Orange SMD LED RF-OUB190TS-CF Datasheet - Size 1.6x0.8x0.7mm - Voltage 1.8-2.4V - Power 72mW - English Technical Document

1. Product Overview

This document provides the complete technical specification for a surface-mount Orange LED. The device is designed for general-purpose indicator applications, offering a wide viewing angle and compatibility with standard SMT assembly processes. It is a compact, RoHS-compliant component suitable for modern electronic designs.

1.1 Product Description

The LED is a color light-emitting diode fabricated using an orange semiconductor chip. It is housed in a miniature surface-mount package with dimensions of 1.6mm (L) x 0.8mm (W) x 0.7mm (H). This small form factor makes it ideal for space-constrained applications such as mobile devices, control panels, and backlighting for symbols.

1.2 Core Features and Advantages

• Extremely Wide Viewing Angle: The device features a typical viewing angle (2θ1/2) of 140 degrees, ensuring high visibility from various positions.
• SMT Compatibility: Fully suitable for all standard Surface Mount Technology assembly and solder reflow processes.
• Moisture Sensitivity: Rated at Moisture Sensitivity Level (MSL) 3, which defines specific handling and baking requirements before soldering.
• Environmental Compliance: The product is compliant with the RoHS (Restriction of Hazardous Substances) directive.

1.3 Target Applications

This LED is versatile and can be used in numerous applications, including but not limited to:

• Status and power indicators in consumer electronics and industrial equipment.
• Backlighting for switches, buttons, and symbolic displays on control panels.
• General-purpose illumination where a compact orange light source is required.

2. In-Depth Technical Parameter Analysis

The following sections provide a detailed breakdown of the LED's performance characteristics under specified test conditions (Ts=25°C).

2.1 Electrical and Optical Characteristics

The key performance metrics are defined in the table below. All measurements are taken at a forward current (IF) of 20mA unless otherwise stated.

• Forward Voltage (V_F): The voltage drop across the LED when operating. It is binned into three categories: B0 (1.8-2.0V), C0 (2.0-2.2V), and D0 (2.2-2.4V). This allows designers to select LEDs with consistent voltage characteristics for their circuits.
• Dominant Wavelength (λ_D): Defines the perceived color of the light. It is binned into E00 (620-625nm) and F00 (625-630nm), corresponding to specific shades of orange.
• Luminous Intensity (I_V): The amount of visible light emitted, measured in millicandelas (mcd). It is available in multiple bins: G20 (120-150 mcd), 1AW (150-200 mcd), 1AT (200-260 mcd), and 1AU (260-330 mcd). This grading system enables selection based on brightness requirements.
• Spectral Half Bandwidth (Δλ): Typically 15nm, indicating the spectral purity of the orange light.
• Viewing Angle (2θ_1/2): 140 degrees, confirming the wide-angle emission.
• Reverse Current (I_R): Maximum leakage current is 10 μA at a reverse voltage (V_R) of 5V.
• Thermal Resistance (R_THJ-S): Junction-to-solder point thermal resistance is 450 °C/W, which is critical for thermal management calculations.

2.2 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage may occur. Operation under or at these limits is not guaranteed.

• Power Dissipation (P_d): 72 mW
• Continuous Forward Current (I_F): 30 mA
• Peak Forward Current (I_FP): 60 mA (under pulsed conditions: 0.1ms pulse width, 1/10 duty cycle)
• Electrostatic Discharge (ESD) Withstand: 2000V (Human Body Model)
• Operating Temperature (T_opr): -40°C to +85°C
• Storage Temperature (T_stg): -40°C to +85°C
• Maximum Junction Temperature (T_j): 95°C

Critical Design Note: The maximum allowable continuous current must be determined based on the actual thermal conditions of the application (PCB layout, ambient temperature) to ensure the junction temperature does not exceed 95°C.

3. Performance Curve Analysis

The provided graphs offer valuable insights into the LED's behavior under varying conditions.

3.1 IV Curve and Relative Intensity

The Forward Voltage vs. Forward Current curve shows the typical exponential relationship. The Relative Intensity vs. Forward Current curve demonstrates how light output increases with current, typically in a near-linear fashion within the recommended operating range, before potential saturation or efficiency drop at very high currents.

3.2 Temperature Dependence

The Pin Temperature vs. Relative Intensity and Pin Temperature vs. Forward Current graphs are crucial for thermal design. They illustrate how light output decreases as the LED's pin (a proxy for junction) temperature rises. Similarly, the forward voltage has a negative temperature coefficient, meaning it decreases slightly with increasing temperature.

3.3 Spectral Characteristics

The Dominant Wavelength vs. Forward Current curve shows minimal shift with current, indicating good color stability. The Relative Intensity vs. Wavelength graph depicts the spectral power distribution, centered around the dominant wavelength (e.g., 625nm) with the specified 15nm half-bandwidth.

3.4 Radiation Pattern

The radiation pattern diagram (Fig 1-12) visually confirms the wide, lambertian-like emission pattern with a 140-degree viewing angle, showing relative intensity as a function of angle from the central axis.

4. Mechanical and Package Information

4.1 Package Dimensions and Tolerances

The LED has a rectangular footprint of 1.6mm x 0.8mm. The overall height is 0.7mm. All dimension tolerances are ±0.2mm unless specifically noted otherwise on the drawing. Detailed top, bottom, and side views define the exact geometry.

4.2 Polarity Identification and Pad Design

The cathode (negative) terminal is identified by a marked corner or a green indicator on the bottom view of the package. A recommended solder pad layout is provided to ensure reliable soldering and proper alignment during pick-and-place assembly. The pad design considers solder fillet formation and thermal relief.

5. Soldering and Assembly Guidelines

5.1 SMT Reflow Soldering Instructions

The LED is designed for standard infrared or convection reflow soldering processes. Due to its MSL Level 3 rating, the components must be used within 168 hours (7 days) of opening the moisture barrier bag under factory floor conditions (≤30°C/60%RH). If exceeded, baking is required as per the IPC/JEDEC standard before soldering to prevent \"popcorning\" damage. The specific reflow profile (preheat, soak, reflow peak temperature, cooling rate) should follow the recommendations for similar small SMD components, typically with a peak package body temperature not exceeding 260°C.

5.2 Handling and Storage Precautions

• Always handle LEDs with ESD (Electrostatic Discharge) precautions.
• Avoid mechanical stress on the lens or leads.
• Store in the original moisture-resistant packing in a cool, dry environment within the specified storage temperature range (-40°C to +85°C).
• Do not expose the LED to solvents or chemicals that may damage the epoxy lens.
• During soldering, ensure the soldering iron tip temperature is controlled and contact time is minimized to prevent thermal damage.

6. Packaging and Ordering Information

6.1 Standard Packaging Specification

The LEDs are supplied in industry-standard embossed carrier tape for automated handling. The tape dimensions are specified to ensure compatibility with standard pick-and-place equipment feeders. The components are wound onto reels, with each reel containing 4000 pieces. Reel dimensions (diameter, width, hub size) are provided for machine setup and inventory planning.

6.2 Moisture-Resistant Packing and Labeling

The reels are packaged in sealed moisture barrier bags along with desiccant and a humidity indicator card to maintain the MSL rating during shipment and storage. The bag and the reel label contain critical information such as part number, quantity, lot number, and date code.

7. Application Suggestions and Design Considerations

7.1 Typical Application Circuits

In most applications, the LED is driven by a constant current source or through a current-limiting resistor connected in series with a voltage supply. The resistor value (R) can be calculated using Ohm's Law: R = (V_supply - V_F) / I_F. For example, with a 5V supply, an LED from the C0 bin (V_F ~2.1V), and a desired I_F of 20mA, the resistor would be approximately (5 - 2.1) / 0.02 = 145 Ohms. A standard 150 Ohm resistor would be suitable.

7.2 PCB Layout and Thermal Management

• Thermal Pads: Use the recommended solder pad pattern. Connecting the thermal pad (if applicable) or the cathode/anode pads to a larger copper area on the PCB helps dissipate heat, lowering the junction temperature and improving longevity and light output stability.
• Current Driving: For maximum reliability and stable light output, drive the LED with a constant current rather than a constant voltage. If using PWM (Pulse Width Modulation) for dimming, ensure the frequency is high enough (typically >100Hz) to avoid visible flicker.
• ESD Protection: In environments prone to electrostatic discharge, consider adding transient voltage suppression devices or series resistors on the LED lines for additional protection, even though the LED itself is rated for 2kV HBM.

8. Reliability and Quality Assurance

The product is subjected to a series of reliability tests to ensure performance under various environmental stresses. Standard test items likely include (as referenced in the document):

• High Temperature Storage Life Test.
• Low Temperature Storage Test.
• Temperature Cycling Test.
• Moisture Resistance Test.
• Solder Heat Resistance Test.
• Lead Integrity Test.

Specific test conditions and pass/fail criteria (e.g., allowable changes in forward voltage or luminous intensity) are defined to guarantee product robustness. The failure judgment standard typically specifies the maximum allowable parameter shift (e.g., ΔV_F < ±0.2V, ΔI_V < ±30%) after testing.

9. Technical Comparison and Differentiation

Compared to generic LEDs, this device offers a clear advantage through its comprehensive binning system for forward voltage, dominant wavelength, and luminous intensity. This allows for tighter color and brightness matching in applications requiring multiple LEDs, such as status bars or backlight arrays. The wide 140-degree viewing angle is superior to many standard LEDs which often have narrower beams, making it better for applications where off-axis visibility is important. The specified MSL level and detailed handling instructions provide clear guidance for high-yield manufacturing.

10. Frequently Asked Questions (FAQ)

Q1: What is the difference between the B0, C0, and D0 voltage bins?

A1: These bins categorize the LED's forward voltage drop at 20mA. B0 LEDs have the lowest voltage (1.8-2.0V), while D0 have the highest (2.2-2.4V). Choosing LEDs from the same bin ensures uniform brightness and current draw in parallel circuits or arrays powered by the same voltage.

Q2: Can I drive this LED at its maximum continuous current of 30mA?

A2: You can, but it is not recommended for optimal lifetime and stability unless necessary for brightness. Driving at the typical 20mA provides a better balance of light output, efficiency, and thermal load. If using 30mA, you must ensure excellent PCB thermal design to keep the junction temperature below 95°C.

Q3: My LED appears dimmer than expected. What could be the cause?

A3: First, verify the driving current is correct by checking the series resistor value or constant current source setting. Second, ensure the polarity is correct. Third, check for excessive heating; high junction temperature significantly reduces light output. Finally, confirm you have selected the appropriate luminous intensity bin (e.g., 1AU for highest brightness).

Q4: What does Moisture Sensitivity Level 3 mean for my production?

A4: MSL 3 means the components can be exposed to factory ambient conditions (≤30°C/60%RH) for up to 168 hours (7 days) after the moisture barrier bag is opened. If they are not soldered within this time, they must be baked in a dry oven according to the specified procedure (e.g., 125°C for 8 hours) to remove absorbed moisture before they can be safely reflow soldered.

11. Practical Application Example

Scenario: Designing a multi-LED status indicator panel for a network router.

The panel requires 10 orange LEDs to indicate link activity on different ports. Uniform color and brightness are critical for a professional appearance.

• Part Selection: Specify LEDs from the same Dominant Wavelength bin (e.g., F00: 625-630nm) and the same Luminous Intensity bin (e.g., 1AT: 200-260 mcd) to ensure visual consistency.
• Circuit Design: Use a 5V rail on the PCB. Calculate the series resistor for a 20mA drive current. Assuming an average V_F of 2.1V (C0 bin), R = (5V - 2.1V) / 0.02A = 145Ω. Use 150Ω, 1% tolerance resistors for each LED to minimize current variation.
• PCB Layout: Place the LEDs in a row. Connect the cathode pad of each LED to a dedicated ground pour on the top layer to aid heat dissipation. Route the 5V supply and individual control signals from the microcontroller.
• Manufacturing: Plan the SMT assembly so that the reel of LEDs is loaded onto the pick-and-place machine and used within the 168-hour MSL3 window after opening the bag.

12. Operating Principle

This is a semiconductor light-emitting diode. When a forward voltage exceeding its characteristic forward voltage (V_F) is applied, electrons and holes recombine in the active region of the orange-emitting chip (typically based on materials like AlGaInP). This recombination process releases energy in the form of photons (light) with a wavelength corresponding to the orange part of the visible spectrum (approximately 620-630nm). The epoxy lens encapsulates the chip, provides mechanical protection, and shapes the light output beam to achieve the wide 140-degree viewing angle.

13. Technology Trends

The general trend for SMD indicator LEDs like this one is towards even higher efficiency (more light output per mA of current), improved color consistency through tighter binning, and further miniaturization while maintaining or improving reliability. There is also a growing emphasis on broader operating temperature ranges for automotive and industrial applications. The packaging technology continues to evolve to provide better thermal management from the chip junction to the PCB, allowing for higher drive currents or improved lifetime at standard currents.