Table of Contents
- 1. Product Overview
- 2. Technical Parameter Analysis
- 2.1 Absolute Maximum Ratings
- 2.2 Electro-Optical Characteristics
- 3. Binning System Explanation
- 3.1 Luminous Intensity Binning
- 3.2 Dominant Wavelength Binning
- 3.3 Forward Voltage Binning
- 4. Performance Curve Analysis
- 4.1 Relative Intensity vs. Wavelength
- 4.2 Directivity Pattern
- 4.3 Forward Current vs. Forward Voltage (I-V Curve)
- 4.4 Relative Intensity vs. Forward Current
- 4.5 Thermal Characteristics
- 5. Mechanical and Package Information
- 5.1 Package Dimensions
- 5.2 Polarity Identification
- 6. Soldering and Assembly Guidelines
- 7. Packaging and Ordering Information
- 7.1 Moisture Resistant Packaging
- 7.2 Tape and Reel Specifications
- 7.3 Packing Quantities
- 7.4 Label Explanation and Part Numbering
- 8. Application Suggestions
- 8.1 Typical Application Scenarios
- 8.2 Design Considerations
- 9. Technical Comparison and Differentiation
- 10. Frequently Asked Questions (Based on Technical Parameters)
- 11. Design and Usage Case Study
- 12. Technical Principle Introduction
- 13. Technology Trends and Context
1. Product Overview
This document details the specifications for a high-performance, oval-shaped LED lamp. The primary design objective of this component is to serve as a reliable and efficient light source for passenger information systems and various signage applications. Its unique optical design and form factor are tailored to meet the specific demands of clear, visible displays in both indoor and outdoor environments.
The core advantages of this LED include its high luminous intensity output, which ensures excellent visibility even in well-lit conditions. The oval shape and precisely engineered radiation pattern provide a well-defined spatial light distribution, crucial for uniform illumination of sign panels. Furthermore, the component is built with longevity in mind, utilizing UV-resistant epoxy and adhering to major environmental and safety standards such as RoHS, EU REACH, and halogen-free requirements, making it suitable for global markets and sustainable design practices.
The target market encompasses manufacturers of transportation infrastructure equipment, commercial advertising systems, and public information displays. Its primary applications are in color graphic signs, message boards, and variable message signs (VMS) where consistent color mixing (particularly with yellow, blue, or green elements) and reliable performance are paramount.
2. Technical Parameter Analysis
2.1 Absolute Maximum Ratings
The device is designed to operate reliably within the following absolute maximum limits. Exceeding these ratings may cause permanent damage.
- Reverse Voltage (VR): 5 V. This defines the maximum voltage that can be applied in the reverse direction across the LED terminals.
- Forward Current (IF): 50 mA (Continuous). The maximum recommended continuous current for normal operation.
- Peak Forward Current (IFP): 160 mA. This is the maximum allowable pulsed current, typically specified under a duty cycle of 1/10 at 1 kHz. It is crucial for designs involving multiplexing or brief high-current pulses.
- Power Dissipation (Pd): 120 mW. The maximum power the package can dissipate without exceeding its thermal limits, calculated as the product of forward voltage and current.
- Operating Temperature (Topr): -40°C to +85°C. The ambient temperature range over which the device is guaranteed to function correctly.
- Storage Temperature (Tstg): -40°C to +100°C. The temperature range for safe storage when the device is not powered.
- Junction Temperature (Tj): 110°C. The maximum allowable temperature at the semiconductor junction inside the LED.
- Soldering Temperature (Tsol): 260°C for 5 seconds. This defines the reflow soldering profile tolerance, critical for PCB assembly processes.
2.2 Electro-Optical Characteristics
These parameters are measured under standard test conditions (Ta=25°C, IF=20mA) and define the core performance of the LED.
- Luminous Intensity (Iv): 1220 - 2040 mcd (millicandela). This indicates the amount of visible light emitted in a specific direction. The wide range is managed through a binning system (see Section 3).
- Viewing Angle (2θ1/2): 110° (X-axis) / 40° (Y-axis). This asymmetric oval beam pattern is a key feature. The 110° wide angle is ideal for horizontal viewing in signs, while the narrower 40° vertical angle helps concentrate light and improve efficiency for the viewer.
- Peak Wavelength (λp): 632 nm (Typical). The wavelength at which the spectral power distribution is maximum.
