per full reel.
• Packing: Complies with EIA-481-1-B specifications. A maximum of two consecutive missing components (empty pockets) is allowed.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

A lead-free reflow profile per J-STD-020B is recommended.

• Pre-heat: 120–150°C for a maximum of 120 seconds.
• Peak Temperature: Maximum 260°C.
• Time Above Liquidus: Maximum 30 seconds within the peak temperature zone.
• Controlled ramp-up and cool-down rates are necessary to prevent thermal shock.

6.2 Hand Soldering

If manual soldering is necessary:

• Iron Temperature: Maximum 300°C.
• Soldering Time: Maximum 3 seconds per lead.
• This should be performed only once to avoid damaging the plastic package.

6.3 Cleaning

Only specified cleaning agents should be used. Immersing the LED in ethyl alcohol or isopropyl alcohol at room temperature for less than one minute is acceptable. Unspecified chemicals may damage the epoxy lens or package.

6.4 Moisture Sensitivity & Storage

This product is classified as Moisture Sensitivity Level (MSL) 3 per JEDEC J-STD-020.

• Sealed Bag: Store at ≤30°C and ≤90% RH. Use within one year of bag seal date.
• Opened Bag: Store at ≤30°C and ≤60% RH. Must be soldered within 168 hours (7 days) of exposure to factory ambient conditions.
• Baking: If the humidity indicator card turns pink (≥10% RH) or the 168-hour floor life is exceeded, bake at 60°C for at least 48 hours before use. Reseal unused parts with fresh desiccant.

7. Application Design Recommendations

7.1 Drive Circuit Design

LEDs are current-driven devices. For consistent performance:

• Current Limiting Resistor: Always use a series resistor with each LED to set the operating current, even when driven by a constant current source. This helps compensate for minor variations in the forward voltage of individual LEDs (Vf bin spread).
• Avoid Direct Parallel Connection: Connecting multiple LEDs directly in parallel without individual current limiting (Circuit Model B in the datasheet) is not recommended. Small differences in forward voltage characteristics can cause significant current imbalance, leading to uneven brightness and potential overstress of the LED with the lowest Vf.
• Recommended Circuit (Model A): Use a voltage source (Vcc), a current-setting resistor (R = (Vcc - Vf_LED) / I_LED), and the LED in series. Repeat this circuit for each LED branch in parallel.

7.2 Electrostatic Discharge (ESD) Protection

The LED is sensitive to electrostatic discharge. Precautions must be taken during handling and assembly:

• Operators must wear grounded wrist straps or anti-static gloves.
• All workstations, equipment, and storage facilities must be properly grounded.
• Use ionizers to neutralize static charge that may accumulate on the plastic lens.
• Follow standard ESD control procedures per ANSI/ESD S20.20.

7.3 Thermal Management

Although power dissipation is low, proper PCB design enhances longevity:

• Use adequate copper area on the PCB connected to the LED's thermal pads (cathode and anode) to act as a heat sink.
• Ensure the LED is not placed near other significant heat sources.
• Adhere strictly to the current derating curve in high-temperature applications.

8. Typical Application Scenarios

This orange LED is suitable for a wide range of applications requiring a compact, bright, and reliable indicator or light source, including but not limited to:

• Status Indicators: Power-on, standby, charging, and fault indicators in consumer electronics, appliances, and industrial control panels.
• Backlighting: Edge-lighting for small LCD displays, keypad illumination, and decorative lighting in compact devices.
• Automotive Interior Lighting: Dashboard indicators, switch illumination, and ambient lighting (subject to qualification for specific automotive standards).
• Signage & Decoration: Point light sources in decorative arrays and simple signage.
• Sensor Systems: As a light source in opto-sensors and interruption detectors.

9. Frequently Asked Questions (FAQ)

9.1 Can I drive this LED directly from a 3.3V or 5V logic output?

No, not directly. You must always use a series current-limiting resistor. For example, to drive at 20mA from a 5V supply with a typical Vf of 2.5V: R = (5V - 2.5V) / 0.020A = 125 Ohms. A 120 Ohm or 130 Ohm resistor would be appropriate. Without the resistor, excessive current will flow, potentially destroying the LED.

9.2 Why is there a binning system for voltage and intensity?

Manufacturing processes cause natural variations in semiconductor characteristics. Binning sorts LEDs into groups with closely matched performance. For applications where multiple LEDs need to appear equally bright (e.g., an array), specifying the same intensity bin (e.g., V1) is crucial. Similarly, using LEDs from the same voltage bin can simplify current-setting resistor calculations in parallel circuits.

9.3 What is the difference between Peak Wavelength and Dominant Wavelength?

Peak Wavelength (λP) is the physical wavelength where the LED emits the most optical power. Dominant Wavelength (λd) is a calculated value based on human color perception (CIE chart); it's the single wavelength that best matches the color we actually see. For monochromatic LEDs like this orange one, they are often close but not identical.

9.4 How critical is the 168-hour floor life after opening the moisture barrier bag?

Very critical for MSL 3 components. Exposure beyond this time allows moisture to absorb into the plastic package. During reflow soldering, this moisture can rapidly expand into steam, causing internal delamination, cracking ("popcorning"), or wire bond failure. If the time is exceeded, baking is mandatory to drive out the moisture.

10. Technology Introduction and Trends

10.1 AlInGaP Technology

This LED is based on Aluminum Indium Gallium Phosphide (AlInGaP) semiconductor material grown on a transparent substrate. This technology is particularly efficient in the red, orange, amber, and yellow wavelength regions, offering higher brightness and better temperature stability compared to older technologies like Gallium Arsenide Phosphide (GaAsP). The use of a transparent substrate allows more light to escape the chip, enhancing external quantum efficiency.

10.2 Industry Trends

The general trend in SMD LEDs is toward:

• Increased Efficiency: More lumens or millicandelas per watt, reducing power consumption and thermal load.
• Miniaturization: Smaller package sizes (e.g., 0402, 0201) for high-density PCB designs while maintaining or improving light output.
• Higher Reliability: Improved materials and packaging techniques to extend operational lifetime, especially under high-temperature and high-humidity conditions.
• Tighter Binning: More precise sorting to provide designers with components that have extremely consistent color and brightness, essential for applications like full-color displays and automotive lighting.
• Integration: Growth of LED modules that incorporate driver ICs, protection components, and optics into a single package, simplifying end-product design.