Table of Contents
- 1. Product Overview
- 1.1 Core Features and Advantages
- 2. Technical Parameters and Specifications
- 2.1 Device Selection and Absolute Maximum Ratings
- 2.2 Electro-Optical Characteristics
- 3. Binning System Explanation
- 3.1 Luminous Intensity Binning
- 3.2 Dominant Wavelength Binning
- 4. Performance Curve Analysis
- 4.1 Spectral and Angular Characteristics
- 4.2 Electrical and Thermal Behavior
- 5. Mechanical and Packaging Information
- 5.1 Package Dimensions
- 5.2 Moisture Resistant Packing and Labeling
- 6. Assembly, Handling, and Storage Guidelines
- 6.1 Lead Forming and Soldering
- 6.2 Storage Conditions
- 7. Application Notes and Design Considerations
- 7.1 Typical Application Scenarios
- 7.2 Design and Implementation Advice
- 8. Technical Comparison and Differentiation
- 9. Frequently Asked Questions (FAQ)
- 9.1 What is the purpose of the oval shape?
- 9.2 How do I interpret the luminous intensity bin codes (GA, GB, etc.)?
- 9.3 Can I drive this LED with a voltage source?
- 9.4 What is the difference between Peak Wavelength (522nm) and Dominant Wavelength (528nm typ.)?
- 10. Practical Use Case Example
- 11. Operational Principle
- 12. Industry Trends and Context
1. Product Overview
This document provides the complete technical specifications for the 3474BFGR/MS Oval LED Lamp. This component is a precision optical performance LED specifically engineered for applications requiring clear, defined illumination patterns, such as passenger information systems and commercial signage.
1.1 Core Features and Advantages
The primary advantages of this oval LED lamp stem from its unique design and performance characteristics:
- High Luminous Intensity Output: Delivers bright, consistent light output suitable for daylight-readable signs.
- Oval Shape with Defined Radiation Pattern: The oval lens creates a matched radiation pattern ideal for mixing with yellow, blue, or red colors in multi-color sign applications, ensuring uniform appearance.
- Wide and Asymmetric Viewing Angle: Features a 2θ1/2 viewing angle of 110° in the X-axis and 60° in the Y-axis, providing a broad horizontal coverage suitable for viewing from various angles while controlling vertical spread.
- Robust Environmental Compliance: The device is constructed with UV-resistant epoxy and complies with key environmental standards including RoHS, EU REACH, and is Halogen-free (Br <900 ppm, Cl <900 ppm, Br+Cl <1500 ppm).
- Application-Specific Design: Optimized for integration into color graphic signs, message boards, variable message signs (VMS), and commercial outdoor advertising displays.
2. Technical Parameters and Specifications
2.1 Device Selection and Absolute Maximum Ratings
The LED utilizes an InGaN (Indium Gallium Nitride) chip material to produce a Brilliant Green color, diffused through a green lens. Operating limits must not be exceeded to ensure reliability.
| Parameter | Symbol | Rating | Unit |
|---|---|---|---|
| Reverse Voltage | VR | 5 | V |
| Forward Current | IF | 20 | mA |
| Peak Forward Current (Duty 1/10 @1KHz) | IFP | 100 | mA |
| Power Dissipation | Pd | 100 | mW |
| Operating Temperature | Topr | -40 to +85 | °C |
| Storage Temperature | Tstg | -40 to +100 | °C |
| Soldering Temperature | Tsol | 260 (for 5 sec) | °C |
2.2 Electro-Optical Characteristics
All parameters are measured at an ambient temperature (Ta) of 25°C and a standard forward current (IF) of 20mA, unless otherwise specified.
| Parameter | Symbol | Min. | Typ. | Max. | Unit | Condition |
|---|---|---|---|---|---|---|
| Luminous Intensity | Iv | 2781 | 4635 | 5760 | mcd | IF=20mA |
| Viewing Angle (2θ1/2) | -- | -- | X:110, Y:60 | -- | deg | IF=20mA |
| Peak Wavelength | λp | -- | 522 | -- | nm | IF=20mA |
| Dominant Wavelength | λd | 520 | 528 | 535 | nm | IF=20mA |
| Forward Voltage | VF | 2.4 | -- | 3.6 | V | IF=20mA |
| Reverse Current | IR | -- | -- | 50 | μA | VR=5V |
3. Binning System Explanation
To ensure consistency in brightness and color for large-scale applications, the LEDs are sorted into bins based on luminous intensity and dominant wavelength.