- Dominant Wavelength (λd): 619 - 628 nm. This defines the perceived color of the light, which is in the red spectrum. It is also subject to binning.
- Spectral Radiation Bandwidth (Δλ): 20 nm (Typical). The width of the emitted spectrum at half the maximum intensity (FWHM).
- Forward Voltage (VF): 1.8 - 2.4 V. The voltage drop across the LED when driven at the test current. This range is managed by binning and impacts driver circuit design.
- Reverse Current (IR): 10 μA (Max) at VR=5V. A measure of the diode's leakage in the off-state.
3. Binning System Explanation
To ensure consistent performance in mass production, LEDs are sorted into bins based on key parameters. This allows designers to select components that match their specific requirements for brightness and color.
3.1 Luminous Intensity Binning
Bins are defined with a ±10% tolerance on the nominal value.
- Bin H2: 1220 - 1440 mcd
- Bin J1: 1440 - 1720 mcd
- Bin J2: 1720 - 2040 mcd
Selection of a higher bin (e.g., J2) guarantees higher minimum brightness, which may be necessary for applications requiring maximum visibility or to compensate for optical losses in sign diffusers.
3.2 Dominant Wavelength Binning
Bins ensure color consistency with a tight tolerance of ±1 nm.
- Bin 1: 619 - 622 nm
- Bin 2: 622 - 625 nm
- Bin 3: 625 - 628 nm
For color-mixing applications (e.g., with yellow or green LEDs), selecting LEDs from the same or adjacent wavelength bins is critical to achieve the desired final color without noticeable variation between units.
3.3 Forward Voltage Binning
Bins have a tolerance of ±0.1V.
- Bin 1: 1.8 - 2.0 V
- Bin 2: 2.0 - 2.2 V
- Bin 3: 2.2 - 2.4 V
Using LEDs from the same voltage bin simplifies current-limiting resistor calculation in series or parallel arrays, ensuring more uniform current distribution and brightness.
4. Performance Curve Analysis
The provided characteristic curves offer insights into the LED's behavior under varying conditions.
4.1 Relative Intensity vs. Wavelength
This spectral distribution curve confirms the monochromatic red output centered around 632 nm with a typical bandwidth of 20 nm. The narrow spectrum is characteristic of AlGaInP material technology, providing saturated color purity ideal for signage.
4.2 Directivity Pattern
The polar radiation pattern visually represents the asymmetric 110° x 40° viewing angle. The pattern shows a well-defined oval shape, confirming the controlled spatial radiation claimed in the features. This pattern is engineered to match the typical aspect ratio of information display segments.
4.3 Forward Current vs. Forward Voltage (I-V Curve)
This curve shows the exponential relationship typical of a diode. The forward voltage increases with current. Designers use this to determine the operating point and to design appropriate driver circuits (constant current recommended for LEDs). The curve also helps in understanding the device's dynamic resistance.
4.4 Relative Intensity vs. Forward Current
This curve demonstrates the LED's light output (luminous intensity) as a function of drive current. It is generally linear over a range but will saturate at higher currents due to thermal and efficiency droop. Operating at or below the recommended 50mA ensures optimal efficiency and longevity.
4.5 Thermal Characteristics
The curves for Relative Intensity vs. Ambient Temperature and Forward Current vs. Ambient Temperature are critical for thermal management. They show that luminous intensity decreases as ambient temperature rises, a phenomenon common to all LEDs. Conversely, for a constant voltage drive, the forward current would typically increase with temperature due to the negative temperature coefficient of VF, highlighting the importance of constant current drivers for stable performance across temperature ranges.
5. Mechanical and Package Information
5.1 Package Dimensions
The LED is provided in a surface-mount device (SMD) package. Key dimensional notes include:
- All dimensions are in millimeters unless specified otherwise.
- A standard tolerance of ±0.25mm applies to most dimensions.
- The maximum allowable protrusion of resin under the component flange is 1.5mm, which is important for PCB clearance calculations.
- The datasheet illustrates two variants: one with a stopper feature and one without. The stopper likely aids in placement accuracy during assembly or provides a physical registration point.
The detailed drawing specifies lead spacing, body size, and overall height, which are essential for creating accurate PCB footprints and ensuring proper placement by pick-and-place machines.
5.2 Polarity Identification
While not explicitly detailed in the extracted text, standard LED packages typically use a visual marker such as a notch, a flat edge on the lens, or a differently shaped lead to denote the cathode. The PCB footprint design must align with this polarity marking to ensure correct orientation during soldering.
6. Soldering and Assembly Guidelines
Proper handling is crucial to maintain device integrity and performance.
- Lead Forming: If through-hole mounting is required after receipt, leads must be bent at a point at least 3mm from the base of the epoxy bulb. All forming must be done before soldering to avoid transferring stress to the semiconductor junction.
- Stress Avoidance: Avoid applying mechanical stress to the LED package or its leads during handling and placement. Misaligned PCB holes that force the leads into position can cause resin cracking or internal damage, leading to premature failure.
- Cutting Leads: Lead cutting should be performed at room temperature. Using hot cutting tools can damage the internal wire bonds.
- Reflow Soldering: The device can withstand a peak soldering temperature of 260°C for up to 5 seconds, which is compatible with standard lead-free (SnAgCu) reflow profiles. It is critical to follow the recommended profile to avoid thermal shock.
7. Packaging and Ordering Information
7.1 Moisture Resistant Packaging
The components are supplied in moisture-resistant packaging suitable for long-term storage and are compatible with standard SMD tape-and-reel automated assembly equipment.
7.2 Tape and Reel Specifications
Detailed dimensions for the carrier tape are provided, including:
- Component Pitch (F): 2.54 mm
- Tape Width (W3): 18.00 mm
- Reel Feed Hole Pitch (P): 12.70 mm
- Overall Taped Package Thickness (T): 1.42 mm Max
These dimensions are standardized to ensure compatibility with automated placement equipment.
7.3 Packing Quantities
- 2000 pieces per inner carton.
- 10 inner cartons per master (outside) carton, totaling 20,000 pieces per master carton.
7.4 Label Explanation and Part Numbering
The reel labels include critical information for traceability and correct application:
- CPN: Customer's Part Number
- P/N: Manufacturer's Product Number (e.g., 5484BN/R7DC-AHJB/XR/MS)
- CAT, HUE, REF: Codes indicating the specific Binning for Luminous Intensity, Dominant Wavelength, and Forward Voltage, respectively.
- LOT No: Manufacturing lot number for quality control traceability.
The part number structure allows for the selection of specific variants, such as with or without a stopper (e.g., /R/MS vs. /PR/MS).
8. Application Suggestions
8.1 Typical Application Scenarios
- Passenger Information Signs (PIS): In buses, trains, and airports for displaying routes, destinations, and messages.
- Variable Message Signs (VMS): On highways for traffic alerts, speed limits, and Amber/Silver alerts.
- Commercial Outdoor Advertising: In large-format digital billboards and signs.
- Message Boards: In stadiums, financial tickers, and industrial control panels.
8.2 Design Considerations
- Current Driving: Always use a constant current driver or a current-limiting resistor. The recommended operating current is 20mA for testing, but designs can be optimized up to the maximum of 50mA, considering heat dissipation.
- Thermal Management: Although power dissipation is relatively low (120mW max), effective PCB layout with adequate copper area for heat sinking is recommended, especially for high-density arrays or high ambient temperature environments. This helps maintain luminous output and lifespan.
- Optical Design: The asymmetric beam pattern (110°x40°) should be aligned with the display layout. For example, in a horizontal text display, orient the LED so its 110° axis is horizontal to maximize the viewing area.
- Color Mixing: When used with other colors (yellow, blue, green), ensure all LEDs are from tight wavelength bins to achieve consistent and predictable mixed colors (e.g., a specific shade of orange or white).
- ESD Protection: Implement standard ESD precautions during handling and assembly, as LEDs are sensitive to electrostatic discharge.
9. Technical Comparison and Differentiation
This oval LED differentiates itself from standard round LEDs through several key features:
- Beam Shape: The primary differentiator is the oval radiation pattern (110°x40°), which is inherently more efficient for illuminating rectangular sign segments compared to a standard round beam, reducing wasted light and potentially lowering power consumption for the same perceived brightness.
- Application-Specific Design: It is explicitly "designed for passenger information signs," meaning its optical performance, package size, and reliability targets are optimized for this demanding use case involving continuous operation, vibration, and wide temperature swings.
- Material: Based on AlGaInP chip technology, which is known for high efficiency in the red and amber color regions, offering good luminous efficacy and color stability over time compared to older technologies.
