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Photointerrupter LTH-1650-01 Datasheet - Focal Distance 3mm - Infrared Cut-off Type - English Technical Document

Complete technical datasheet for the LTH-1650-01 photointerrupter, featuring 3mm focal distance, infrared cut-off type, detailed electrical/optical characteristics, and application guidelines.
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PDF Document Cover - Photointerrupter LTH-1650-01 Datasheet - Focal Distance 3mm - Infrared Cut-off Type - English Technical Document

1. Product Overview

The LTH-1650-01 is a compact, transmissive-type photointerrupter module. Its core function is to detect the interruption of an infrared light beam between its integrated infrared light-emitting diode (LED) and a silicon phototransistor. The primary design advantage is its integrated 3mm focal distance, which optimizes sensitivity for object detection at that specific gap. As an infrared cut-off type device, it is designed to minimize interference from ambient visible light, enhancing reliability in various sensing applications. The target market primarily includes office automation equipment, industrial control systems, and consumer electronics requiring non-contact position or object detection.

2. In-Depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

These parameters define the stress limits beyond which permanent damage to the device may occur. They are not intended for normal operation.

2.2 Electrical & Optical Characteristics

These parameters are specified at an ambient temperature (TA) of 25°C and define the device's performance under normal operating conditions.

3. Binning System Explanation

The device features a performance binning system based on the On-State Collector Current (IC(ON)), which is measured under standardized conditions (VCE=5V, IF=20mA, gap d=3.0mm). This current directly correlates with the sensitivity of the coupler.

This binning allows designers to select a device with consistent sensitivity for their application, ensuring reliable triggering thresholds across production batches.

4. Performance Curve Analysis

The datasheet references typical characteristic curves which provide graphical insight into device behavior under varying conditions. While specific graphs are not detailed in the text, standard curves for such a device would typically include:

5. Mechanical & Package Information

The package is a standard through-hole type. Key dimensional notes from the datasheet include:

6. Soldering & Assembly Guidelines

Proper handling is required to maintain device integrity.

7. Application Recommendations

7.1 Typical Application Scenarios

As indicated in the datasheet, primary applications include:

7.2 Design Considerations

8. Technical Comparison & Differentiation

Compared to basic phototransistors or photodiodes, this integrated photointerrupter offers key advantages:

9. Frequently Asked Questions (FAQs)

Q: What is the purpose of the different bins (A, B, C)?
A: Bins categorize devices by their sensitivity (IC(ON)). Choose a higher bin (B or C) for applications requiring detection of lower-contrast objects, longer life (as LED output degrades over time), or operation with higher dust levels. Bin A is sufficient for standard applications.

Q: Can I drive the LED with a voltage source directly?
A: No. An LED is a current-driven device. You must use a series current-limiting resistor to set the forward current (IF) to a safe and consistent value, as shown in all application circuits.

Q: How do I interface the output with a microcontroller?
A: The phototransistor acts as a switch. Connect its emitter to ground, its collector to a digital input pin via a pull-up resistor (e.g., 10kΩ). When the beam is uninterrupted, the transistor is on, pulling the pin low. When interrupted, the transistor is off, and the pull-up resistor pulls the pin high. Ensure the microcontroller's input logic levels are compatible with the output voltage swing (near 0V for "on", near VCC for "off").

Q: What affects the response time?
A> The intrinsic speed of the phototransistor, the value of the load resistor (RL), and the capacitance of the circuit traces. For faster switching, use a smaller RL as allowed by the desired output current and voltage levels.

10. Practical Use Case Example

Scenario: Paper-Out Sensor in a Desktop Printer.
The photointerrupter is mounted on the printer frame so that the paper stack in the tray sits within the 3mm optical gap, blocking the infrared beam. A lever or flag attached to the paper tray follower may be used. When paper is present, the beam is blocked, the phototransistor is off, and its output is high. When the last sheet of paper is fed, the follower moves, unblocking the beam. The phototransistor turns on, pulling the output low. This logic transition is detected by the printer's main controller, which then activates the "Paper Out" warning on the user interface. The infrared cut-off filter prevents false triggers from the printer's internal lighting or room lights.

11. Operating Principle

The device operates on the principle of modulated optical coupling. An internal infrared LED emits light when forward-biased with an appropriate current. Directly opposite, within the same package, is a silicon NPN phototransistor. The phototransistor's base region is exposed to light. When infrared photons from the LED strike the base-collector junction, they generate electron-hole pairs. This photogenerated current acts as base current, causing the transistor to conduct a much larger collector current (IC), proportional to the light intensity. An object passing through the 3mm slot between them interrupts this light beam, causing the phototransistor to turn off. This provides a clean, electrically isolated switching signal based on a physical event.

12. Technology Trends

Photointerrupters remain fundamental components in position sensing. Current trends in the field include:

The core principle of optical interruption remains robust due to its non-contact nature, reliability, and simplicity, ensuring its continued relevance in mechatronic system design.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.