3.1 Luminous Intensity Binning
LEDs are categorized into four bins (GA, GB, GC, GD) with a ±10% tolerance on the nominal luminous intensity value.
| Bin Code | Min. (mcd) | Max. (mcd) |
|---|---|---|
| GA | 2781 | 3335 |
| GB | 3335 | 4000 |
| GC | 4000 | 4800 |
| GD | 4800 | 5760 |
3.2 Dominant Wavelength Binning
Color consistency is controlled through five wavelength bins (G1 to G5) with a tight tolerance of ±1nm.
| Bin Code | Min. (nm) | Max. (nm) |
|---|---|---|
| G1 | 520 | 523 |
| G2 | 523 | 526 |
| G3 | 526 | 529 |
| G4 | 529 | 532 |
| G5 | 532 | 535 |
4. Performance Curve Analysis
The datasheet includes several key performance graphs that illustrate the LED's behavior under different conditions. These are critical for robust system design.
4.1 Spectral and Angular Characteristics
The Relative Intensity vs. Wavelength curve shows a typical peak around 522nm, confirming the brilliant green color output. The Directivity plot visually represents the asymmetric 110° x 60° viewing angle, crucial for understanding the spatial light distribution in the final application.
4.2 Electrical and Thermal Behavior
The Forward Current vs. Forward Voltage (I-V Curve) is essential for driver design, showing the typical exponential relationship. The Relative Intensity vs. Forward Current curve demonstrates how light output increases with current, important for brightness tuning. The Relative Intensity vs. Ambient Temperature and Forward Current vs. Ambient Temperature graphs highlight thermal performance. Light output decreases as temperature rises, a key consideration for thermal management in enclosed signs or high-ambient environments.
5. Mechanical and Packaging Information
5.1 Package Dimensions
The LED features a standard oval lamp package with two leads. Critical dimensional notes include: all unspecified dimensions are in millimeters with a standard tolerance of ±0.25mm, and the maximum protrusion of resin under the flange is 1.5mm. Designers must refer to the detailed dimensioned drawing in the original datasheet for precise PCB footprint and mechanical clearance planning.
5.2 Moisture Resistant Packing and Labeling
The components are supplied in moisture-resistant packing to prevent damage during storage and transit. They are housed on carrier tapes, which are then placed in inner and outer cartons. The packing specification is 2500 pieces per inner carton and 10 inner cartons per outside carton (25,000 pieces total). The reel label contains vital information for traceability and correct application, including Customer's Product Number (CPN), Product Number (P/N), Packing Quantity (QTY), and the specific Binning codes for Luminous Intensity (CAT), Dominant Wavelength (HUE), and Forward Voltage (REF).
6. Assembly, Handling, and Storage Guidelines
6.1 Lead Forming and Soldering
- Lead Forming: Must be performed before soldering. Bends should be made at least 3mm from the epoxy bulb base to avoid stress on the package. Cutting should be done at room temperature.
- PCB Mounting: PCB holes must align perfectly with LED leads. Misalignment causing stress on the leads can degrade the epoxy and LED performance.
- Soldering: The solder joint must be more than 3mm from the epoxy bulb. Wave or reflow soldering at 260°C should not exceed 5 seconds.
6.2 Storage Conditions
For long-term reliability, LEDs should be stored at ≤30°C and ≤70% Relative Humidity. The recommended storage life after shipment is 3 months. For storage beyond 3 months and up to one year, the components should be kept in a sealed container with a nitrogen atmosphere and moisture-absorbent material. Rapid temperature changes in humid environments must be avoided to prevent condensation.
7. Application Notes and Design Considerations
7.1 Typical Application Scenarios
This LED is expressly designed for passenger information signs, variable message signs (VMS) on highways, commercial outdoor advertising boards, and general message displays. Its oval beam pattern and high intensity make it ideal for these applications where readability from a distance and wide horizontal viewing angles are paramount.
7.2 Design and Implementation Advice
- Current Limiting: Always use a series current-limiting resistor or a constant-current driver to maintain the forward current at or below the rated 20mA. Exceeding this value reduces lifespan.