- Compliance: The combination of RoHS, REACH, and Halogen-free compliance in a single component simplifies the material declaration process for end-product manufacturers targeting global markets, particularly the EU.
10. Frequently Asked Questions (Based on Technical Parameters)
Q: What is the difference between Peak Wavelength (632nm) and Dominant Wavelength (619-628nm)?
A: Peak Wavelength is the physical peak of the light spectrum emitted. Dominant Wavelength is the single wavelength of monochromatic light that would evoke the same perceived color. For LEDs, the dominant wavelength is often more relevant for color specification. The binning is done on dominant wavelength.
Q: Can I drive this LED at its maximum forward current of 50mA continuously?
A: Yes, the 50mA rating is for continuous operation. However, operating at the maximum rating will generate more heat and may reduce the LED's lifespan compared to operating at a lower current like 20mA. The design should include adequate thermal management if running at max current.
Q: Why is the viewing angle asymmetric (110° x 40°)?
A: This is an intentional optical design. Information signs are typically wider than they are tall. The 110° wide angle ensures good horizontal visibility, while the 40° vertical angle concentrates the light, making the sign appear brighter from a distance and improving optical efficiency by directing light where the viewer is likely to be.
Q: How do I select the right bin for my application?
A: For applications requiring uniform appearance (like a large display), specify a single bin for luminous intensity (e.g., J1) and dominant wavelength (e.g., Bin 2). For cost-sensitive applications where slight variations are acceptable, a wider bin or mixed bins may be used. Consult the binning tables in Section 3.
Q: Is a constant current driver necessary?
A> While a simple resistor can be used with a stable voltage supply, a constant current driver is highly recommended for several reasons: it compensates for the negative temperature coefficient of VF (preventing thermal runaway), ensures consistent brightness across all units regardless of VF bin variation, and provides better performance over the operating temperature range.
11. Design and Usage Case Study
Scenario: Designing a Bus Destination Sign.
A manufacturer is designing a new LED-based destination sign for city buses. The sign must be clearly readable in bright daylight and at night, withstand vibrations from bus operation, and have a long service life to minimize maintenance.
Component Selection: This oval LED is an ideal candidate. Its high luminous intensity (up to 2040mcd) ensures daylight visibility. The wide 110° horizontal viewing angle allows passengers to read the sign from various angles at bus stops. The rugged SMD package and UV-resistant epoxy suit the outdoor, high-vibration environment.
Implementation: LEDs would be arranged in a dot-matrix or segmented format. The designer would select LEDs from a single luminous intensity bin (e.g., J1) and a single dominant wavelength bin (e.g., Bin 2) to guarantee uniform brightness and color across the sign. A constant current driver IC would be used to power each row or column of LEDs, ensuring stable operation from the bus's fluctuating electrical system and across temperature extremes from summer heat to winter cold. The asymmetric beam would be oriented with the 110° axis horizontal to match the typical wide, short format of a destination sign.
12. Technical Principle Introduction
This LED is based on Aluminum Gallium Indium Phosphide (AlGaInP) semiconductor material. When a forward voltage is applied across the p-n junction, electrons and holes are injected into the active region where they recombine. In AlGaInP LEDs, this recombination process releases energy in the form of photons (light) with a wavelength in the red to amber part of the visible spectrum. The specific wavelength (dominant wavelength) is determined by the precise bandgap energy of the AlGaInP alloy, which is controlled during the crystal growth process. The oval beam shape is achieved through the specific geometry of the LED chip (if rectangular) combined with the lensing effect of the molded epoxy dome, which is shaped to refract light more in one axis than the other.
13. Technology Trends and Context
While this datasheet represents a mature and reliable product, the broader LED industry trends provide context. There is a continuous drive towards higher luminous efficacy (more lumens per watt), which reduces energy consumption and heat generation. For signage applications, trends include the integration of smart drivers with diagnostics, the use of chip-scale package (CSP) LEDs for higher density displays, and a focus on improved color rendering and consistency for full-color RGB displays. Furthermore, the emphasis on environmental compliance (RoHS, REACH, Halogen-free) has become a baseline requirement rather than a differentiator, pushing all manufacturers to adopt cleaner materials and processes. This component sits firmly in the category of application-optimized, reliable workhorse LEDs for professional signage, where longevity and consistent performance under specific conditions are valued over raw peak performance metrics.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |