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LTH-306-09S Photointerrupter Datasheet - Mechanical Switch Replacement - English Technical Document

Complete technical datasheet for the LTH-306-09S photointerrupter, featuring electrical characteristics, optical parameters, absolute maximum ratings, and application notes.
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PDF Document Cover - LTH-306-09S Photointerrupter Datasheet - Mechanical Switch Replacement - English Technical Document

1. Product Overview

The LTH-306-09S is a photointerrupter, a type of optoelectronic device designed to detect the interruption of a light beam. It serves as a direct, solid-state replacement for traditional mechanical switches in various sensing applications. The core advantage lies in its non-contact operation, which eliminates issues related to mechanical wear, contact bounce, and physical degradation over time. This makes it highly reliable for applications requiring frequent actuation or operation in environments where dust, moisture, or vibration could compromise mechanical contacts. The device is suitable for a broad market, including industrial automation (position sensing, limit switches), consumer electronics (printer paper detection, disk tray sensing), and safety systems (door interlock detection).

2. In-Depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

2.2 Electrical & Optical Characteristics

These parameters are specified at an ambient temperature (TA) of 25°C and define the device's typical performance.

3. Performance Curve Analysis

The datasheet references typical electrical/optical characteristic curves. While the specific graphs are not provided in the text, their standard purpose is analyzed below.

4. Mechanical & Package Information

The datasheet includes a package dimensions drawing (not reproduced here). Key mechanical considerations include:

5. Soldering & Assembly Guidelines

Proper handling is crucial for reliability.

6. Application Suggestions & Design Considerations

6.1 Typical Application Circuits

The most common configuration is a digital switch. The LED is driven with a constant current (e.g., 20mA via a series resistor). The phototransistor collector is connected to a pull-up resistor (Rpull-up) to the logic supply voltage (e.g., 5V), and the emitter is grounded. The output signal is taken from the collector node.

The value of Rpull-up is a trade-off: a lower value provides faster rise times and better noise immunity but draws more current when the output is low. It should be chosen based on the required switching speed and the input characteristics of the following logic stage.

6.2 Design Considerations

7. Technical Comparison & Advantages

Compared to mechanical micro-switches, the LTH-306-09S photointerrupter offers several key advantages:

The trade-off is the need for supporting electronics (a current source for the LED and a pull-up resistor) and potential sensitivity to extreme ambient light or contamination of the optical path.

8. Frequently Asked Questions (Based on Technical Parameters)

9. Practical Application Examples

10. Operating Principle

A photointerrupter is an optocoupler with a physical gap between its emitter and detector. It consists of an infrared Light Emitting Diode (LED) on one side and a silicon Phototransistor on the opposite side, aligned across an open slot. When an electrical current is applied to the LED, it emits infrared light. This light travels across the gap and strikes the base region of the phototransistor. The photons generate electron-hole pairs in the base, effectively acting as a base current. This photogenerated current is then amplified by the transistor's gain, allowing a much larger collector current to flow. When an opaque object enters the slot, it blocks the light path. The photogenerated base current ceases, turning off the phototransistor and stopping the collector current. Thus, the presence or absence of an object in the slot digitally controls the conductivity of the output phototransistor.

11. Technology Trends

The fundamental technology of photointerrupters is mature. Current trends focus on integration and miniaturization. Devices are becoming smaller in package size (SMD types) while maintaining or improving performance. There is also a trend towards integrating additional circuitry on-chip, such as Schmitt triggers for hysteresis (to provide clean digital switching without external components), amplifiers for analog output, or even full digital interfaces (I2C). This reduces external component count and simplifies design. Furthermore, devices with higher sensitivity allow for operation with lower LED currents, reducing overall system power consumption, which is critical for battery-powered applications. The development of materials for the optical path (lenses, filters) also continues to improve ambient light rejection and sensing accuracy.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.