- Thermal Management: Although power dissipation is low, consider the operating environment. In enclosed signs or high ambient temperatures, ensure adequate ventilation to prevent excessive junction temperature rise, which reduces light output.
- Optical Integration: The asymmetric beam (110°x60°) is designed to mix with other colors. When designing multi-color pixel clusters, account for this pattern to achieve uniform color blending across the viewing area.
- Binning for Consistency: For large display projects, specifying tight bins (e.g., GD for highest brightness, G3 for specific green hue) is crucial to avoid visible brightness or color variations across the sign.
8. Technical Comparison and Differentiation
The primary differentiating factor of this LED is its oval lens geometry, which is not common in standard round LEDs. This shape provides a tailored radiation pattern that is inherently more suitable for rectangular pixels in signage, potentially reducing optical losses and improving efficiency compared to using a diffuser over a standard round LED. Its combination of high luminous intensity (up to 5760 mcd) and a specifically wide horizontal viewing angle targets a niche in the high-brightness display market, setting it apart from general-purpose indicator LEDs.
9. Frequently Asked Questions (FAQ)
9.1 What is the purpose of the oval shape?
The oval shape creates an asymmetric radiation pattern (110° wide, 60° tall) that naturally fits the rectangular format of most information signs and pixels, providing efficient, uniform illumination without wasted light.
9.2 How do I interpret the luminous intensity bin codes (GA, GB, etc.)?
These codes represent sorted groups based on measured brightness at 20mA. GA is the dimmest group (2781-3335 mcd), and GD is the brightest (4800-5760 mcd). Specifying a bin ensures consistency across a large installation.
9.3 Can I drive this LED with a voltage source?
No. LEDs are current-driven devices. Applying a voltage directly will cause current to rise uncontrollably (due to the diode's exponential I-V curve), likely destroying the LED. Always use a current-limiting mechanism.
9.4 What is the difference between Peak Wavelength (522nm) and Dominant Wavelength (528nm typ.)?
Peak Wavelength is the single wavelength where the spectral power is highest. Dominant Wavelength is the perceived color of the light, calculated from the entire spectrum. The human eye's sensitivity affects this value, making dominant wavelength more relevant for color specification.
10. Practical Use Case Example
Scenario: Designing a Highway Variable Message Sign (VMS)
An engineer is designing a full-color VMS panel. Each pixel comprises red, green, and blue sub-pixels. For the green sub-pixel, the 3474BFGR/MS is selected.
Implementation: The LEDs are arranged on a PCB in a matrix. A constant-current driver IC supplies 20mA to each LED string. The oval beam pattern of the green LED is aligned so its 110° wide axis corresponds to the horizontal direction of the highway, ensuring good visibility for drivers across multiple lanes. The 60° vertical axis contains the beam to avoid light pollution. To ensure color and brightness uniformity across the large sign, the procurement order specifies bins GC for luminous intensity and G3 for dominant wavelength. Proper heat sinking on the metal backplane of the sign maintains ambient temperature within limits, preserving LED output and longevity.
11. Operational Principle
This LED operates on the principle of electroluminescence in a semiconductor. When a forward voltage is applied across the InGaN (Indium Gallium Nitride) p-n junction, electrons and holes recombine, releasing energy in the form of photons. The specific composition of the InGaN alloy determines the bandgap energy, which in turn defines the wavelength of the emitted light—in this case, in the green spectrum (~522-535nm). The epoxy lens encapsulates the chip, provides mechanical protection, and is shaped (oval) to control the radiation pattern of the emitted light.
12. Industry Trends and Context
LEDs for signage and professional displays represent a specialized segment of the broader LED market. Trends include:
Increased Efficiency: Ongoing development aims for higher luminous efficacy (more light output per electrical watt), allowing for brighter displays or lower power consumption.
Enhanced Color Gamut: Improvements in phosphor and chip technology enable wider color gamuts for more vivid and accurate displays.
Miniaturization and Density: There is a constant drive towards smaller pixel pitches for higher-resolution displays, requiring LEDs with smaller footprints and precise optical control.
Intelligent Drivers: Integration of control electronics closer to the LED (e.g., COB - Chip-on-Board with integrated drivers) for smarter, addressable display modules. While this specific datasheet describes a discrete, through-hole component, the underlying performance requirements (intensity, viewing angle, color) remain fundamental to all signage LEDs, regardless of packaging evolution.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |